Journal of SMT - Paper Review Process
About the Journal of SMTThe Journal of SMT is a quarterly, peer-reviewed, technical publication of articles related to electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Committee Mission StatementThe mission of the SMTA Journal Committee is to select and review papers for publication in the Journal of SMT, ensuring a high standard of quality for each issue and ensuring article content best serves SMTA membership.
So you want to get published in the Journal of SMT...
Surface Mount Technology Association and the Journal of Surface Mount Technology offers electronics assembly and packaging scientists and engineers an opportunity to publish significant findings of their research in a high quality, peer-reviewed, technical journal in a timely manner without incurring any page charges and share their knowledge with their colleagues.
Authors are invited to submit original and unpublished contributions to the journal. The technical and scientific content of the contribution should be new, significant and relevant to practicing technologists, engineers and scientists that make up SMTA membership. Topical areas of interest include practice, development and deployment of new technologies, materials, processes, manufacturing, quality and reliability. Manuscripts are required to be non-commercial in nature and content. Trademarks and copyrights are to be indicated in footnotes.
The review committee may consider publishing contributions based on materials previously presented to a limited audience if such material is considered topical, relevant, significant, and timely. Such contributions must have been revised and updated significantly enough to warrant bringing it to the attention of a wider audience in a timely manner.
Paper Format/Structure Requirements
General Formatting (Download a format template here)
The authors, before submission, should proof read the manuscript thoroughly and ensure that the manuscript is tense consistent, grammatically correct, technically precise, accurate, and devoid of typographical and spelling errors.
Figures and Tables
Prospective authors are referred to the SMTA journal format template for acceptable formatting information.
The Review Process
The complete review process is expected to take two to three months but can take longer depending on the number of papers currently in review. Authors can expect to hear from the journal editor or communications director within three weeks of submission of your manuscript.
(Step 1) The completed manuscript in a soft copy (Word doc) format should be submitted to the SMTA Director of Communications.
(Step 2) The manuscript is then submitted to the committee chair to be assigned for review to two (2) reviewers considered to have the expertise in the subject area of the manuscript for a careful dispassionate review. The identity of the authors and their institutional affiliations will be concealed from the reviewers. They will review the paper for technical content, relevance, timeliness, and value to the readership.
(Step 3) The manuscript will be adjudged into one of four categories: 1) accepted for publication 2) accepted with minor modifications, 3) accepted with major modifications and 4) not accepted. The results of the review will be communicated to the editor for onward transmission to the authors.
(Step 4) If required, authors are to modify the manuscript in light of the reviewers' comments and suggestions and resubmit the manuscript within two weeks. Authors should also send bios and photos at this time.
(Done!) When the manuscript is finally accepted for publication, the editor will schedule the publication and inform the authors of the particular number and volume of the journal in which the article will be published.
How to submit your paper for review
2. Upload your paper
3. Enter metadata
4. Confirm your submission
5. Review next steps of the process
Questions? Contact SMTA Director of Communications.
Srinivas Chada, Ph.D., Stryker, Committee Chair
Kola Akinade, Ph.D., Cisco Systems, Inc.
Raiyo Aspandiar, Ph.D., Intel Corporation
Nilesh Badwe, Ph.D., Intel Corporation
Tom Borkes, The Jefferson Project
Rich Brooks, Jabil Circuit, Inc.
Jean-Paul Clech, Ph.D., EPSI, Inc.
Richard Coyle, Ph.D., Nokia Bell Labs
Gary Freedman, Colab Engineering, LLC
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
David Hillman, Collins Aerospace
Amol Kane, Schlumberger
Pradeep Lall, Ph.D., M.B.A., Auburn University
Tae-Kyu Lee, Ph.D., Portland State University
Anthony Primavera, Ph.D., Micro Systems Engineering, Inc.
Viswanadham Puligandla, Ph.D., Nokia (Retired)
Brian Roggeman, Qualcomm Technologies Inc.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Paul Vianco, Ph.D., Sandia National Laboratories