Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
|Nov 14 & 16, 2017||
Webtorial: Reflow - Understanding the Complete Process & Defect Prevention
|Dec 6 & 13, 2017||
Webtorial: X-Ray Inspection of PCBs
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
$75USD for non-members.*
$300USD for non-members.*
*The price of an individual membership is included in non-member registration.
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, firstname.lastname@example.org 952-920-7682.
If you are interested in presenting a webinar or webtorial, contact Jenny Ng, email@example.com 952-920-7682 or submit your abstract here.
Two (2) 90 minute Sessions
Reflow - Understanding the Complete Process & Defect Prevention
November 14 and 16, 2017
12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
Presented by: Bob Willis, bobwillis.co.uk
The session includes solder paste testing, different reflow methods, reliable solder joint formation on high and low temperature and causes and cures of most common failures. Here we examine the most common process issues seen in the industry and how design, board selection and process materials can cause issues in manufacture. We look at the fundamentals of reflow with convection and vapour phase to understand the cause of failures
With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses of most reflow issues see in industry. Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. Each delegate registered on the webinar will receive a free set of wall charts on reflow soldering and temperature profiling
If you have a specific process problems with reflow send it to Bob to include in the webinar.
Topics will include:
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division.
As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production.
Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection
Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck
In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA
Two (2) 90 minute Sessions
X-Ray Inspection of PCBs
December 6 and 13, 2017
1:00pm to 2:30pm Eastern
Presented by: Kamran Iqbal, Nikon Metrology and Bob Wetterman, BEST
This webinar series will focus on the x-ray inspection of printed circuit boards. This seminar will be taught by two subject matter experts, one coming from the vantage point of inspection as part of being a service provider and the other from an x-ray researcher who will come at the discussion from an imaging and machine capability standpoint.
With the ever increasing trend towards miniaturization and the use of components with non-visual inspect able criteria, x-ray as QC tool is becoming a necessity even to the Tier 1 PCBA assembly area. Devices with pads underneath the device such as QFNs, LCCCs and LGAs have become the most placed component body style. Without x-ray the inspection and quality inspection cannot be made. Couple this to other devices such as traditional BGAs and ever finer-pitch connectors and the need for x-ray imaging augmenting optical inspection is getting to be a necessity. Even older throughhole devices, with lead-free solders and large thermal masses will test the ability to create proper hole fill. Verification of this hole fill becomes increasingly necessary.
This webinar series will have the following overarching goals:
Who Should Attend:
Kamran Iqbal is currently a product manager with Nikon Metrology having experience with Nordson/Dage and Goepel Eectronics He also has experience in the automotive, medical and defense industries. He has extensive applications experience within the semiconductor industry, device packaging, SMT, Manufacturing, test and inspection. He holds both a bachelors and masters degree in engineering from the University of Bradford.
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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