Journal of SMT Articles

The Journal of Surface Mount Technology is a quarterly, peer-reviewed journal featuring jury-selected technical papers. An electronic version is delivered quarterly to all SMTA members. View the current Journal Committee.

All articles published since 1999 are listed below and are also searchable in the knowledge base.

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SMTA JOURNAL ARTICLES: 1999 - Present

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YEAR   VOL.   TITLE AUTHOR
2017 30-3 In-Situ Resistance Characterization During Cure Progression For Electrically Conductive Adhesives Geoff Rivers, Pearl Lee-Sullivan, Boxin Zhao, Alex Chen, John Persic and Robert Lyn Abstract
30-3 Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Electroless Pd Deposition Reaction Process and Electroless Pd Film Thickness Yoshinori Ejiri, Takehisa Sakurai, Akai Kunihiko, Yasushi Sugimoto, Yoshinori Arayama, Yoshiaki Tsubomatsu and Kiyoshi Hasegawa Abstract
30-3 Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis, Mitch Ferrill Abstract
30-2 A Nanocopper Based Alternative to High Temperature Solder S. Hamasha, A. Sharma, B. Schnabl, L. Cheng, L. Desir, K. Bretz, L. Wentlent, A. A. Zinn, J. Beddow, K. Schnabl, E. Hauptfleisch, D. Blass, and P. Borgesen Abstract
30-2 The Effects of Aging on the Microstructure and Mechanical Properties of Bi-Containing Sn-Rich Alloys André M. Delhaise, Doug Perovic, Polina Snugovsky Abstract
30-2 Isothermal Fatigue of High Temperature Solder Joints Harry Schoeller, Ph.D., and Gregory Parks Abstract
30-1 3D Wafer Level Packaging by Using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages L. Hofmann, I. Schubert, D. Wünsch, R. Ecke, K. Vogel, K. Gottfried, D. Reuter, M. Rennau, S.E. Schulz, T. Geßner Abstract
30-1 On the Corrosion Mechanisms of Common Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich Environments Matthew D. Weeks, Ph.D., David J. Zueck Abstract
30-1 Probabilistic Design for Reliability (PDFR) of Medical Electronic Devices (MEDs): When Reliability Is Imperative, Ability to Quantify It Is a Must E. Suhir and S. Yi Abstract
2016 29-3 Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package M. Neilsen and P. Vianco Abstract
29-3 Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract
29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K. Bhattacharya, Daniel F. Baldwin, and Qing Ji Abstract
29-2 Influence of Microalloying Elements on Reliability of SnAgCu Solder Joints Babak Arfaei, Francis Mutuku, Richard Coyle, Eric Cotts Abstract
29-2 Establishing a Ti-Cu-Pt-Au Thin Film – On – Low Temperature Co-Fired Ceramic (LTCC) Technology for High Temperature Electronics P. Vianco, J. Rejent, M. Grazier, A. Kilgo, B. McKenzie, A. Allen, E. Guerrero and W. Price Abstract
29-2 Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Arrangements Cong Zhao, Chaobo Shen, Zhou Hai, Munshi M. Basit, Jiawei Zhang, Michael. J. Bozack, John. L. Evans, and Jeffrey C. Suhling Abstract
29-1 Addressing Critical Assembly Challenges in 2.5D and 3D IC Assembly Guilian Gao, Ph.D. Scott McGrath, Bong-Sub Lee, Ph.D, Cyprian Uzoh, Ph.D., Grant Villavicencio, Hala Shaba, Liang Frank Wang, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract
29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and Abhijit Dasgupta Abstract
29-1 A Comparative Study of Copper Corrosion Products Formed at Two Hot Spring Sites Masamitsu Watanabe, Masaaki Takaya, Morihiko Matsumoto, Jun'ichi Sakai Abstract
2015 28-4 Effect of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue Performance of Lead-Free Solder Joints Babak Arfaei, Francis Mutuku, Eric Cotts Abstract
28-4 Finite Element Modeling of Dynamic Circuit Board Strain Response under High-G Shock Impact Sergey M. Kaplan, M.S., Robert B. Greendyke, Ph.D. Abstract
28-4 Assessment of the Effect Of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure Pradeep Lall, Ph.D., and Kazi Mirza Abstract
28-3 Non-destructive Evaluation of Solder Ball Quality under Mechanical Bending Using Laser Ultrasonic Technique Jie Gong, Charles Ume, Kola Akinade, Bryan Rogers, Cherif Guirguis, David Chan, Cesar Escobar Abstract
