International Conference for Electronics Enabling Technologies (ICEET)

Formerly the International Conference on Soldering & Reliability (ICSR)

Technical Program Finalized!

View the complete technical program

TUV SUD Canada

Facility Tour: TÜV SÜD Canada

Wednesday, June 6 | 6:00pm-7:00pm
Take a tour of a state-of-the-art testing facility at the TÜV SÜD Canada Testing Lab.
Location: 11 Gordon Collins Drive, Gormley, ON L0H 1G0 Canada
Be sure to select this complimentary option when you register.

Celestica Technology Director to Keynote the Conference

Shawn Blakney

On the afternoon of Wednesday, June 6, Shawn Blakney, Senior Director of Global Technology at Celestica, Inc., will deliver his keynote presentation titled "The Automated and Digital Factory - Navigating Technology Disruption." Technology progress is accelerating and the costs of technology are going down at a similar rate. Manufacturing companies have to make choices about where they will invest to generate value for customers and shareholders. Wading through the dizzying array of technology solutions to decide where to invest is a key responsibility for technology and business leaders manufacturing companies. The presentation will focus on the Automation and Digital Factory technologies and the challenges of making investment decisions in a rapidly changing landscape.

ICSR Celebrated 10th Anniversary


Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.