Journal of SMT Article


Authors: Chrys Shea, Sanju Arora, Steve Brown, and Steven W
Company: ALPHA – A Cookson Electronics Company
Date Published: 7/1/2007   Volume: 20-3

Abstract: The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases, the fluxes used in tin-lead soldering work well in lead-free assembly. In other cases, however, the complexity of the assemblies dictate more active, heat-sustainable products formulated specifically for lead-free applications.

The major considerations when selecting a flux should be the performance requirements of the end product, relative complexity of the assembly, and acceptability of residues or other cosmetic concerns.

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing.

Key Words: Lead-Free, Wave Soldering, Flux

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