Call for Abstracts

The ICEHET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, conformal coating and other methods to achieve high reliability in aggressive environments.

Abstracts are no longer being accepted. Please contact the conference organizer for special requests at

Choose your presentation format:

15 Minute Supplier Presentation*
15 Minute Supplier Presentation
* Limited spots available
30 Minute Technical Presentation
30 Minute Technical Presentation

30 Minute Standard Paper Presentation**
30 Minute Standard Paper Presentation
** Eligible for best of conference award

Suggested topics to be covered include:

  • 3D Printing and Additive Manufacturing
  • Medical Devices
  • Design for Assembly, Test, Reliability, Environment (DfX)
  • Low Voltage, High Speed & Frequency
  • Harsh Environment
  • Environmental Compliance & Regulations
  • Halogen-Free PCBs & Components
  • Manufacturing and Assembly Processes
  • Lead-free Processes & Materials
  • New Solder Chemistry & Reliability
  • Tin Whiskers
  • Thermal Dissipation/Thermal Interface Materials
  • Chip and Board-Level Underfills
  • Conformal Coating & Potting
  • Printed Electronics
  • Flex Circuits, Soldering and Assembly
  • Breathable Substrates, Wearable Devices
  • Component Packaging Technologies
  • Failure Modes, e.g. Corrosion, Electrochemical Migration
  • Discrete Components, e.g. LEDs, MEMS
  • High Density Interconnects
  • Ultra Fine Pitch, e.g. PoP, SiP, WLP
  • Nano-interconnects, Materials & Processes
  • Electronics for Automotive, e.g. LiDAR
  • Solder Metallurgy, New Alloys & Reliability
  • Automation and Industry 4.0

  • If you are interested in presenting, please submit a 200-300 word abstract at the link above. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by end of March 2020.

    Final abstracts/papers and presentations are required for advance review and will be due on Monday, May 11, 2020.
    Please make sure you have company approval to travel and present before submitting an abstract.

    Supplier Presentations may opt in to be included in the conference proceedings. All other submissions will be included in the conference proceedings.

    The conference is co-sponsored by the SMTA Ontario Chapter.

    Questions? Please contact:
    Phone: +1-952-920-7682