Journal of SMT Article
AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS
Company: Technology Development Center, Sanmina-SCI Corpora
Date Published: 10/1/2007 Volume: 20-4
The converted parts were examined using x-ray fluorescence (XRF) technique to test for RoHS compliance for the metallic species. Electrical and die visual inspection utilizing optical microscopy, direct current (DC) pin-to-pin electrical testing and acid de-encapsulation were performed to inspect for damage on die, after the conversion process. There were no opens or short circuits found during the electrical test. The die was undamaged after the conversion process.
As the final evaluation method of the robotic conversion process, the converted parts were assembled on a printed circuit board (PCB) using both tin-lead and lead-free processes. Three PCB surface finishes namely immersion silver (Im-Ag), organic solderability preservative (OSP), and electroless nickel/immersion gold (ENIG) were used. The microstructures of the converted components were typical in appearance and had well defined intermetallic compound (IMC) both along the bulk solder/PCB and bulk solder/component interfaces. Further, lead pull testing was performed on ‘as-assembled condition’ (AA) and ‘after thermal aging’ (ATA) components to determine the mechanical integrity of converted component termination finishes with respect to the original termination finish. The results indicate that the converted components have similar pull strength as that of the original components.
Key words: Robotic Termination finish Conversion process, leadfree microstructure, XRF
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