Journal of SMT Article
SOLDER JOINT RELIABILITY OF THE BLP PACKAGE
Company: LG Semicon Company, Ltd.
Date Published: 1/1/1999 Volume: 12-1
This has resulted in a more reliable solder joint shape which was confirmed by the accelerated thermal cycling (ATC) test. The effects of coefficients of thermal expansion (CTEs) of substrates and of double-sided mounting on solder joint reliability of the BLP package were examined. Also, the effect of reflow times will be reported. Finally, as reliability enhancements, the BLP with copper lead frame and D2CSP will be introduced.
Key words: BLP, design optimization, solder joint reliability, ATC test, D2CSP.
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