Journal of SMT Article
WORLD WIDE DEPLOYMENT OF CSP ASSEMBLY PROCESS CSP STRESS/STRAIN ENERGY DISTRIBUTION MODELING AND FATIGUE RESISTANCE STUDY
Company: Solectron Corporation
Date Published: 7/1/2000 Volume: 13-3
This paper will describe the methodology used for the deployment of the CSP assembly process. A test vehicle optimized by incorporating all the findings from the studies on pad geometry, solder volume, and surface finish was designed to assess the reliability of CSP after SMT assembly and rework processes. A series of analyses was performed on the test vehicle including the use of the Mechanical Deflection System designed by IBM to study the reliability of solder joints. Correlation between fatigue resistance, crack pattern, and their impact on the reliability of solder joint were also established.
Stress and displacement under external thermal and mechanical fields were simulated. Finite Element Method was used to analyze the Von Mises stress and strain energy distributions. The impact of package standoff, die size, and DNP on the fatigue resistance and reliability of solder will be discussed.
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