28-3 Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives Wei Zhang, Behnam Meschi Amoli, Jeffrey d’Eon, Boxin Zhao, and Alex Chen Abstract
28-3 Process and Material Envelope for Allowable Package-on-Package Warpage Pradeep Lall, Ph.D., Kewal Patel, and Vikalp Naray Abstract
28-2 Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing Dr. Stephan J. Meschter, Polina Snugovsky, Jeffery Kennedy, Zohreh Bagheri, and Eva Kosiba Abstract
28-2 Effect of Reflow Time on Wetting Behaviour, Interfacial Reaction and Shear Strength of Sn–0.3Ag-0.7Cu Solder/Cu Joint Mrunali Sona and K. Narayan Prabhu Abstract
28-2 Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder P. T. Vianco, J. A. Rejent, A. C. Kilgo, and S. E. Garrett Abstract
28-1 SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development Stephen A. McKeown, Dr. Stephan J. Meschter, Polina Snugovsky, and Jeffery Kennedy Abstract
28-1 Pb-Free Flux: A Chemical View of Reliability Phil Isaacs, Eddie Kobeda and Jing Zhang Abstract
28-1 PoP Rework - A Case Study Robert Wettermann Abstract
2014 27-4 The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design Gabriel Takyi, Ph.D. and Peter K. Bernasko, Ph.D. Abstract
27-4 Multi-Variable Multi-Objective Design Optimization of BEoL/ fBEoL Structure in a Flip Chip Package during Chip Attachment to Substrate Fahad Mirza, Hardik Parekh, Tejas Shetty, and Dereje Agonafer Abstract
27-4 Vibration Testing of Lead-Free Alloys for High Reliability Suthakaran Subramaniam, Polina Snugovsky, Jeffrey Kennedy, Eva Kosiba, Zohreh Bagheri, and Marianne Romansky Abstract
27-3 Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation Junghyun Cho, Stephan J. Meschter, Suraj Maganty, Dale Starkey, Mario Gomez, David G. Edwards, Abdullah Ekin, Kevin Elsken, Jason Keeping, Polina Snugovsky, Jeff Kennedy, and Marianne Romansky Abstract
27-3 Microstructure and Hardness of Bi-containing Solder Alloys After Solidification and Ageing André Delhaise, Leonid Snugovsky, Doug Perovic, Polina Snugovsky, and Eva Kosiba Abstract
27-3 Micro-Alloying Effects on Joint Microstructures in Sn-Ag-Cu Solder Joints for High Reliability in Thermal Cycling Dave Hillman and Iver Anderson, Ph.D. Abstract
27-2 Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J. Bozack and J. L. Evans Abstract
27-2 3-D Fracture Analysis of the BEoL Region of a Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh, Dereje Agonafer Abstract
27-2 Stencil and Solder Paste Inspection Evaluation for Miniaturized SMT Components Robert Farrell and Chrys Shea Abstract
27-1 High Strain Rate Properties of SAC105 and SAC305 Leadfree Alloys after Extended High Temperature Storage Pradeep Lall, Sandeep Shantaram, and David Locker Abstract
27-1 Strain Rate and Cyclic Dependencies of PCBA Pad Crater Susceptibility John McMahon, Brian Standing, Michael Thomson, Jim Wilcox, Derek Robertson, and Matt Kelly Abstract
27-1 Predicting the Reliability of Package-on-Package Interconnections Using Computational Modeling Software Paul T. Vianco, Ph.D., Michael K. Neilsen, Jerome A. Rejent, J. Mark Grazier, and Alice C. Kilgo Abstract
2013 26-4 Plasma Stencil Treatments: A Statistical Evaluation Matt Kelly, P.Eng., William Green, Marie Cole, Ruediger Kellmann Abstract
26-4 Gold Embrittlement in Leadfree Solder Craig Hillman, Ph.D., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract
26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe McGurran, and Dr. Kenneth Lee Abstract
26-3 Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 1 - AXI Capability for HoP Detection Alex Chan, Paul Brown, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Mulugeta Abtew, Iulia Muntele, and Michael Meilunas Abstract
26-3 Collaboration Between OEM and EMS to Combat Head on Pillowing Defects: Part 2 - Warpage Acceptance Proposal Alex Chan, Paul Brown, Richard Coyle, Lars Bruno, Anne-Kathrine Knoph, Thilo Sack, David Geiger, David Mendez, Ron Kulterman, Mulugeta Abtew, Iulia Muntele, and Kirk VanDreel Abstract
26-3 Corrosion Study of Lead-Free Solders Exposed to Artificial Sweat Laura Sloboda, Thomas Kennedy, Julie Liu, Deepchand Ramjattan, Nancy Wang and Laura J. Turbini Abstract
