Call for Papers

Abstract Deadline Extended: February 28, 2019
Submit an Abstract

Suggested topics to be covered include:

  • Design for Assembly, Test, Reliability, Environment (DfX)
  • High Voltage, Speed and Frequency
  • Harsh Environment
  • Environmental Compliance & Regulations
  • Halogen-Free PCBs and Components
  • Manufacturing and Assembly Processes
  • Lead-free Processes & Materials
  • Lead-free Die Attach Soldering
  • New Solder Paste Technologies
  • Solder Joint Reliability
  • Tin Whiskers
  • Failure Modes, e.g. Corrosion, Electrochemical Migration
  • Thermal Dissipation
  • Thermal Interface Materials
  • Chip and Board-Level Underfills
  • Conformal Coating and Potting
  • Printed Electronics
  • Flex Circuits, Soldering and Assembly
  • Breathable Substrates, Wearable Devices
  • Component Packaging Technologies
  • Discrete Components, e.g. LEDs, MEMS
  • High Density Interconnects
  • Ultra Fine Pitch, e.g. PoP, SiP, WLP
  • Nano-interconnects, Materials & Processes
  • Alternative Interconnects
  • Electronics for Automotive, e.g. Lida

    If you are interested in presenting, please submit a 200-300 word abstract to Jenny Ng at Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by end of March 2019.

    Abbreviated Papers and presentations are required and will be due on May 10, 2019.
    Please make sure you have company approval to travel and present before submitting an abstract.

    The conference is co-sponsored by the SMTA Ontario Chapter.

    Questions? Please contact:
    Jenny Ng, SMTA Conference and Education Manager
    Phone: 952-920-7682

  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.