Dealing with the Challenges in the New Advanced Packaging Era
E. Jan Vardaman, TechSearch International, Inc.Wednesday, June 5, 2019 | 1:00pm-1:45pm
The role of packaging and assembly in the electronics industry is changing. In the high performance space, new packaging solutions are being adopted to achieve the economic advantages that were previously met with silicon scaling. Many of these options include heterogeneous integration in the form of silicon interposers, fan-out on substrate, and system-in-package. In the mobile space the introduction of 5G requires the development of new packaging solutions. Product ramps are steep and cost and performance targets must be met. The automotive sector with increased electronic content provides an attractive market, but reliability requirements are tough to meet. Challenges for packaging and assembly in this new era include chip package interaction (CPI) for devices fabricated with low-k and ultra-low-k (ULK) dielectrics. This presentation discusses the packaging changes and some of the issues being faced.