Call for Abstracts

Choose your presentation format:

  • 10 Minute Supplier Presentation
  • 30 Minute Short Technical Presentation
  • 30 Minute Standard Paper Presentation*

    * Eligible for best of conference award

    Suggested topics to be covered include:

  • Design for Assembly, Test, Reliability, Environment (DfX)
  • Low Voltage, High Speed & Frequency
  • Harsh Environment
  • Environmental Compliance & Regulations
  • Halogen-Free PCBs & Components
  • Manufacturing and Assembly Processes
  • Lead-free Processes & Materials
  • New Solder Chemistry & Reliability
  • Tin Whiskers
  • Thermal Dissipation/Thermal Interface Materials
  • Chip and Board-Level Underfills
  • Conformal Coating & Potting
  • Printed Electronics
  • Flex Circuits, Soldering and Assembly
  • Breathable Substrates, Wearable Devices
  • Component Packaging Technologies
  • Failure Modes, e.g. Corrosion, Electrochemical Migration
  • Discrete Components, e.g. LEDs, MEMS
  • High Density Interconnects
  • Ultra Fine Pitch, e.g. PoP, SiP, WLP
  • Nano-interconnects, Materials & Processes
  • Electronics for Automotive, e.g. LiDAR
  • Solder Metallurgy, New Alloys & Reliability
  • Automation and Industry 4.0

    ICEET Call for Abstracts

    If you are interested in presenting, please submit a 200-300 word abstract at the link above. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by end of March 2019.

    Final abstracts/papers and presentations are required for advance review and will be due on May 10, 2019.
    Please make sure you have company approval to travel and present before submitting an abstract.

    The conference is co-sponsored by the SMTA Ontario Chapter.

    Questions? Please contact:
    Phone: 952-920-7682

  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.