Authors: Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D. Company: DfR Solutions Date Published: 1/31/2010
Abstract: This paper will discuss the shortcomings of current LF alloys (namely SAC305) and present recent data for various new alloys which show promise as replacement materials. These newer alloys offer important reliability improvements but do have some issue that need resolution before mass implementation. Shock and vibration data will be provided, as well as thermal cycle data. The primary focus will be on SnCuNi and SAC105X alloys and how they can be used effectively in the Pb-free electronics industry going forward.