26-2 Solder Alloy Creep Constants for Use in Thermal Stress Analysis Robert Darveaux, Ph.D. and Corey Reichman Abstract
26-2 A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions Keith Sweatman, Tetsuro Nishimura, and Teruo Komatsu Abstract
26-2 Reliability of BiAgX Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications HongWen Zhang, Ph.D. and Ning-Cheng Lee, Ph.D. Abstract
26-1 SnAgCu Lead-Free Electronics Reliability Under Combined Temperature And Vibration Environments Pradeep Lall and Geeta Limaye Abstract
26-1 Ag-Au-Ge Alloys for High Temperature Geothermal and Oil Well Electronics Applications P. T. Vianco, R. Grant, J. A. Rejent, T. B. Crenshaw, and A.C. Kilgo Abstract
26-1 Alternatives to Solder in Interconnect, Packaging, and Assembly Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D. Abstract
2012 25-4 Should Intermetallic Thickness Measurements Be Needed To Determine Solder Joint Reliability Scott K Buttars, Chonglun Fan, and Raiyo F. Aspandiar Abstract
25-4 Bottom Termination Component Land Pattern Design and Assembly For High Reliability Electronic Systems Scott Nelson Abstract
25-4 Study of Sulfide Films Grown on Printed Circuit Boards Anil Kurella, Ph.D. and Balu Pathangey, Ph.D. Abstract
25-3 The Last Will and Testament of The Lead-Free BGA Void David Hillman, David Adams, Tim Pearson, Ross Wilcoxon, Bev Christian, Brandon Smith, and Mario Scalzo Abstract
25-3 Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints Jiawei Zhang, Zhou Hai, Sivasubramanian Thirugnanasambandam, John L. Evans, M. J. Bozack, Richard Sesek, Yifei Zhang, J. C. Suhling Abstract
25-3 New Generation Of Pb-Free Solder Alloys: Possible Solution To Solve Current Issues With Main Stream Pb-Free Soldering Polina Snugovsky, Simin Bagheri, Marianne Romansky, Doug Perovic, Leonid Snugovsky, John Rutter Abstract
25-2 Investigation of Factors that Influence Creep Corrosion on Printed Circuit Boards Haley Fu, Cherie Chen, Prabjit Singh, Jing Zhang, Anil Kurella, Xu Chen, Xiaodong Jiang, Jennifer Burlingame, and Simon Lee Abstract
25-2 PCB Dynamic Coplanarity at Lead-Free SMT Temperatures John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, and Ron Kulterman Abstract
25-2 Stress Analysis of Multilayered Printed Circuit Board under Mechanical Loading Jia-Shen Lan and Mei-Ling Wu Abstract
25-1 Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems Server PK Pu, Theron Lewis, Marie Cole, Mark Hoffmeyer, John Shaughnessy, Tom Finck, Mark Stevens, Kari Fischer, and Joe Doman Abstract
25-1 Analysis of Corrosion Films in Printed Circuit Board Assemblies Anil Kurella Ph.D., Balu Pathangey Ph.D., Zhiyong Wang Ph.D., and Tim Ciarkowski Abstract
25-1 The Influence of Alloy Composition and Temperature Cycling Dwell Time on the Reliability of a Quad Flat No Lead (QFN) Package Richard Coyle, Peter Read, Heather McCormick, Richard Popowich, and Debra Fleming Abstract
2011 24-4 Comparison Of Several PCB Final Finishes In A Mixed Flowing Gas Test Environment Robert Veale and James Trainor Abstract
24-4 Health Monitoring Of Leadfree Electronics Under Mechanical Shock And Vibration With Particle Filter Based Resistance Spectroscopy Pradeep Lall, Ryan Lowe, and Kai Goebel Abstract
24-4 Material Testing And Mitigation Techniques For Pad-Crater Defects Brian Gray, P. Eng., and John McMahon, P. Eng. Abstract
24-3 Laminate Resistance to Pad Crater Defects: Comparative Spherical Bend Testing John McMahon, P.Eng., and Brian Gray, P.Eng. Abstract
24-3 Tin Whisker Testing and Risk Modeling Project Stephan Meschter, Steve McKeown, Polina Snugovsky, Jeff Kennedy, and Eva Kosiba Abstract
24-3 Case Histories in Failure Analysis of Electronics Assemblies Vladimir Igoshev Abstract
24-2 Copper Wire Bonding on Pure Palladium Surface Finishes - Eliminating The Gold Cost from The Electronic Package Mustafa Özkök, Hugh Roberts, and Horst Clauberg Abstract
24-2 Development of a Packaging System for Clinical Evaluation of a Nanocomposite-Based Neural Electrode Array Fabricated from a Chemoresponsive Polymer Substrate Andrew Barnes, Allison Hess, Christian Zorman, and Mondhita Diewvilai Abstract
