Journal of SMT Article


Author: Olli Salmela et al.
Company: Nokia Group
Date Published: 4/1/2005   Volume: 18-2

Abstract: In this paper, an approach to interpret lead-free solder thermal cycling test results is discussed. First, the experiments are described. Second, failure analysis and statistical analysis are performed. The actual lifetime prediction is based on both utilization of analytical models and finite element (FE) simulations. Special attention is paid to re-calibration of the models in order to reflect the change of solder material.

As an end result, two new methods to enhance the lifetime prediction accuracy of Engelmaier's model are suggested. Based on the data from the literature, the prediction accuracy enhancement scheme is widened to cover also plastic packages in case of both SnPb and lead-free assemblies.

Key words: lead-free, solder, reliability.

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