Journal of SMT Article


Author: Alan Rae
Company: NanoDynamics, Inc.
Date Published: 4/1/2005   Volume: 18-2

Abstract: Lead-free assembly regulations dictate that we must move reflow temperatures as high as 260°C and rework temperatures even higher. Many existing components and systems can not cope. At the same time the use of smaller pitch devices that require careful alignment, or include low-temperature materials in their construction is increasing in the areas of MEMS, optoelectronics, flash memory and other semiconductor devices.

Nanotechnology allows us a number of tools which will allow lower temperature assembly through enhanced solders, adhesives and novel attachment methods.

Key words: nanotechnology, assembly.

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