SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Mar 6, 2018 Free Pre-Conference Webinar: Electronics in Harsh Environments

Mar 7, 2018 Webinar: Solder Paste Qualification Testing

Mar 14 & 15, 2018 Webtorial: Role of Bi in Lead-free Electronics - All You Need to Know

Apr 18 & 19, 2018 Webtorial: Stencil Printing Process and Solder Paste Inspection – An In-Depth Look

May 17 & 18, 2018 Webtorial: Tin Whisker – All You Should Know

Jun 14 & 15, 2018 Webtorial: SMT Process Fundamentals for Tin-Lead and Lead Free Assembly

Jul 17 & 18, 2018 Webtorial: Fan Out Packaging- Technology Overview and Evolution

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Webinars:

  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*

    Webtorials:

  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Ryan Flaherty, ryan@smta.org 952-920-7682.

    If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org 952-920-7682 or submit your abstract here.






    Free Pre-Conference Webinar:
    Electronics in Harsh Environments

    Register Now

    Tuesday, March 6, 2018 @ 2:30 PM GMT (9:30 AM US Eastern Time)

    Presenter: Keith Bryant, SMTA Europe

    Overview
    The Electronics in Harsh Environments Conference, 24-26 April in Amsterdam, Netherlands, will focus on building reliable electronics used in power electronics and harsh environments. In advance of this event we are holding a webinar to give engineers a preview of the topics and presentation content you can expect to see at the conference.

    For full information on the conference and speakers go to https://www.smta.org/harsh/

    Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

    This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.

    The webinar will run for approximately 60min with question and answer session. Space is limited to the first 100 delegates/companies so reserve your place now! A copy of each of the slides presented will be provided after the webinar.

    Registrations are being taken through a third party - Register Now.









    SMTA Webinar:
    Solder Paste Qualification Testing

    March 7, 2018
    1:00pm-2:30pm Eastern
    Presented by:
    Chrys Shea, Shea Engineering Services
    Doug Dixon, Henkel Electronic Materials

    Complimentary Webinar for Members!

    Is it time to upgrade your solder paste?

    Many SMT operations struggle with “process issues” that are actually solder paste-related, and have been resolved in newer generations of the materials.  Nagging defects like tombstones, solder balls, excessive voids and Head-In-Pillow can often be mitigated with a change of solder paste.  Newer formulations print better, wet better, endure hot reflow cycles better, and void less than older ones.

    In the world of solder pastes, one size does not fit all, which is why there are so many variants to choose from.  The myriad of options can be overwhelming, and matching the right product to any given operation can be confusing, time consuming and costly:

    • Solder paste has many conflicting properties – one that prints well may not pin test well, or one that minimizes voiding may reflow well, and tradeoffs must be considered
    • Developing test methods takes a great deal of engineering time and experience
    • Executing the tests requires engineering and production line time
    • Production boards are expensive test vehicles and may not test every property
    • Laboratory test boards often require a lot of manual setup and may not test every property, requiring multiple boards, setups and test runs

    When a small EMS provider determined it was time to update the SMT process chemistry, they needed to develop a test program that they could execute efficiently while keeping production running and costs under control.  When a solder paste provider wanted to commercialize their laboratory test board and needed a beta site, a working partnership was formed.  The cooperative effort produced a consolidated test plan that gauges key solder paste properties, requires less than one shift of line time per product evaluated, and is available as a customizable, off-the-shelf kit.

    This FREE 90-minute webinar reviews the initial test plan, data collection and analysis processes, and presents the results of the original study.  It discusses some of the issues encountered during test development and their resolutions or workarounds. It then interprets the findings using a scorecard method that helps the user weigh the importance of individual solder paste performance characteristics to their operation.

    The webinar then details the process of turning the laboratory board that was beta tested into a production line-ready kit, based off the beta builds, including:

    • Updates to the PCB layout to improve sample sizes, embed DOEs and reduce cost
    • Full documentation on the PCB including placement and ODB++ files with included BOM for easy programming
    • An assembly configurator that calculates sample sizes and component costs as the user inputs the number of PCBs they want to print and populate
    • Stencil and PCB support designs
    • Step-by-step instructions on how to execute a test that evaluates 20+ solder paste properties in 30 prints and 4 hours of line time
    • The score card that enables the assembler to customize their selection criteria for their operation, understand the potential tradeoffs, and make a data-driven decision on their next process chemistry

    Additional up-to-date information on the kit, such as availability and the status of the statistical reduction methods will also be provided, as the development work continues.

