Toronto SMTA Expo & Tech Forum
In conjunction with the International Conference on Soldering & Reliability (ICSR)
Location: Edward Village Markham
50 East Valhalla Drive
Markham, ON L3R 0A3
The Toronto Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at firstname.lastname@example.org or call 952-920-7682. Thank you!
Wednesday, June 7, 2017: 10:00am – 3:30pm
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
Early Registration Ends May 5th! Rates go up $100!
For a hard copy of the sponsorship and exhibits form, click here.
Exhibit space entitles you to:
Register here to attend the expo only!
Technical conference and workshops not included.
Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!
ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Wednesday, June 7, 2017: 10:00am – 3:30pm
12:00pm - 1:00pm
A Special Thank You To Our Lunch Sponsor: Nortec Humidity!
1:00pm – 2:00pm
Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Hype or Reality?
Chuck Bauer, Ph.D., TechLead Corporation
While often exaggerated and over-promised, nanotechnology now provides vital performance enhancements to electronic systems after over a decade of R&D. Advanced solders and adhesives pioneered nanotech adoption by electronics manufacturers by minimizing technical risk and masking their nanotechnology nature via drop-in alternatives. Hype gives way to breakthrough as new nanotech solutions address multiple aspects of packaging, interconnect, and assembly. Leading nanotech contributions today include surface finishes for stencils and tin whisker mitigation, adhesives, die attach and solder replacements, via structures, additive circuit formation and 3D printing, novel conductors and dielectrics, and passive components. The authors examine a broad range of exciting evolutionary as well as revolutionary nano-based technologies for electronics manufacturing, identifying key technical challenges and fascinating practical applications characterizing the potential routes to commercialization. As with most technical developments, evolutionary nano-enabled solutions find quicker adoption thanks to existing standards and infrastructure, but revolutionary nano-alternatives entice early adopters with their potential, albeit at substantial risk, to displace incumbent technologies or even more excitingly to create entirely new markets. Presentations of practical and cost effective applications demonstrate that nanotechnology today indeed represents reality instead of hype.
2:00pm - 2:30pm
iNEMI Roadmap 2017 and Research Priorities
Alan Rae, TPF Enterprises
The 2017 iNEMI roadmap is now the only comprehensive electronics roadmap left in the Western Hemisphere. This talk outlines some of the findings relevant to the assembly community and the process underway to develop Research Priorities for companies, University and Government laboratories.
2:30pm - 3:00pm
Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach
Mike Bixenman, DBA, KYZEN Corporation
Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths. Environmental conditions can mobilize conductive ions that lead to metal migration, and from which ultimately causes intermittent performance and failure. Non-standard test methods have been developed to perform site specific analysis of both contamination trapped under the bottom termination and reliability expectations based on the current assembly process conditions. These test methods allow an OEM to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.
The purpose of this research paper is to demonstrate the use of these non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.
Dessert & Coffee Break!
Current Exhibitor List: