Exhibitor Information

Toronto SMTA Expo & Tech Forum

In conjunction with the International Conference on Soldering & Reliability (ICSR)
Wednesday June 7, 2017
Location: Edward Village Markham
50 East Valhalla Drive
Markham, ON L3R 0A3

The Toronto Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!
Exhibit Hours:
Wednesday, June 7, 2017: 10:00am – 3:30pm

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
Early Registration Ends May 5th! Rates go up $100!

For a hard copy of the sponsorship and exhibits form, click here.

View the floor plan.

Exhibit space entitles you to:

  • 6 ft. Draped table
  • Two Chairs
  • Attendee list (sent after the conference)
  • Company sign
  • Lunch & Breaks
  • Sponsorship Opportunities:

  • Lanyard Sponsor $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Bag Sponsor - $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Lunch Sponsor - $800
  • Refreshment Break Sponsor - $550
  • Attendees

    Register here to attend the expo only!
    Technical conference and workshops not included.

    Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

    ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

    Exhibit Hours:
    Wednesday, June 7, 2017: 10:00am – 3:30pm

    Registration Opens

    Expo Opens

    12:00pm - 1:00pm
    Free Lunch!

    A Special Thank You To Our Lunch Sponsor: Nortec Humidity!

    1:00pm – 2:00pm
    Chuck Bauer Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Hype or Reality?
    Chuck Bauer, Ph.D., TechLead Corporation

    While often exaggerated and over-promised, nanotechnology now provides vital performance enhancements to electronic systems after over a decade of R&D. Advanced solders and adhesives pioneered nanotech adoption by electronics manufacturers by minimizing technical risk and masking their nanotechnology nature via drop-in alternatives. Hype gives way to breakthrough as new nanotech solutions address multiple aspects of packaging, interconnect, and assembly. Leading nanotech contributions today include surface finishes for stencils and tin whisker mitigation, adhesives, die attach and solder replacements, via structures, additive circuit formation and 3D printing, novel conductors and dielectrics, and passive components. The authors examine a broad range of exciting evolutionary as well as revolutionary nano-based technologies for electronics manufacturing, identifying key technical challenges and fascinating practical applications characterizing the potential routes to commercialization. As with most technical developments, evolutionary nano-enabled solutions find quicker adoption thanks to existing standards and infrastructure, but revolutionary nano-alternatives entice early adopters with their potential, albeit at substantial risk, to displace incumbent technologies or even more excitingly to create entirely new markets. Presentations of practical and cost effective applications demonstrate that nanotechnology today indeed represents reality instead of hype.

    2:00pm - 2:30pm
    Alan Rae iNEMI Roadmap 2017 and Research Priorities
    Alan Rae, TPF Enterprises

    The 2017 iNEMI roadmap is now the only comprehensive electronics roadmap left in the Western Hemisphere. This talk outlines some of the findings relevant to the assembly community and the process underway to develop Research Priorities for companies, University and Government laboratories.

    2:30pm - 3:00pm
    Alan Rae Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach
    Mike Bixenman, DBA, KYZEN Corporation

    Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths. Environmental conditions can mobilize conductive ions that lead to metal migration, and from which ultimately causes intermittent performance and failure. Non-standard test methods have been developed to perform site specific analysis of both contamination trapped under the bottom termination and reliability expectations based on the current assembly process conditions. These test methods allow an OEM to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.

    The purpose of this research paper is to demonstrate the use of these non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.

    Dessert & Coffee Break!

    Expo Ends

    Current Exhibitor List:

    Adroit Circuit Logix Private Limited
    Alpha Assembly Solutions
    Apex Tool Group - Weller
    Aven Tools, Inc.
    Comtree Inc.
    Conductive Containers, Inc.
    Electronic Coating Technologies
    EPTAC Corporation
    Foresite, Inc.
    Fuji America Corporation
    High Density Package User Group
    Indium Corporation
    Integrity Testing Laboratory Inc.
    INVENTEC Performance Chemicals USA
    Kyzen Corporation
    MicroCare Corporation
    Nikon Metrology, Inc.
    Opti-Tech Scientific Inc.
    Panasonic Factory Solutions
    Seica Inc.
    StaticStop a division of SelecTech, Inc.
    Trans-Tec America LLC.
    Universal Instruments
    ZESTRON Americas

    Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.