Charles Hutchins Educational Grant

The SMTA is accepting applications for the 2019 Charles Hutchins Educational Grant. This $5000 grant, given in memory of Charles Hutchins, past president of the SMTA, educator, mentor, and distinguished industry colleague, was established in 1998 to encourage graduate students to pursue careers in the electronics industry, by developing closer ties between student research and the needs of the electronics industry.

The Hutchins grant, co-sponsored by SMTA and Circuits Assembly magazine, has been awarded annually since 1998 to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. The grant is intended for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary. $100,000 has been awarded to grant recipients since 1998!

The Application Deadline has passed. Next year's Application Form and Eligibility Requirements will be available early in 2019!
View eligibility criteria.
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View the list of current grant donors.

Downloadable Flyer

2019 Hutchins Grant Flyer

2018 Grant Winner Announced

2018 Hutchins Grant recipient Vishnu Vardhan Busi Reddy from Georgia Institute of Technology

The 2018 recipient, Vishnu Vardhan Busi Reddy, a graduate student at the Georgia Institute of Technology, has been selected by the SMTA Grant Committee for his project entitled "Assessments of Solder Joint Interconnection and Inner Package Interconnection (Via) Qualities for Improved Understanding of Chip to Package Interaction, Using Laser Ultrasonic Inspection Technique."

Vishnu expects to graduate in December 2020 with his PhD. He received his Bachelor's Degree in Engineering at Osmania University in 2007 and his Master's Degree in Technology from the Indian Institute of Technology Madras in 2009.

Vishnu's ultimate goal is to set up a start-up and develop an innovative semiconductor and automation organization promoting advanced packaging technology. He desires to create a workplace for thousands of employees, a profitable, international and leading company within the industry. Vishnu also hopes to turn an underdeveloped area into a flourishing industrial zone.

Vishnu has plans to attend business school at Georgia Tech which he states will lay the foundation in achieving his goals.

We are honored to award such an inspiring and hardworking individual. We are excited to see where the next steps lead you and we wish you the best of luck Vishnu!

The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, IL, October 14 - 18, 2018. The 2019 grant will be presented at SMTAI in Rosemont, IL, September 22-26, 2019.

Honorable Mention:

The following students are acknowledged for the hard work they put in on their projects as well as the application process.

Aritra Chakraborty, Michigan State University
"Investigating Governing Factors for Whisker Growth from Tin Thin Films"

Ben Stewart, Georgia Institute of Technology
"Reliability Characterization and Optimization of Interconnects and Sensors for Flexible Body-Worn Bioinformatic Device"

Mohammed Genanu, Binghamton University
"Effect of Processing Variables on the Mechanical Reliability of Copper Pillar Pb Free Solder Joints"

Nakul Kothari, Auburn University
"Use of Micro-Computed Tomography Data for Non-Destructive Assessment of Deformation and Strains in Electronics Packaging"

Pavan Rajmane, University of Texas at Arlington
"Chip Package Interaction Study to Analyze Mechanical Integrity of Two Die 3D-TVS Package and Design Optimization"

Saurabh Saxena, University of Maryland College park
"Accelerated Testing and Modeling of High Energy LiCoO2 Cathode based Lithium-ion Batteries"

Sinan Su, Auburn Univerisity
"Effects of Surface Finish on the Fatigue Properties of Lead-Free Doped Solder Joints"

Thaer Alghoul, Binghamton University
"The Effects of Bi/Sb Addition to SnAgCu Alloys in Accelerated Life Tests"