24-2 Pb-Free Thermal Cycle Acceleration Factors Phil Isaacs and Eddie Kobeda Abstract
24-1 Evaluation Of Defects In Lead-Free BGA Solder Joints Under Random Vibration Stress Anurag Bansal, Kuo-Chuan Liu, and Jie Xue Abstract
24-1 High Volume Manufacturing Solution For Wafer Level Lens Molding and Stacking Kien Mun Lau, Michael Kast, Gerald Kreindl, Markus Abstract
24-1 Pb-free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package Richard Coyle, Heather McCormick, John Osenbach, P Abstract
2010 23-4 An Investigation Into The Development Of Lead-Free Solder Paste For Package On Package (PoP) Component Manufacturing Applications Jasbir Bath, Manabu Itoh, Gordon Clark, Masatoshi Abstract
23-4 New Developments In High-Temperature, High-Performance Lead-Free Solder Alloys Anton-Zoran Miric Abstract
23-4 Effect Of PCB Surface Finishes On Lead-Free Solder Joint Reliability Xu Zheng, Hongfeng Ran, Lei Wang, Hao Kou, Yexiang Ning, Bei Wang, Xian Lin, and Zuyao Liu Abstract
23-3 Environmental Regulatory Roadmap: A Recent History And A Look Forward Jacklin Adams, George Galyon, Ph.D., and LH Chew PM Abstract
23-3 Lead-Free PTH Rework Process Challenges And Solutions For A Complex Server PCBA Willie Davis, PK Pu, Wang Yong Kang, Alex Chen, Daniel Tan, Wai Mun Lee Abstract
23-3 A Novel Test Methodology to Evaluate Solder Pastes for Mitigating Head-in-Pillow Defects Guhan Subbarayan Ph.D., Scott Priore, and Sundar Sethuraman Abstract
23-2 Assessment of Accrued Thermo-Mechanical Damage in Leadfree Parts During Field-Exposure to Multiple Environments Pradeep Lall, Ph.D., et al. Abstract
23-2 Mechanical Failures in Pb-Free Processing: Evaluating The Effect of Pad Crater Defects on Process Strain Limits for BGA Devices John McMahon and Brian Gray Abstract
23-2 Lead-Free Flux Technology and Influence on Cleaning Ning-Cheng Lee, Ph.D. Abstract
23-1 Reliability Study and AF Modeling for SnAgCu Solder Joints and SnPb Solder Joints in QFN Packages Dong Hyun Kim, Mudasir Ahmad, Sue Teng Abstract
23-1 Second Generation Pb-Free Alloys Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D. Abstract
23-1 Solder Joint Reliability Analysis and Testing of a Dual Row QFN Package Luke England, et al. Abstract
2009 22-4 Evaluation of Lead-free Solders, Halogen-free Laminates, and Nanomaterial Surface Finishes for Assembly of Printed Circuit Boards for High Reliability Applications Gregory Morose, et al. Abstract
22-4 ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, et al. Abstract
22-4 ACHIEVING HIGH RELIABILITY LOW COST LEAD-FREE SAC SOLDER JOINTS VIA MN OR CE DOPING Dr. Weiping Liu, et al. Abstract
22-3 REFLOW PROFILE EVALUATION FOR LEAD-FREE STACKED CSP COMPONENTS SUBJECTED TO MULTIPLE REFLOW CYCLES Satyanarayan Iyer and Krishnaswami Srihari Abstract
22-3 IMPACT OF TRACE AND VIA JOULE HEATING ON MULTILAYER STRUCTURES Mudasir Ahmad and David Popovich Abstract
22-3 DETECTING COUNTERFEIT and REWORKED ELECTRONIC COMPONENTS IN THE OPEN MARKETPLACE Art Ogg Abstract
22-2 Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies Lei Nie, Michael Osterman, and Michael Pecht Abstract
22-2 LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS Matthew Kelly, Marie Cole, Jim Wilcox, David Braun Abstract
22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Abstract
22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER MOTHERBOARDS TO LEAD-FREE R. Schueller, Ph.D., W. Ables, and J. Fitch, Ph.D. Abstract
22-1 INVESTIGATION OF IMC GROWTH IN TIN SURFACE FINISH AND ITS EFFECT ON SOLDERABILITY IN FC-CSP PACKAGING HyunJung Lee, YeonSeop Yu, HyoJung Kim, Hee-Soo Kim Abstract
22-1 COMPREHENSIVE METHODOLOGY TO CHARACTERIZE AND MITIGATE BGA PAD CRATERING IN PRINTED CIRCUIT BOARDS Mudasir Ahmad, Jennifer Burlingame, and Cherif Gui Abstract
2008 21-4 A Comprehensive Analysis of the Thermal Fatigue Reliability of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using Backward and Forward Compatible Assembly Processes Richard Coyle, Peter Read, Steven Kummerl, Debra F Abstract
21-4 iNEMI Pb-FREE ALLOY ALTERNATIVES PROJECT REPORT: STATE OF THE INDUSTRY Gregory Henshall, Ph.D., Robert Healy, Ranjit S. P Abstract
