Charles Hutchins Educational Grant

The SMTA is accepting applications for the 2019 Charles Hutchins Educational Grant. This $8000 grant, given in memory of Charles Hutchins, past president of the SMTA, educator, mentor, and distinguished industry colleague, was established in 1998 to encourage graduate students to pursue careers in the electronics industry, by developing closer ties between student research and the needs of the electronics industry.

The Hutchins grant, co-sponsored by SMTA and Circuits Assembly magazine, has been awarded annually since 1998 to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field. The grant is intended for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary. $105,000 has been awarded to grant recipients since 1998!

The Application Deadline has passed. Next year's Application Form and Eligibility Requirements will be available early in 2020!
View eligibility criteria.
Donate to the Hutchins Educational Grant
View the list of current grant donors.

Downloadable Flyer

2020 Hutchins Grant Flyer

2019 Grant Winner Announced

2019 Hutchins Grant recipient Ben Stewart from Georgia Institute of Technology

The 2019 recipient, Ben Stewart, a graduate student at the Georgia Institute of Technology, has been selected by the SMTA Grant Committee for his project entitled "Biaxial Inflation Test for Electromechanical Reliability Characterization and Optimization of Stretchable Body-Worn Bioinformatic Device."

Ben expects to graduate in May 2021 with his PhD in Mechanical Engineering from Georgia Tech. He received his Bachelor's Degree in Mechanical Engineering from the University of New Mexico in 2017. The same year, Ben co-founded a start-up company in Albuquerque, New Mexico which specialized in the production of copper nano-inks as a cheaper alternative to silver nano-inks for inkjet printed electronics. While at UNM, Ben also worked as a student intern at Sandia and Los Alamos National Laboratories, specializing in product definition and purchased product value streams for mechanical and electrical components.

Ben's ultimate goal is to leverage his technical and business background to create a start-up company specializing in the development of next-generation stretchable electronic devices for human health monitoring. He hopes his contribution to the proactive healthcare technology industry will make a positive impact in the lives of people all over the world. He desires to create a workplace for thousands of employees, and to create a leading company within the packaged electronics industry.

Ben plans to attend business school at Georgia Tech to work towards a Masters in Business Administration concurrently with his PhD, which he posits will lay the foundation in achieving his goals.

The award is presented at the SMTA Annual Meeting during the SMTA International Conference in Rosemont, IL, September 22 - 26, 2019. The 2020 grant will be presented at SMTAI in Rosemont, IL, September 27 - October 1, 2020.

Past Recipients

2018 Hutchins Grant recipient Vishnu Vardhan Busi Reddy from Georgia Institute of Technology
Vishnu Vardhan Busi Reddy, Georgia Institute of Technology
Paper: "Assessments of Solder Joint Interconnection and Inner Package Interconnection (Via) Qualities for Improved Understanding of Chip to Package Interaction, Using Laser Ultrasonic Inspection Technique"
Where is he now? Continuing his graduate studies
2017 Hutchins Grant recipient Stephanie Choquette from Iowa State University
Stephanie Choquette, Iowa State University
Paper: "Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections"
Where is she now? Chemical Engineer, Honeywell FM&T
2016 Hutchins Grant recipient Thomas Reeve from Purdue University
Thomas Reeve, Purdue University
Paper: "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys"
Where is he now? Continuing his graduate studies
2015 Hutchins Grant recipient Hanju Oh from Georgia Institute of Technology
Hanju Oh, Georgia Institute of Technology
Paper: "A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling"
Where is he now? Continuing his graduate studies
2014 Hutchins Grant recipient Christine Taylor from Georgia Tech
Christine Taylor, Georgia Tech
Paper: "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages"
Where is she now? Continuing her graduate studies
2013 Hutchins Grant recipient Andrew Daya from Rochester Institute of Technology
Andrew Daya, Rochester Institute of Technology (RIT)
Paper: "Package on Package: A Comprehensive Study of the Profile Requirements, Alloy Combinations, Location Influence, and Reliability Performance"
Where is he now? Process Engineer, Garmin AT
2012 Hutchins Grant recipient Xian Qin from Georgia Institute of Technology
Xian Qin, Georgia Institute of Technology
Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections"
Where is she now? Continuing her graduate studies
2011 Hutchins Grant recipient Pylin Sarobol from Purdue University
Pylin Sarobol, Purdue University (West Lafayette, IN)
Paper: "Growth Mechanisms for the Formation of Tin Whiskers"
Where is she now? R&D Scientist and Engineer, Sandia National Laboratories
2010 Hutchins Grant recipient Jonathon Tucker from Purdue University
Jonathon Tucker, Purdue University (West Lafayette, IN)
Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders"
Where is he now? Reliability Engineer, Microsoft
2009 Hutchins Grant recipient Zhaozhi (George) Li, from Auburn University
Zhaozhi Li (George), Auburn University (Auburn, AL)
Paper: "Design, Processing and Reliability Characterizations of 3D Wafer Level Chip Scale Packaging Technology"
Where is he now? Senior Process Technology Development Engineer, Intel ATTD
2008 Hutchins Grant recipient Lei Nie, from the University of Maryland
Lei Nie, Ph.D., CALCE @ University of Maryland (College Park, MD)
Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
Where is she now? Hardware Reliability Engineer, Lab126
Gayatri Cuddalorepatta
Gayatri Cuddalorepatta, University of Maryland (College Park, MD)
Paper: "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
Where is she now? Continuing her graduate studies
Sungchul Joo
Sungchul Joo, Georgia Institute of Technology (Atlanta, GA)
Paper: "Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
Where is he now? Research Scientist, Cree, Inc.
Leila Jannesari Ladani
Leila Janessari Ladani, Ph.D., University of Maryland (College Park, MD)
Paper: "Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
Where is she now? Professor, University of Alabama
Brian McAdams
Brian McAdams, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
Where is he now? Manager Global Products, W.L. Gore
Andrew Perkins
Andrew Perkins, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
Where is he now? R&D Process Engineer, Aptina Imaging
Arun Gowda
Arun Gowda, Ph.D., Binghamton University (Binghamton, NY)
Paper: "High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
Where is he now? Electronics Packaging & Miniaturization Lab Manager, GE Global Research
Renzhe Zhao
Renzhe Zhao, Ph.D., Auburn University (Auburn, AL)
Paper: "Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
Where is he now? Chief Technologist, Huawei Technologies Co.
Jennifer Venton
Jennifer Venton Muncy, Ph.D., Georgia Institute of Technology (Atlanta, GA)
Paper: "Flip Chip on Flex for Low Cost Electronic Packaging"
Where is she now? Technology Development Manager, IBM Semiconductor Research and Technology Center
Anita Sargent
Anita Sargent, Binghamton University (Binghamton, NY)
Paper: "The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
Where is she now? OB/GYN Resident, Yale Medical Center
Daniel Lewis
Daniel Lewis, Ph.D., Lehigh University (Bethlehem, PA)
Paper: "Solidification of Ternary Alloys"
Where is he now? Professor, Rensselaer Polytechnic Institute

Chair: Andrew Daya, Garmin AT (2013 Hutchins Grant Recipient)

Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Corporation
Glen Herzog
Li Jiang, Texas Instruments, Inc.
Jason Keeping, P. Eng., Celestica Inc. (Canada)
Steven Lustig, The Coca Cola Company
Luu T. Nguyen, Ph.D., Texas Instruments Inc.
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