International Conference for Electronics Enabling Technologies (ICEET)
Formerly the International Conference on Soldering & Reliability (ICSR)
Submit an abstract for the 2018 conference!
The Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is January 19, 2018. Show off your company's expertise by presenting a paper. Abstracts can be submitted quickly and easily from the Call for Papers page.
About ICEETElectronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.
The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.