    About the Presenters:
    Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA "Member of Technical Distinction" award. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.

    Douglass Dixon is the Marketing Communications Director for Henkel Electronic Materials LLC and is responsible for managing all of the business unit’s global marketing communication activities.  With over 20 years of electronics industry experience, Dixon has a broad skill set that includes engineering, field service, applications, product management and marketing communications expertise.  Since joining Henkel in 2001, Dixon’s role has centered on strategic communications initiatives that have significantly raised the company’s profile within the global electronics market.    During his tenure at Henkel, Dixon has also championed multiple service initiatives on behalf of the company that have made a positive impact on the communities in which Henkel Electronic Materials employees live and work.   Examples include Henkel’s work with Think Together, a California-based organization dedicated to encouraging children to stay in school; and the Tianhua Orphan Education Project, a Chinese charity that provides full educational assistance for orphaned children. Dixon holds an Engineering degree from the University of Utah and, in his current role with Henkel, is based in the company’s Irvine, California facility.  

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Role of Bi in Lead-free Electronics - All You Need to Know

    Two (2) 90 minute Sessions
    March 14 and 15, 2018
    1:00pm to 2:30pm Eastern
    Dr. Jennie S. Hwang Presented by: Dr. Jennie S. Hwang, H-Technologies Group

    Overview:
    Bismuth (Bi), which is introduced either through the supply chain or by design, is becoming an inevitable element in lead-free electronic products. With the deliberation of all relevant parameters, theoretical and practical, Bi plays a “potent” role in electronic solder systems, which impact the performance and reliability of electronic package and assembly including solder joint performance, tin whisker mitigation, among others. The proper use of Bi can profoundly benefit the performance and reliability, and the improper use could degrade the performance and reliability. An adequate understanding of the property parameters of Bi is critical to product reliability. This webtorial will discuss the relevant aspects of Bi to help dispel misconceptions and to demonstrate performance criteria related to Bi. The webtorial will also highlight the distinction between Sn-based-Bi-containing alloys and Bi-based alloys. The goal is to help achieve the desired level of performance and product reliability. Your questions and issues for solutions and discussions are welcome.

    Main Topics for Part 1:

    • Your issues & concerns related to Bi
    • Bi - characteristics, resources, safety data
    • Bi effects in 63Sn37Pb solder joint
           Physical properties
           Mechanical behavior
    • Effects of Bi from component coating and PCB surface finish
           Dissolving into solder joint
           Estimation of concentration of Bi in solder joint
           Effect of compositional change
    • Bi effects in SAC solder joint (SnAgCuBi)
           Compositional change
           Stress vs. strain
           Fatigue behavior
    • Bi effects in other Pb-free alloys (SnCu, SnAg, SnAgIn)
           Stress vs. strain
           Fatigue performance

     

    Main Topics for Part 2:

    • Historically established Bi-containing electronic solder alloys
           Pb-containing
           Pb-free
    • Bi-containing Pb-free solder alloys
           Melting temperature range
           Compositional control level
           Physical, mechanical properties
           BGA thermal fatigue performance
    • Distincion between Sn-based-Bi-containing alloys and Bi-based alloys
    • Case study - PCB through-hole fillet-lifting vs. Bi
           Causes
           Solutions
    • Low temperature BiPbSn phase
           Presence or absence
           Thermograms
           Detectable or non-detectable effects
           General guidelines
    • Design limit in Pb-free solder joints vs. solder joint reliability
    • Concluding points

     

    Who Should Attend:
    The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.

     

    About the Instructor
    Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Stencil Printing Process and Solder Paste Inspection – An In-Depth Look

    Two (2) 90 minute Sessions
    April 18 and 19, 2018
    1:00pm to 2:30pm Eastern
    Presented by:  S. Manian Ramkurar, Ph.D., Center for Electronics Manufacturing and Assembly

    Rochester Institute of Technology

    Overview:
    The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included.

