Electronics in Harsh Environments Conference
24-26 April 2018
Crowne Plaza Amsterdam - Schiphol
The technical committee finalized the program. Session topics include Predicting Component Life, Joining Technologies, Electrochemical Reliability, Adhesive and Coating, Advanced Test Methods and High Temperature PCB Materials and Fabrication. iNEMI is a co-organizer of the final day of conference sessions focused on reliability in the automotive sector.
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Building on the successful Contamination, Cleaning and Coating Conference in 2017, SMTA Europe will host the Electronics in Harsh Environments Conference on 24-26 April 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.
Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.
This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.
Contact Tanya Martin, firstname.lastname@example.org, with questions or comments.