Professional Development Course

Conference registration now includes this course!

Hold My Circuit Board and Watch This! The Consequences of Poor Design and Assembly Decisions for High Performance Electronics

Doug Pauls and Dave Hillman, Collins Aerospace

Tuesday, 2 April 2019 | 9:00 - 12:30

This course is a presentation of ten (or so) case studies showing the consequences of poor design practices and poor materials choices for high performance electronic assemblies. The value of some of these case studies is knowing what NOT to do in an assembly operation. Topics cover packaging, soldering, surface finishes, process control coupons, various residues, external contaminants, conformal coating, etc. The target audience is the process engineer.

About the instructors

Doug Pauls

Doug Pauls

Principal Materials and Process Engineer with Collins Aerospace, an Aerospace OEM, in Cedar Rapids, Iowa. Doug holds a B.A. in Chemistry and Physics and a B.S. in Electrical Engineering, but has morphed into a materials engineer over his career. He has worked for the Naval Avionics Center in Indianapolis, Indiana as a Materials Engineer and as Technical Director of Contamination Studies Laboratories, Kokomo, Indiana, before joining Rockwell Collins in 2000.

Doug has been an active IPC Chairman for 35 years, serving as the Chairman of the Cleaning and Coating Committees for 10 years and chairing the Technical Activities Executive Committee from 2012-2014. Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes. He has been a U.S. representative to ISO and IEC working groups on SIR, electromigration, and cleanliness reliability standards. He has participated in numerous national and international consortia on electronics manufacturing materials and processes. He is also known for his goofy sense of humor. His most recent accomplishment was being awarded the IPC's top honor, the IPC Hall of Fame Award. He has led a group of industry subject matter experts to revise the ionic cleanliness provisions of J-STD-001, culminating in J-STD-001 Revision G, Amendment 1.

Dave Hillman

Dave Hillman

David D. Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his present assignment he serves as a consultant to manufacturing on material and processing problems. He served as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009. He has published numerous technical papers with the 2011 SMTAI Conference paper being selected as "Best of Proceedings Paper." Mr. Hillman was named a Rockwell Collins Fellow in 2016. He serves as the Chairman of the IPC JSTD-002 Solderability committee. Mr. Hillman served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis prior to joining Rockwell. He is a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), and Surface Mount Technology Association (SMTA) and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).