Embedded Systems Conference (ESC) Minneapolis

The Midwest's Only Embedded Systems Conference

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Embedded Systems Conference (ESC) Minneapolis is the premier conference for chip, board and systems design engineers, deep dive into testing and measurement equipment, system boards, debugging software tools, security products, and more. 

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ESC 2018

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International Conference for Electronics Enabling Technologies 2018

The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

Registrations are being taken through the SMTA Online Registration System.






SMTA-IPC High Reliability Cleaning and Conformal Coating Conference

Organized by SMTA and IPC

November 13-15, 2018
Chicago Marriott
Schaumburg, IL

"How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others. Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies. The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.

 


Call for Participation

 






South East Asia Technical Training Conference on Electronics Assembly Technologies 2018 (Rescheduled Dates)

The South East Asia Technical Conference on Electronics Assembly is a highly technical event that is focused on today's most important and timely issues. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

 

View the Technical Program Here!

 

Keynote Speaker

Recent Advances in Flip Chip, WLCSP, and FOWLP

John H. LauWednesday, August 15th
John H. Lau, Ph.D., ASM Pacific Technology

Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-first with die face-up, and chip-last or redistribution layer (RDL)-first will be presented in this study. Emphasis is placed on the latest developments of these technologies in the past few years. Their future trends will also be discussed.

 


Professional Development Courses

 

Flip Chip, WLCSP, and FOWLP Assembly and Reliability
Tuesday, August 14
John Lau, Ph.D. Sr. Technical Advisor, ASM

The major trend in the electronic industry today is to make products such as smartphones, tablets, wearables, internet of things, etc. more personal by making them smarter, lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, robust, innovative, creative, and less expensive. As the trend towards miniature and compact products continues, the introduction of cool products that are more user-friendly and contain a wider variety of functions will provide growth in the market. Some of the key technologies that are helping to make these cool product design goals possible are flip chip, WLCSP (wafer-level chip scale package), and FOWLP (fan-out wafer-level packaging). Their PCB (printed circuit board) assembly and solder joint reliability will be presented and discussed in this lecture.

 

Understanding Parameters Affecting Barrel Fill in Wave Soldering Process
Wednesday, August 15
AF Ng, Consultant, Techment Consultancy Sdn Bhd

AF Ng

Conventional Wave Soldering has been employed for soldering of boards since long time ago. The related manufacturing personnel are well aware of common encumbering defects happen erratically with this process. Some of these defects encountered daily are bridging, solder skips, solder voids and insufficient barrel fill or hole-fill. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering. It is important for the Engineering personnel to understand the root causes of the defect, as it can be contributed by factors from board design, material procurement to equipment setting and maintenance. With these numerous factors implicating, the engineers involved must be equipped with sufficient knowledge on soldering fundamentals, laminate composition, thermal demands, design geometry, wetting mechanism during wave contact and equipment maintenance. Commonly, many engineers just adopt recommendations based on DOE results and hoping to get consistent good barrel fill, but mostly to their disappointment due to erratic parameter shift. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to achieve consistent good barrel fill. We need a practical approach in tackling this vexing problem. To do that, one needs to know the fundamentals of wettability involving molten solder. The molten solder wicks up the barrel depend critically on the surface tensions of molten solder in relation to the solder interface with component terminals and copper plated holes. Upon discovering of the root causes, then, appropriate engineering solutions are to be implemented, be it equipment upgrade, board re-design, process adjustment or material changes. The course aims to provide a concise description of these factors through simplified notes, shared experiences and interaction in class.

 



Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

 

Registrations are being taken through the SMTA Online Registration System.






Electronics in Harsh Environments Conference Electronics in Harsh Environments Conference

The conference will focus on building reliable electronics used in power electronics and harsh environments.






Symposium on Counterfeit Parts and Materials 2019

Thanks for attending the Symposium on Counterfeit Parts and Materials June 26-28, 2018. Plans are underway for the 2019 event. Check back here for details.

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 



The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.






Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


 
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