Call for Papers

Submit an Abstract

Suggested topics to be covered include:

Design, DfX:

  • Design for Excellence (DfM, DfT, DfR, etc.)
  • Mechanical / electrical design integration
  • Thermal management
  • Design verification
  • Design tools, simulation

    Solder alloys:

  • Lead-free assembly processes
  • Lead-free die attach soldering
  • Nano-scale soldering materials & processes
  • New solder paste technologies

    Failure modes:

  • Tin whiskers
  • Electromigration and corrosion
  • Solder embrittlement


  • Conformal and hydrophobic coatings
  • Thermal interface materials
  • Underfills and encapsulants

    Environmental compliance & regulations

    Interconnects & component packaging:

  • Alternative interconnects
  • Nano-interconnects
  • High density interconnects
  • Package-on-package


  • Halogen-free laminates
  • Printed electronics
  • Flex circuits soldering and assembly


  • Harsh environment
  • Wearables
  • Entertainment systems
  • Robots and drones
  • Mechatronics

    Reliability from solder joint to systems level:

  • Temperature cycling, mechanical shock/drop, aging

    If you are interested in presenting, please submit a 200-300 word abstract to Jenny Ng at Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by March 1, 2018.

    Technical papers are required and will be due on May 1, 2018.
    Please make sure you have company approval before submitting an abstract.

    The conference is co-sponsored by the SMTA Toronto Chapter.

    Questions? Please contact:
    Jenny Ng, SMTA Conference and Education Manager
    Phone: 952-920-7682

  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.