Journal of SMT Article
EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY
Company: Rochester Institute of Tech.
Date Published: 10/1/2005 Volume: 18-4
Since current electronic components can withstand a maximum temperature only in the range 245-250°C, the process window for reflow soldering has narrowed. It is expected that even minor deviations outside of the window could have a dramatic effect on the process outcome and the component's ability to function properly.
In this research project, peak reflow temperature (Tpeak) and time above liquidus (TAL) were varied across the solder paste manufacturer recommended specifications (standard process window), in order to study the effect of process window deviation. Solder joint quality, shear strength, microstructure and intermetallic of the joints were used as metrics to determine the influence of deviating from the process window.
Interestingly, across the process window, as peak temperature and TAL varied, solder joint appearance varied from uncoalesced to shiny to dull solder joints. Significant solder wicking on the component leads was also observed. ANOVA analysis and t-test were performed in order to understand the influence of process window deviation on solder joint strength.
Key words: lead-free soldering, process window, peak temperature, time above liquidus, shear strength, microstructure, intermetallic.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.