International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Formerly the International Conference on Soldering & Reliability (ICSR)


Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

Start Planning Now for ICEHET 2020

Markham, Ontario
June 2-4, 2020

Jason Keeping and Mayor of Markham
Conference Chair, Jason Keeping, P. Eng., and Mayor of Markham Open the 2019 Conference

Value Proposition for Participation

  • Broaden your knowledge of the wider enabling technologies
  • Deepen your skills on traditional soldering and electronics
  • Access to local engineering and science talent
  • Opportunities for cross-sector collaboration/innovation
  • Industry exposure to your work – generate interest, support, awareness & excitement
  • Build network and local-ecosystem that aligns various needs and service providers
  • Recognition for Best Conference Paper

    Still Accepting Abstracts!

    The ICEHET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, conformal coating and other methods to achieve high reliability in aggressive environments.

    Choose your presentation format:

    15 Minute Supplier Presentation*
    15 Minute Supplier Presentation
    * Limited spots available
    30 Minute Technical Presentation
    30 Minute Technical Presentation

    30 Minute Standard Paper Presentation**
    30 Minute Standard Paper Presentation
    ** Eligible for best of conference award