Journal of SMT Article
iNEMI Pb-FREE ALLOY ALTERNATIVES PROJECT REPORT: STATE OF THE INDUSTRY
Company: Hewlett-Packard Co., Cookson Electronics, Nihon Su
Date Published: 10/30/2008 Volume: 21-4
The increasing number of Pb-free alloys provides opportunities to address the important issues described above. At the same time, the increase in choice of alloys presents challenges in managing the supply chain and introduces a variety of risks, particularly to the reliability of PCAs.
This paper provides the results of an iNEMI study of the present state of industry knowledge on Sn-Ag-Cu alloy “alternatives,” including an assessment of existing knowledge and critical gaps. Focus areas are recommended for closing these gaps, with the additional goal of avoiding repeated investigations into issues already resolved. Finally, efforts to update industry standards to account for the new alloys and to better manage supply chain complexity and risk are described.
Key words: Lead-free alloys, alternative alloys, low silver alloys, microalloying, reliability
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