Call for Papers
Suggested topics to be covered include:
Environmental compliance & regulations
Interconnects & component packaging:
Reliability from solder joint to systems level:
If you are interested in presenting, please submit a 200-300 word abstract to Jenny Ng at email@example.com. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by March 1, 2018.
Technical papers are required and will be due on May 1, 2018.
Please make sure you have company approval before submitting an abstract.
The conference is co-sponsored by the SMTA Toronto Chapter.
Questions? Please contact:
Jenny Ng, SMTA Conference and Education Manager