Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
|Nov 25, 2019||
Webinar: Overcoming Challenging X-Ray Problems
|Dec 2, 2019||
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
Free Webinars (4 per year!)
One session lasting 60 minutes
Cost: Free for SMTA members
$95USD for non-members
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members
Two sessions lasting 90 minutes each (3 hours total)
Cost: $200USD for SMTA members
$300USD for non-members
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, firstname.lastname@example.org +1-952-920-7682.
If you are interested in presenting a webinar or webtorial, contact Jenny Ng, email@example.com +1-952-920-7682 or submit your abstract here.
Organized by SMTA Europe
Overcoming Challenging X-Ray Problems
Monday 25th November @ 2:30pm - 4:00pm UK Time
(9:30am - 11:00am US Eastern Time)
Presenter: Keith Bryant, Chairman SMTA Europe
As with all inspection technology, x-ray has to evolve to keep pace with the advances in components and products. Most recently, this has been driven by the continued reduction in board, device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components and dies becoming thinner and thinner. But we also see an increase at the other end of the spectrum with IGBTs, super capacitors and battery applications requiring high power and high-resolution images for Failure Analysis and inspection.
In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems. In particular, there is a new x-ray tube type that permits high magnification inspection at improved resolution yet retains high tube power and stability under these conditions, allowing good x-ray flux for inspection of the smallest features and excellent repeatability of measurements and auto inspections.
This presentation will look at various x-ray tube and detector types that are available and explain the implications of these choices in terms of what they provide for inspection regarding image resolution, magnification, tube power, and detector pixel size, amongst others. We will look at x-ray images at both ends of the spectrum, high power with high-resolution and low power with high-resolution, using IGBTs and LEDs as examples.
About the Presenter
A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.
QFN/LGA Design, Assembly Process Issues & Reliability Failures
Monday 2nd December @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with a low stand off which needs to be reflow soldered to a substrate can be a challenge but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.
Having had hands on experience with these parts since conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture.
Provided FREE with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.
- Design options to reduce failures
- Process improvements in design and assembly
- Void reduction
- Improvements in joint reliability
- Simple 5min solderability assessment
- Improved cleaning performance
- Results in cleaning and SIR on QFN packages
- Process results from vapour phase and convection reflow
- Solder joint reliability
- IPC design and process guidelines
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.
The webinar will run for between 60-90min with question and answer session. If you have a process example you would like covered in the webinar it will need to be provided in advance of the session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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