The ICEHET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, conformal coating and other methods to achieve high reliability in aggressive environments.
Abstracts are no longer being accepted. Please contact the conference organizer for special requests at firstname.lastname@example.org.
Choose your presentation format:
15 Minute Supplier Presentation*
* Limited spots available
30 Minute Technical Presentation
30 Minute Standard Paper Presentation**
** Eligible for best of conference award
Suggested topics to be covered include:
3D Printing and Additive Manufacturing
Design for Assembly, Test, Reliability, Environment (DfX)
Low Voltage, High Speed & Frequency
Environmental Compliance & Regulations
Halogen-Free PCBs & Components
Manufacturing and Assembly Processes
Lead-free Processes & Materials
New Solder Chemistry & Reliability
Thermal Dissipation/Thermal Interface Materials
Chip and Board-Level Underfills
Conformal Coating & Potting
Flex Circuits, Soldering and Assembly
Breathable Substrates, Wearable Devices
Component Packaging Technologies
Failure Modes, e.g. Corrosion, Electrochemical Migration
If you are interested in presenting, please submit a 200-300 word abstract at the link above. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by end of March 2020.
Final abstracts/papers and presentations are required for advance review and will be due on Monday, May 11, 2020.
Please make sure you have company approval to travel and present before submitting an abstract.
Supplier Presentations may opt in to be included in the conference proceedings. All other submissions will be included in the conference proceedings.
The conference is co-sponsored by the SMTA Ontario Chapter.