21-4 STENCIL PRINTING EVALUATION OF A 01005 COMPONENT BASED ON A STATISTICAL APPROACH Sung Chul Joo, Daniel F. Baldwin, Ph.D., and Weon Abstract
21-3 THERMO-MECHANICAL RELIABILITY MANAGEMENT MODELS FOR AREA-ARRAY PACKAGES ON Cu-CORE AND NO-CORE ASSEMBLIES Pradeep Lall, Milan Shah, Luke Drake, Timothy Moor Abstract
21-3 EFFECT OF TEMPERATURE CYCLING PARAMETERS ON THE SOLDER JOINT RELIABILITY OF A Pb-FREE PBGA PACKAGE John Manock, Richard Coyle, Brian Vaccaro, Heather Abstract
21-3 ALTERNATE SOLDER BALLS FOR IMPROVING DROP/SHOCK RELIABILITY Ahmer Syed, TaeSeong Kim, and Se Woong Cha Abstract
21-2 ROHS CONVERSION FOR MEDICAL DEVICES: RISKS, CONSIDERATIONS AND COMPANY IMPACT PLUS SEVERAL BOM ANALYSIS CASE STUDIES Kim Sharpe Abstract
21-2 MINIATURE IC PACKAGE INNOVATIONS FOR ADVANCED MEDICAL ELECTRONIC APPLICATIONS Vern Solberg Abstract
21-2 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKEL-PALLADIUM-GOLD FINISH WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly Abstract
21-1 A COMPLIANT AND CREEP RESISTANT SAC-Al(Ni) ALLOY Dr. Benlih Huang, Dr. Hong-Sik Wang, and Dr. Ning-Cheng Lee Abstract
21-1 QUALIFICATION OF A LEAD-FREE CARD ASSEMBLY & TEST PROCESS FOR A SERVER COMPLEXITY PCBA Matthew Kelly, et al. Abstract
21-1 CREEP CORROSION ON LEAD-FREE PRINTED CIRCUIT BOARDS IN HIGH SULFUR ENVIRONMENTS Randy Schueller, Ph.D. Abstract
2007 20-4 CHARACTERIZATION OF Sn-Ag-Cu SOLDER UNDER TENSILE AND SHEAR LOADING Mohammad M Hossain1, Tommi Reinikainen2, Viswam Puligandla Abstract
20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Abstract
20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G. Subbarayan and R. Kinyanjui, J. Deutsch and M. Abstract
20-3 ULTRASONIC GOLD TO GOLD FLIP CHIP INTERCONNECT PROCESS USING LOW COST SUBSTRATES Philip Couts and M. Kawahara Abstract
20-3 CONSIDERATIONS IN SELECTING FLUXES FOR LEAD-FREE WAVE SOLDERING Chrys Shea, Sanju Arora, Steve Brown, and Steven W Abstract
20-3 FAILURE MECHANISM OF SAC 305 AND SAC 405 IN HARSH ENVIRONMENTS AND INFLUENCE OF BOARD DEFECTS INCLUDING BLACK PAD Polina Snugovsky, Zohreh Bagheri, Heather McCormic Abstract
20-2 Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards Denis Barbini, Paul Wang, Peter Biocca, Quyen Chu, Abstract
20-2 MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER Heather McCormick, Polina Snugovsky, Zohreh Bagher Abstract
20-2 65nm FCBGA RELIABILITY FOR NEXT GENERATION GAMING DEVICE1* PHASE I-A METHODOLOGY FOR STREAMLINE PRODUCT DESIGN CYCLE AND 2ND SYSTEM LEVEL QUALIFICATION Paul P.E. Wang, Ph.D.1, DongJi Xie, Ph.D4., Michae Abstract
20-1 MECHANICAL TESTING OF SOLDER JOINT ARRAYS VERSUS BULK SOLDER SPECIMENS Robert Darveaux Abstract
20-1 UTILIZATION OF DIE ATTACH ADHESIVES IN WAFER LEVEL ASSEMBLY OF CAVITY PACKAGES FOR IMAGE SENSORS G Humpston and M Nystrom, S Kanagavel, M Previti a Abstract
20-1 JCAA/JG-PP LEAD-FREE SOLDER TESTING FOR HIGH RELIABILITY APPLICATIONS: -55ºC to +125ºC THERMAL CYCLE TESTING David Hillman and Ross Wilcoxon Abstract
2006 19-4 VOIDS IN SOLDER JOINTS Raiyo F. Aspandiar Abstract
19-4 RELIABILITY STUDY AND SOLDER JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS Marie Cole, Matthew Kelly, Mario Interrante, Grego Abstract
19-4 AGING EFFECTS ON DYNAMIC BEND TEST PERFORMANCE OF PB-FREE SOLDER JOINTS ON NI/AU FINISH Min Ding and Adriana Porras Abstract
19-3 SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS FOR HIGH VOLTAGE MEDICAL APPLICATIONS J. Bultitude, P. Gormally, J. Rogers, and J. Jiang Abstract
19-3 RELIABILITY ASSESSMENT OF MIXED TECHNOLOGY DRIVEN BY AVAILABILITY OF LEAD FREE COMPONENTS Lucian Kasprzak, Milind Sawant, Gerry Adams, Brian Lewis, Paul N. Houston, Daniel Baldwin, and Mike Nahorniak Abstract
19-3 COMPARISON OF NEAR-EUTECTIC SnPb AND SnAg SOLDER PLATING FOR WLP APPLICATIONS Bioh Kim, Charles Sharbono, Tom Ritzdorf, and Dan Abstract
19-3 EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R. Wayne Buttry, Alice K Abstract
19-2 INTEGRATION OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGY Lars Boettcher, A. Neumann, A. Ostmann and H. Reichl Abstract