Past Recipients

2017 Hutchins Grant recipient Stephanie Choquette from Iowa State University
Stephanie Choquette, Iowa State University
Paper: "Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections"
Where is she now? Chemical Engineer, Honeywell FM&T
2016 Hutchins Grant recipient Thomas Reeve from Purdue University
Thomas Reeve, Purdue University
Paper: "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys"
Where is he now? Continuing his graduate studies
2015 Hutchins Grant recipient Hanju Oh from Georgia Institute of Technology
Hanju Oh, Georgia Institute of Technology
Paper: "A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling"
Where is he now? Continuing his graduate studies
2014 Hutchins Grant recipient Christine Taylor from Georgia Tech
Christine Taylor, Georgia Tech
Paper: "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages"
Where is she now? Continuing her graduate studies
2013 Hutchins Grant recipient Andrew Daya from Rochester Institute of Technology
Andrew Daya, Rochester Institute of Technology (RIT)
Paper: "Package on Package: A Comprehensive Study of the Profile Requirements, Alloy Combinations, Location Influence, and Reliability Performance"
Where is he now? Process Engineer, Garmin AT
2012 Hutchins Grant recipient Xian Qin from Georgia Institute of Technology
Xian Qin, Georgia Institute of Technology
Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections"
Where is she now? Continuing her graduate studies
2011 Hutchins Grant recipient Pylin Sarobol from Purdue University
Pylin Sarobol, Purdue University (West Lafayette, IN)
Paper: "Growth Mechanisms for the Formation of Tin Whiskers"
Where is she now? R&D Scientist and Engineer, Sandia National Laboratories
2010 Hutchins Grant recipient Jonathon Tucker from Purdue University
Jonathon Tucker, Purdue University (West Lafayette, IN)
Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders"
Where is he now? Reliability Engineer, Microsoft
2009 Hutchins Grant recipient Zhaozhi (George) Li, from Auburn University
Zhaozhi Li (George), Auburn University (Auburn, AL)
Paper: "Design, Processing and Reliability Characterizations of 3D Wafer Level Chip Scale Packaging Technology"
Where is he now? Senior Process Technology Development Engineer, Intel ATTD
2008 Hutchins Grant recipient Lei Nie, from the University of Maryland
Lei Nie, Ph.D., CALCE @ University of Maryland (College Park, MD)
Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
Where is she now? Hardware Reliability Engineer, Lab126
Gayatri Cuddalorepatta
Gayatri Cuddalorepatta, University of Maryland (College Park, MD)
Paper: "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
Where is she now? Continuing her graduate studies
Sungchul Joo
Sungchul Joo, Georgia Institute of Technology (Atlanta, GA)
Paper: "Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
Where is he now? Research Scientist, Cree, Inc.
Leila Jannesari Ladani
Leila Janessari Ladani, Ph.D., University of Maryland (College Park, MD)
Paper: "Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
Where is she now? Professor, University of Alabama
Brian McAdams
Brian McAdams, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
Where is he now? Manager Global Products, W.L. Gore
Andrew Perkins
Andrew Perkins, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
Where is he now? R&D Process Engineer, Aptina Imaging
Arun Gowda
Arun Gowda, Ph.D., Binghamton University (Binghamton, NY)
Paper: "High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
Where is he now? Electronics Packaging & Miniaturization Lab Manager, GE Global Research
Renzhe Zhao
Renzhe Zhao, Ph.D., Auburn University (Auburn, AL)
Paper: "Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
Where is he now? Chief Technologist, Huawei Technologies Co.
Jennifer Venton
Jennifer Venton Muncy, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Flip Chip on Flex for Low Cost Electronic Packaging"
Where is she now? Technology Development Manager, IBM Semiconductor Research and Technology Center
Anita Sargent
Anita Sargent, Binghamton University (Binghamton, NY)
Paper: "The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
Where is she now? OB/GYN Resident, Yale Medical Center
Daniel Lewis
Daniel Lewis, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Solidification of Ternary Alloys"
Where is he now? Professor, Rensselaer Polytechnic Institute

Chair: Andrew Daya, Garmin AT (2013 Hutchins Grant Recipient)

Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Corporation
Glen Herzog
Li Jiang, Texas Instruments, Inc.
Jason Keeping, P. Eng., Celestica Inc. (Canada)
Steven Lustig, The Coca Cola Company
Luu T. Nguyen, Ph.D., Texas Instruments Inc.
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