Journal of SMT Article
RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS
Company: Nokia Group
Date Published: 4/1/2005 Volume: 18-2
As an end result, two new methods to enhance the lifetime prediction accuracy of Engelmaier's model are suggested. Based on the data from the literature, the prediction accuracy enhancement scheme is widened to cover also plastic packages in case of both SnPb and lead-free assemblies.
Key words: lead-free, solder, reliability.
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