19-2 MODEL BASED APPROACHES FOR SELECTING RELIABLE UNDERFILL-FLUX COMBINATIONS FOR FLIP CHIP PACKAGES Satyanarayan Iyer, Nagendra Nagarur and Purushotha Abstract
19-2 A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson Abstract
19-2 EFFECT OF AGING ON PULL STRENGTH OF SnPb, SnAgCu, AND MIXED SOLDER JOINTS IN PERIPHERAL SURFACE MOUNT COMPONENTS A. Choubey, D. Menschow, S. Ganesan, M. Pecht Abstract
19-1 SUPPLY CHAIN DATA EXCHANGE FOR MATERIAL DISCLOSURE Mark Myles Abstract
19-1 DEVELOPMENT OF A "SYSTEMS BASED" COMPLIANCE APPROACH TO THE EUROPEAN UNION'S ROHS DIRECTIVE Holly Evans Abstract
19-1 SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICES Fay Hua and Carl Deppisch Abstract
19-1 PROCESS AND RELIABILITY ISSUES WITH LEAD-FREE CSP REWORK Arun Gowda et al. Abstract
2005 18-4 RELIABILITY CONSIDERATIONS FOR IMPLANTED MEDICAL ELECTRONICS Anthony Primavera, Ph.D. and Jamie Hoffpauir Abstract
18-4 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER BOARD FINISHES WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez et al. Abstract
18-4 EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY Manivannan Sampathkumar et al. Abstract
18-4 GENERAL APPROACH IN REDUCING EMI FOR 3D MICROELECTRONICS SENSORS Alessandro Gandelli et al. Abstract
18-3 SMT GOES FROM MICRO TO NANOSCALE R. Tummala, A. Aggarwal, S. Bansal, and P.M. Raj Abstract
18-3 DESIGN ANALYSIS AND OPTIMIZATION OF WAFER-LEVEL CSP BOARD LEVEL SOLDER JOINT RELIABILITY Tong Yan Tee et al. Abstract
18-3 A STUDY ON MOLDING MATERIAL FOR FLEXIBLE FLIP CHIP CONNECTION S. Lu, T-H. Lin, D. McBride, and F. Andros Abstract
18-3 A RELIABILITY EXAMINATION OF LEAD-FREE QUARTZ CRYSTAL PRODUCTS USING SURFACE MOUNT TECHNOLOGY ENGINEERED FOR HARSH ENVIRONMENTS Todd H. Treichel, CQE Abstract
18-2 NANOTECHNOLOGY AND LOW TEMPERATURE ELECTRONICS ASSEMBLY Alan Rae Abstract
18-2 RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al. Abstract
18-2 FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Abstract
18-2 MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS R. Scott Priore, S. Camerlo, and Mark V. Brillhart Abstract
18-1 OPTIMIZING STENCIL DESIGN FOR LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher Abstract
18-1 HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar Abstract
18-1 DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF VERTICAL POWER DEVICES Lars Boettcher et al. Abstract
18-1 DETECTING AND ANALYZING WAFER BUMP VOIDS WITH X-RAY INSPECTION Dr. Udo E. Frank Abstract
2004 17-4 YIELD ENHANCEMENT AND YIELD MODELING FOR MASS REFLOW PROCESS OF 0201 COMPONENTS Susan Lu, Sarah Lam, and Wei-Yun Cheng Abstract
17-4 LEAD-FREE SOLDERING FOR SMT COMPONENTS: A REVIEW OF PROCESSING AND RELIABILITY ISSUES Frank Liotine, Jr., PE Abstract
17-4 COMPONENT RELIABILITY ON METAL-BACKED SUBSTRATES FOR HARSH AUTOMOTIVE ENVIRONMENTS John L. Evans et al. Abstract
17-3 TRENDS IN MEDICAL DEVICE DESIGN AND MANUFACTURING Phil Salditt Abstract
17-3 IMPLANTABLE MEDICAL ELECTRONICS ASSEMBLY QUALITY AND RELIABILITY CONSIDERATIONS Peter Borgesen / Eric Cotts Abstract
17-3 IMPACT OF ADVANCES IN COMPONENT PACKAGING ON MEDICAL DEVICES James Marshall et al. Abstract
17-3 IMPROVING MANUFACTURABILITY, REDUCING COST, AND EXTENDING PRODUCT LIFE - PROCESSES AND PITFALLS UNIQUE TO MEDICAL DEVICES Chris Rozewski and Walter Thomson Abstract
17-2 EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS ON SHEAR STRENGTH AND MICROSTRUCTURE IN PB-FREE SURFACE MOUNT ASSEMBLY S. Bukhari, D.L. Santos, L.P. Lehman and E. Cotts Abstract
17-2 COMPREHENSIVE NUMERICAL AND EXPERIMENTAL ANALYSIS OF MATRIX TFBGA WARPAGE Tong Yan Tee et al. Abstract
17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract
17-2 ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al. Abstract
17-2 TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al. Abstract
17-1 A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA Andrew Mawer, D. Hodges Popps, and G. Presas Abstract
17-1 MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS Dave Nelson and Hector Pallavicini et al. Abstract
17-1 EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ Dwayne R. Shirley et al. Abstract
