Charles Hutchins Educational Grant

The SMTA is accepting applications for the 2017 Charles Hutchins Educational Grant. This $5000 grant, given in memory of Charles Hutchins, past president of the SMTA, educator, mentor, and distinguished industry colleague, was established in 1998 to encourage graduate students to pursue careers in the electronics industry, by developing closer ties between student research and the needs of the electronics industry.

The Hutchins grant, co-sponsored by SMTA and Circuits Assembly magazine, has been awarded annually since 1998 to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. The grant is intended for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary. $95,000 has been awarded to grant recipients since 1998!

The Application Deadline has passed. Next year's Application Form and Eligibility Requirements will be available early in 2018!
View eligibility criteria.
Donate to the Hutchins Educational Grant
View the list of current grant donors.

Downloadable Flyer

2017 Hutchins Grant Flyer

2016 Grant Winner Announced

2016 Hutchins Grant recipient Kate Reeve from Purdue University
The 2016 recipient, Kate Reeve, a graduate student at Purdue University, has been selected by the SMTA Grant Committee for her project entitled "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys."

Kate expects to graduate from Purdue University with her Ph.D. in May of 2018, after which she plans to pursue a career in academics, conducting research and teaching within topics of materials science. Kate graduated from Iowa State University in 2013 with a bachelor's degree in Materials Engineering and dual minors in Nuclear Engineering and Economics.

The award was presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, IL, September 25 - 29. The 2017 grant will be presented at SMTAI in Rosemont, IL, September 17 - 21, 2017.

Honorable Mention:

The following students are acknowledged for the hard work they put in on their projects as well as the application process.

Andre Delhaise, University of Toronto
"The Strengthening Effects of Bismuth on Aged Lead-Free Solder Alloys"

Cong Zhao, Auburn University
"Long Term Isothermal Aging Effect on Reliability of Doped Lead- Free Solder Joint"

Jacob Perry, Sam Houston State University
"Method Development for Comparison of Solvent Systems, Ionic Contamination from Fluxes, and Extraction Methods for Residual Contamination in Electronics Cleaning Processes "

Maan Kokash, Binghamton University
"Deformation and Damage of Copper and Nano Copper Based Joints"

Mina Mobini, Ryerson University

Nathan Valentine, University of Maryland
"Impact of Intermittent Power Cyclying on Insulated Gate Bipolar Transistors (IGBT)"

Ninad Shahane, Georgia Institute of Technology
"Modeling, Design, Fabrication, Low-temperature Assembly and Characterization of All-Copper, Interconnections without Solder"

Saeed Akbari Roknabadi, University of Toronto
"Fracture Load Prediction of Underfilled Solder Joints in BGA/PCB Assemblies"

Shantanu Shashikant Deshpande, Auburn University
"Development of QFN Devices for Harsh Environmental Applications (Grade 0 and Beyond)"

Sivasubramanian Thirugnanasambandam, Auburn University
"Long Term Isothermal Correlation Aging Effects of Different Doped Lead Free Solder Alloys on Thermo-Mechanical Reliability"

Thaer Alghoul, Binghamton University
"New Constructive Relations for Solder"

Vidya Jayaram, Georgia Institute of Technology
"Modeling, Design, and Demonstration of Direct SMT Assembly of a Large 2.5D Glass BGA Package by Warpage Control and Mitigation in Assembly, with System Level Reliability"

Past Recipients

2015 Hutchins Grant recipient Hanju Oh from Georgia Institute of Technology
Hanju Oh, Georgia Institute of Technology
Paper: "A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling"
Where is he now? Continuing his graduate studies
2014 Hutchins Grant recipient Christine Taylor from Georgia Tech
Christine Taylor, Georgia Tech
Paper: "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages"
Where is she now? Continuing her graduate studies
2013 Hutchins Grant recipient Andrew Daya from Rochester Institute of Technology
Andrew Daya, Rochester Institute of Technology (RIT)
Paper: "Package on Package: A Comprehensive Study of the Profile Requirements, Alloy Combinations, Location Influence, and Reliability Performance"
Where is he now? eDFM Engineer, Schlumberger
2012 Hutchins Grant recipient Xian Qin from Georgia Institute of Technology
Xian Qin, Georgia Institute of Technology
Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections"
Where is she now? Continuing her graduate studies
2011 Hutchins Grant recipient Pylin Sarobol from Purdue University
Pylin Sarobol, Purdue University (West Lafayette, IN)
Paper: "Growth Mechanisms for the Formation of Tin Whiskers"
Where is she now? R&D Scientist and Engineer, Sandia National Laboratories
2010 Hutchins Grant recipient Jonathon Tucker from Purdue University
Jonathon Tucker, Purdue University (West Lafayette, IN)
Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders"
Where is he now? Reliability Engineer, Microsoft
2009 Hutchins Grant recipient Zhaozhi (George) Li, from Auburn University
Zhaozhi Li (George), Auburn University (Auburn, AL)
Paper: "Design, Processing and Reliability Characterizations of 3D Wafer Level Chip Scale Packaging Technology"
Where is he now? Senior Process Technology Development Engineer, Intel ATTD
2008 Hutchins Grant recipient Lei Nie, from the University of Maryland
Lei Nie, Ph.D., CALCE @ University of Maryland (College Park, MD)
Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
Where is she now? Hardware Reliability Engineer, Lab126
Gayatri Cuddalorepatta
Gayatri Cuddalorepatta, University of Maryland (College Park, MD)
Paper: "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
Where is she now? Continuing her graduate studies
Sungchul Joo
Sungchul Joo, Georgia Institute of Technology (Atlanta, GA)
Paper: "Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
Where is he now? Research Scientist, Cree, Inc.
Leila Jannesari Ladani
Leila Janessari Ladani, Ph.D., University of Maryland (College Park, MD)
Paper: "Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
Where is she now? Professor, University of Alabama
Brian McAdams
Brian McAdams, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
Where is he now? Manager Global Products, W.L. Gore
Andrew Perkins
Andrew Perkins, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
Where is he now? R&D Process Engineer, Aptina Imaging
Arun Gowda
Arun Gowda, Ph.D., Binghamton University (Binghamton, NY)
Paper: "High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
Where is he now? Electronics Packaging & Miniaturization Lab Manager, GE Global Research
Renzhe Zhao
Renzhe Zhao, Ph.D., Auburn University (Auburn, AL)
Paper: "Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
Where is he now? Chief Technologist, Huawei Technologies Co.
Jennifer Venton
Jennifer Venton Muncy, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Flip Chip on Flex for Low Cost Electronic Packaging"
Where is she now? Technology Development Manager, IBM Semiconductor Research and Technology Center
Anita Sargent
Anita Sargent, Binghamton University (Binghamton, NY)
Paper: "The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
Where is she now? OB/GYN Resident, Yale Medical Center
Daniel Lewis
Daniel Lewis, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Solidification of Ternary Alloys"
Where is he now? Professor, Rensselaer Polytechnic Institute

R. Wayne Johnson, Ph.D., Chair, Tennessee Tech University
Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Corporation
Andrew Daya, Schlumberger
Glen Herzog
Li Jiang, Texas Instruments, Inc.
Jason Keeping, P. Eng., Celestica Inc. (Canada)
Steven Lustig, The Coca Cola Company
Luu T. Nguyen, Ph.D., Texas Instruments Inc.
Chandradip Patel, Ph.D., Schlumberger
Andrew Perkins, Ph.D., Aptina Imaging
(2003 Hutchins Grant Recipient)

SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819