    Who Should Attend:
    ♦ Process, Design, Test and Quality Engineers
    ♦ Process and Quality Technicians
    ♦ Operators
    ♦ Managers


    After completing this course, you will be able to:
    1. Understand the stencil printing process and the process parameters, thoroughly.
    2. Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
    3. Evaluate materials such as paste, stencil and squeegee for efficient printing
    4. Understand the various solder paste constituents and types of paste
    5. Specify stencils, solder paste and printer requirements for various applications
    6. Understand Stencil construction and features for efficient paste transfer
    7. Understand squeegees and the recent advances in print technology
    8. Evaluate in-coming raw materials and procedure for qualifying vendors
    9. Understand the print process for adhesive applications

     


     

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Tin Whisker – All You Should Know

    Two (2) 90 minute Sessions
    May 17 and 18, 2018
    1:00pm to 2:30pm Eastern
    Dr. Jennie S. Hwang Presented by: Dr. Jennie S. Hwang, H-Technologies Group

    Overview:

    For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on relevant aspects of tin whiskers from both physical/phenomenal occurrence and fundamental scientific perspectives. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Tin whisker mitigating measures and their relative effectiveness will be highlighted. Your questions and issues for solutions and discussions are welcome.

    Main Topics for Part 1:

    • Definition & clarification;
    • Physical phenomena;
    • Reference point;
    • Causes and factors;
    • Concerns & impact;
    • Case Study.

    Main Topics for Part 2:

    • Reliability;
    • Test conditions;
    • Mitigation remedies;
    • Relative effectiveness of mitigating measures;
    • Plausible mechanism;
    • Tin whisker vs. tin pest;
    • Summary.

    Who Should Attend:
    The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.

    About the Instructor
    Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    SMT Process Fundamentals for Tin-Lead and Lead Free Assembly

    Two (2) 90 minute Sessions
    June 14 and 15, 2018
    1:00pm to 2:30pm Eastern
    Presented by:  S. Manian Ramkurar, Ph.D., Center for Electronics Manufacturing and Assembly

    Rochester Institute of Technology

    Overview:
    This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues.

    Who Should Attend:
    Who should attend?
    ♦ People with very little or no background in SMT
    ♦ Process, Design, Test and Quality Engineers
    ♦ Process and Quality Technicians
    ♦ Operators
    ♦ Marketing, Sales and Purchasing Staff
    ♦ Managers


    After completing this course, you will be able to:
    1. Identify various SMT components, their terminology and nomenclature
    2. Understand what a PCB is and also the need for effective thermal management
    3. Identify types of mixed technology PCB assemblies and their assembly sequence
    4. Understand the influence of design on the ease of manufacturing and assembly
    5. Understand thoroughly the entire assembly process and the various parameters that influence it.
    6. Understand the influence of various materials such as solder paste, adhesives, flux, etc.
    7. Detect assembly process defects and troubleshoot them.
    8. Evaluate equipment required for setting up assembly lines
    9. Understand Lead Free Implementation and Issues.

    Registrations are being taken through the SMTA Online Registration System.









    SMTA Webtorial:
    Fan Out Packaging- Technology Overview and Evolution

     

    Two (2) 90 minute Sessions
    July 17 and 18, 2018
    1:00pm to 2:30pm Eastern
    John Hunt Presented by: John Hunt, ASE (US) Inc.

     

    Overview:
    Mobile electronics has driven the need for ever increasing density and performance in electronics packaging. This has only accelerated with the advent of advanced smart phones and the burgeoning Internet of Things. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging, resulting in a wide variety of new packaging options.

    We will review how the integration of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into what is being called Fan Out Packaging. These packages are for both low density mobile and high density server applications. They have higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fan Out, Panel Level Fan Out, and Chip Last Fan Out packaging. All of these can combine low cost materials and varied process flows to create both simple devices, and more complex System in Package and Package on Package applications. This course will provide an overview of the drivers, technology, advantages and disadvantages of various structural options, as well as a view of potential future trends for Fan Out Packaging.

     

    Course Outline:
    1. Evolution to Fan Out
         a. WLCSP
         b. Fan Out
    2. Drivers for Fan Out
         a. Historical Drivers
         b. Advanced Drivers
    3. Definition of “Fan Out”
    4. Advantages of Fan Out
    5. Fan Out Market
         a. Forecast
         b. Low Density vs High Density
    6. Brief History of Fanout
         a. Early Variations
    7. 2D Fan Out Structures
         a. Low Density 2D Fan Out
         b. High Density 2D Fan Out
    8. Fan Out System in Package (SiP)
         a. Passive Components in Fan Out
         b. 3D Interconnectivity Structures
    9. 3D Fan Out Structures
         a. Low Density 3D Fan Out
         b. High Density 3D Fan Out
    10. Comparison of Fan Out Technologies
    11. Reliability Considerations
         a. Structural Reliability Variations
    12. Panel Fan Out
         a. Drivers
         b. Considerations

     

    Registrations are being taken through the SMTA Online Registration System.




    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819