17-1 LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS Marie Cole et al. Abstract
17-1 ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES Harjinder Ladhar and Sundar Sethuraman Abstract
2003 16-4 AN OVERVIEW OF IPC STANDARDS RELATED TO MOISTURE SENSITIVE COMPONENTS Robert Rowland Abstract
16-4 MOISTURE SENSITIVE COMPONENT STORAGE Hiro Suganuma and Alvin Tamanaha Abstract
16-4 THE IMPACT OF LEAD-FREE REFLOW TEMPERATURES ON THE MOISTURE SENSITIVITY PERFORMANCE OF PLASTIC SURFACE MOUNT PACKAGES B.T. Vaccaro, R.L. Shook, and D.L. Gerlach Abstract
16-4 CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVITY LEVEL AND RELIABILITY OF DEVICES FOR HIGH-REL APPLICATIONS S. R. Martell Abstract
16-3 FAILURE MODE AND EFFECTS ANALYSIS IN ELECTRONICS MANUFACTURING Jayang Patel et al. Abstract
16-3 AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS Sunny Zhang et al. Abstract
16-3 DROP TEST AND IMPACT LIFE PREDICTION MODEL FOR QFN PACKAGES Tong Yan Tee et al. Abstract
16-3 OPTICAL CONNECTOR CONTAMINATION/SCRATCHES AND ITS INFLUENCE ON OPTICAL SIGNAL PERFORMANCE Tatiana Berdinskikh et al. Abstract
16-2 FLUX-LESS / VOID-FREE: AN ENVIRONMENT-FRIENDLY SOLDERING PROCESS FOR OPTOELECTRONICS ASSEMBLIES Gary Pangelina Abstract
16-2 NANO-OPTICS: NEW OPTICAL STRUCTURES AND LITHOGRAPHY ENABLE STANDARDIZED MANUFACTURING FOR MULTIPLE COMPONENTS Barry J. Weinbaum and Hubert Kostal Abstract
16-2 AUTOMATED PACKAGING OF MEMS DEVICES Joseph S. Bell Abstract
16-2 SURFACE MOUNT OPTICS A NEW APPROACH TO PHOTONIC ASSEMBLY Dr. Steven K. Case Abstract
16-1 ACOUSTIC MICRO IMAGING IN THE FOURIER DOMAIN FOR EVALUATION OF ADVANCED PACKAGING Janet E. Semmens and Lawrence W. Kessler Abstract
16-1 REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION Dr. Gerald Pham-Van-Diep et al. Abstract
16-1 A NEW DIMENSION IN STENCIL PRINT OPTIMIZATION Ian Fleck and Prashant Chouta Abstract
16-1 SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al. Abstract
2002 15-4 IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al. Abstract
15-4 EFFECT OF COPPER CONCENTRATION ON THE SOLID-STATE AGING REACTIONS BETWEEN TIN-COPPER LEAD-FREE SOLDERS AND NICKEL W. T. Chen, R. Y. Tsai, Y. L. Lin, and C. R. Kao Abstract
15-4 COMPONENT TEMPERATURE STUDY ON TIN-LEAD AND LEAD-FREE ASSEMBLIES Matthew Kelly et al. Abstract
15-4 FATIGUE PROPERTIES OF Sn/3.5Ag/0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION J. Oliver, M. Nylén, O. Rod, C. Markou Abstract
15-3 CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTS Jodi Roepsch, Robert Champaign, Marlin Downey Abstract
15-3 EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONS Daryl Santos et al. Abstract
15-3 RELIABILITY ASSESSMENT OF FLIP CHIP ON LAMINATE CSP Julia Y. Zhao, Ph.D. Abstract
15-3 DEVELOPMENT AND APPLICATION OF A PRESS-PIN/PTH RELIABILITY MODEL A. Kulkarni et al. Abstract
15-2 A STUDY OF MICROSTRUCTURAL CHANGE OF LEAD-CONTAINING AND LEAD FREE SOLDERS Hans-Juergen Albrecht Abstract
15-2 LAND GRID ARRAY PACKAGING TECHNOLOGY IN PORTABLE ELECTRONICS Arni Kujala Abstract
15-2 STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS Vern Solberg Abstract
15-2 ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES Ji Wu and Michael Pecht Abstract
15-1 THE NEW MILLENNIUM FOR CCGA - BEYOND 2000 I/O Marie S. Cole Abstract
15-1 ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION VS. VECTORAL IMAGING Mark J. Norris Abstract
15-1 RAPID QUALIFICATION OF CSP ASSEMBLIES BY INCREASE OF RAMP RATES AND CYCLING TEMPERATURE RANGES Reza Ghaffarian Abstract
15-1 e-MANUFACTURING SOFTWARE FOR PRODUCT AND PROCESS REAL-TIME MONITORING Hersh Kohli, Ranjan Chatterjee, and Dan Kauss Abstract
15-1 LOW COST SOLDER BUMPING VIA PASTE REFLOW Dr. Benlih Huang and Dr. Ning-Cheng Lee Abstract
2001 14-4 Withdrawn paper Cemal Basaran Abstract
14-4 IMPROVING PCBA SOLDERABILITY BY DESIGN Dale Lee Abstract
14-4 RELIABILITY OF ELECTRICALLY CONDUCTIVE ADHESIVES AS A SUBSTITUTE FOR LEAD BASED SOLDER IN MILITARY, AUTOMOTIVE, AND HIGH STRESS ENVIRONMENTS Frank Liotine Abstract
14-4 WETTABILITY ANALYSIS FOR C4 OLGA PACKAGE Jinlin Wang Abstract
