LED Assembly, Reliability & Testing Symposium 2017

CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the The Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 to 30, 2017.

The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.



Keynote Speakers Announced!

IWLPC Keynote Ralph Tuttle

Keynote Day 1:
Ralph Tuttle, Engineering Manager, Cree
Topic: High Power LED Solder Joint Reliability
Tuesday, November 28, 2017 | 8:45 am

In the past, the temperatures and drive currents that LEDs were typically operated at were limited by the packaging materials used in their construction. Recent improvements in these materials now allow luminaire manufacturers the ability to push the limits at which LEDs can operate and successfully achieve desired long-term lumen maintenance and efficacy objectives. While traditional lead-free solders used in SMT processing are acceptable for LEDs operating under more benign conditions, they are not as reliable when LEDs are operated at high temperatures and high drive currents. This talk will discuss failure modes associated with LEDs operating under stressful conditions and test results that demonstrate vastly improved solder joint reliability when using newer solders and with modifications to package construction.

IWLPC Keynote Warren Weeks

Keynote Day 2:
Warren Weeks, Director of Quality & Technical Services, Hubbell Lighting
Topic: Assembly, Reliability, and Testing (A.R.T.) of LED Luminaires
Wednesday, November 29, 2017 | 8:30 am



Technical Program Finalized!

View the program featuring research on:
  • LED Applications
  • LED Solder Joint Reliability
  • LED Failures and Failure Mechanisms
  • Board Processing with LEDs
  • LED Packaging
  • Panel Discussions
  • View the program



    Workshops on November 30:

    TimeTopicInstructor
    8:30am - 12:00pmShining a Light on LED Technology: Construction, Reliability, Qualification, Failure ModeMartine Simard-Normandin, Ph.D.
    MuAnalysis Inc.
    1:30pm - 5:00pmFailure Mechanisms and Qualification Tests for LEDsDiganta Das, Ph.D.
    CALCE University of Maryland


    Facility Tour

    North Carolina State University
    Nanofabrication Facility & FREEDM Systems Center
    Wednesday, November 29

    The tour is free to attend, just select the option when you register or stop by the registration desk!

    3:30pm – NCSU Nanofabrication Facility (NNF)
    2410 Campus Shore Drive, Raleigh, NC 27606

    4:15pm – FREEDM Tour
    Suite 100, Keystone Science Center (Centennial Campus)
    1791 Varsity Drive, Raleigh, NC 27606

    NCSU Nanofabrication Facility
    The NCSU Nanofabrication Facility (NNF) provides access to semiconductor processing tools to researchers from academia, government labs, and industry. A full range of micro and nano-fabrication capabilities including lithography, plasma etching, metallization, and metrology are available at the NNF.

    FREEDM Systems Center
    At the FREEDM Center, we're building the internet of energy: a network of distributed energy resources that intelligently manages power using secure communications and advanced power electronics. Our research priorities include power electronics packaging, controls theory, solid state transformers, fault isolation devices, and power systems simulation and demonstration.

    Stop by the registration desk to sign up. You are responsible for your own transportation. Visitor parking for NC State on North, Central and Centennial Campus is available for $2.00 per hour in the pay lots which accept MasterCard, Visa, Discover and American Express. Cash is not accepted.



    Registrations are being taken through the SMTA Online Registration System.






    South East Asia Technical Training Conference on Electronics Assembly Technologies 2018

    Co-located with Semicon Southeast Asia

    The South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.

    The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

    The conference is "claimable from HRDF under SBL scheme."





    Submit an Abstract

    Abstracts (300 words) are due January 15, 2018.. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please indicate if your abstract is for a course you are offering to instruct. Questions? Contact Jenny@smta.org

    Click here to submit an abstract




    Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately






  • Electronics in Harsh Environments Conference

    Building on the successful Contamination, Cleaning and Coating Conference in 2017, SMTA Europe will host the Electronics in Harsh Environments Conference on 24-26 April 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.

    Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

    This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.

    Contact Tanya Martin, tanya@smta.org, with questions or comments.






    Symposium on Counterfeit Parts and Materials 2018

    Thank you for attending the 2017 Symposium!

    2018 dates announced!

    Technical Symposium: June 26-28, 2018
    Expo: June 26-27, 2018
    Workshops: June 28, 2018

    University of Maryland, College Park, MD



    Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts.

    Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.





    The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.






    International Conference for Electronics Enabling Technologies 2018

    The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

    Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

    The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

    Registrations are being taken through the SMTA Online Registration System.






    Contamination, Cleaning and Coating Conference

    Co-organized by SMTA and SMART Group

    Organized by SMTA and SMART Group

    May 22-24, 2017
    Radisson Blu Hotel Amsterdam Airport Schiphol
    Amsterdam, Netherlands


    Thank you for attending!

    SMTA and SMART Group thank you for being part of their first-ever co-organized conference in Europe. The conference focus was on contamination, cleaning and conformal coating in the manufacture of electronics. We hope to see you next year for this two-day event featuring presentations, workshops, and a panel discussion.



    Purchase the conference proceedings! Contamination, cleaning and Coating Conference Proceedings



    View photos from the CCCC 2017
    View the album on Facebook!


    Thank you exhibiting companies!

    Foresite

    Gen3 Systems Limited

    Global SMT & Packaging

    HumiSeal Europe Ltd

    INVENTEC Performance Chemicals

    Kester

    KYZEN Corporation

    Partnertec

    ROTEC

    Specialty Coating Systems



    Conference Organizers

    Conference Chair:
    Mike Bixenman, KYZEN Corporation

    Executive Committee:
  • Keith Bryant, SMART Group
  • Tanya Martin, SMTA
  • Helmut Schweigart, ZESTRON Europe
  • Bob Willis, bobwillisonline.com







  • Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


     
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819