International Conference for Electronics Enabling Technologies (ICEET)
Formerly the International Conference on Soldering & Reliability (ICSR)
Technical Program Finalized!
Facility Tour: TÜV SÜD Canada
Wednesday, June 6 | 5:30pm-6:45pm
Location: 11 Gordon Collins Drive, Gormley, ON L0H 1G0 Canada
You will be touring a TUV SUD Canada working lab with Electro Magnetic Compliance chamber and Safety Lab in a 23000 Sq feet building. Our specialized engineers will be presenting the basic understanding of EMC and safety testing. Be sure to select this complimentary option when you register.
Celestica Technology Director to Keynote the Conference
On the afternoon of Wednesday, June 6, Jeff Kennedy, Director of Technology at Celestica, Inc., will deliver his keynote presentation titled "The Automated and Digital Factory - Navigating Technology Disruption." Technology progress is accelerating and the costs of technology are going down at a similar rate. Manufacturing companies have to make choices about where they will invest to generate value for customers and shareholders. Wading through the dizzying array of technology solutions to decide where to invest is a key responsibility for technology and business leaders manufacturing companies. The presentation will focus on the Automation and Digital Factory technologies and the challenges of making investment decisions in a rapidly changing landscape.
About ICEETElectronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.
The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.