14-3 A SMORGASBORD OF PACKAGES – PETITE AND LIGHT Dr. Ken Gilleo Abstract
14-3 AUTOMATING OPTOELECTRONIC PACKAGING Bryan Pate Abstract
14-3 SURFACE MOUNTABLE PACKAGE (OPTOBGA TM) FOR 10G DATA LINK Yuji Kishida Abstract
14-3 OPTOELECTRONIC PACKAGING TECHNOLOGIES FOR FUTURE TELECOMMUNICATION SYSTEMS IN JAPAN Hideyuki Takahara Abstract
14-2 FLIP-CHIP AND GAAS : A ROUTE FOR RF PACKAGING Claude Drevon Abstract
14-2 IC AND MEMS TRENDS AND RELIABILITY Reza Ghaffarian, Ph.D. Abstract
14-2 CIRCUIT CONSTRUCTIONS AND MATERIAL SELECTIONS OF FLEX CIRCUITS FOR HIGH DENSITY INTERCONNECTS Dominique Numakura Abstract
14-2 INTERCONNECTIONS IN 3 DIMENSIONS FOR HIGH SPEED COMPONENTS Christian Val Abstract
14-1 ELECTROLESS Ni-P/Pd/Au PLATING FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa Abstract
14-1 AIRCRAFT FLIGHT TESTS AND RELIABILITY IMPROVEMENTS OF MEMS PRESSURE SENSOR ASSEMBLY Dr. Namsoo Kim Abstract
14-1 AUTOMOTIVE PBGA ASSEMBLY AND BOARD-LEVEL RELIABILITY WITH LEAD-FREE VERSUS LEAD-TIN INTERCONNECT Andrew Mawer Abstract
14-1 EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE V.Srirama Sastry Abstract
2000 13-4 EFFECTS OF NEMI Sn/Ag/Cu ALLOY ASSEMBLY REFLOW ON PLATED THROUGH HOLE PERFORMANCE John J. Davignon Abstract
13-4 IMPACT OF HIGHER MELTING LEAD-FREE SOLDERS ON THE RELIABILITY OF PRINTED WIRING ASSEMBLIES Dr. Laura J. Turbini Abstract
13-4 ISSUES AND SOLUTIONS TO IMPLEMENTING LEAD FREE SOLDERING Lee Whiteman Abstract
13-4 TIN WHISKER GROWTH AND PREVENTION Yun Zhang, et al. Abstract
13-3 INLINE FLUX VOLUME MEASUREMENT FOR CSP PROCESS CONTROL Stacy Kalisz Abstract
13-3 AUTOMATING UNDERFILL FOR NON-TRADITIONAL PACKAGES, SECONDARY CSP UNDERFILL, STACKED DIE, AND NO-FLOW UNDERFILL Al Lewis Abstract
13-3 AUTOMATION & CONTROL OF THE SURFACE MOUNT PROCESS Neil Douglas Abstract
13-3 WORLD WIDE DEPLOYMENT OF CSP ASSEMBLY PROCESS CSP STRESS/STRAIN ENERGY DISTRIBUTION MODELING AND FATIGUE RESISTANCE STUDY Dr. Shelgon Yee and Dr. Paul Wang Abstract
13-2 APPLICATION OF MICROELECTRONIC DEVICES FOR PACKAGE-INDUCED STRESS MEASUREMENT Tung-Sheng Chen Abstract
13-2 PROCESS 'OPTIMIZATION' USING DESIGNED EXPERIMENTS IN AN EMS PROVIDER'S FACILITY Sandeep Tonapi Abstract
13-2 A VISION OF ELECTRONICS IN THE 21st CENTURY Toru Ishida Abstract
13-2 ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS Morihiro Kada Abstract
13-1 CSP ASSEMBLY RELIABILITY: COMMERCIAL AND HARSH ENVIRONMENTS Namsoo P. Kim Abstract
13-1 PROCESS OPTIMIZATION FOR 1.0 MM PITCH CBGA Marie Cole Abstract
13-1 ENVIRONMENTAL ISSUES IN ELECTRONICS ASSEMBLY Greg Munie Abstract
13-1 EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson Abstract
1999 12-4 REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow Abstract
12-4 NEW GENERATION METALLIC SOLDERABILITY PRESERVATIVES Donald P. Cullen Abstract
12-4 RELIABILITY EXPERIMENTS FOR DIFFERENT MICROVIA CONSTRUCTIONS Lavanya Gopalakrishnan Abstract
12-4 IMPLEMENTING LEAD FREE SOLDDERING - EUROPEAN CONSORTIUM RESEARCH Dr. Malcolm Warwick Abstract
12-3 SURFACE MOUNT CERAMIC CHIP CAPACITOR RELIABILITY IN A HIGH VOLTAGE ENVIRONMENT Frank Liotine, Jr. Abstract
12-3 INTERCONNECT RELIABILITY OF MICRO BGA AND CHIP SCALE PACKAGES M. Avery et al. Abstract
12-3 CAN CIM IMPROVE OVERALL FACTORY EFFECTIVENESS? Douglas Scott Abstract
12-3 CSP SELF-CENTERING ASSESSMENT USING OFFSET NORMALIZATION METHODOLOGY Dr. Paul P.E. Wang and Dr. Katsuji Takasu Abstract
12-2 SOLDER JOINT RELIABILITY OF ChipArray BGA Ahmer Syed and Tony Panczak et al. Abstract
12-2 Ultra CSP: A WAFER-LEVEL PACKAGE Peter Elenius Abstract
12-2 CHOOSING THE CORRECT CHIP SIZE PACKAGE FOR THE RIG Marc Papageorge Abstract
12-2 CONSIDERATIONS FOR PRACTICAL IMPLEMENTATION OF CSP James Rathburn Abstract
12-1 ADVANCES IN CHIP SCALE PACKAGES AND TOOLS Ron Bauer and James Malatesta Abstract
12-1 PACKAGE-TO-BOARD INTERCONNECTION AND RELIABILITY OF BGA PACKAGES OVER EXTENDED TEMPERATURE RANGE* Puligandia Viswanadham et al. Abstract
12-1 SOLDER JOINT RELIABILITY OF THE BLP PACKAGE Kwang-Seong Choi et al. Abstract
12-1 FACTORS THAT AFFECT VOID FORMATION IN BGA ASSEMBLY Anthony A. Primavera et al. Abstract
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