SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Apr 17, 2019 FREE Webinar: Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment

Apr 29, 2019 Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys

May 20, 2019 Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process

Jun 4, 2019 FREE Webinar: Improving Reliability of Assemblies from a Soldering Materials Development Standpoint

Jun 17, 2019 Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions

Jul 15, 2019 Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process

Aug 12, 2019 Webinar: Conformal Coating - Successful Implementation & Quality Control

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Free Webinars (4 per year!)
One session lasting 60 minutes
Cost: Free for SMTA members
$95USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Webtorials:
Two sessions lasting 90 minutes each (3 hours total)
Cost: $200USD for SMTA members
$300USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org +1-952-920-7682 or submit your abstract here.






FREE Webinar:
Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment

Organized by SMTA India - Bangalore Chapter

Wednesday 17th April @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenters: Ansuman Das, Ph.D., MacDermid Alpha Electronics Solutions

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With the quantum of changes the electronics world has gone through in the past two decades, cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by today's industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.

 

About the Presenter

Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph.D. in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.

 









Webinar:
Flexible Circuit Board Design & Assembly with Lead-Free Alloys

Bob WillisMonday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process

Bob WillisMonday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









FREE Webinar:
Improving Reliability of Assemblies from a Soldering Materials Development Standpoint

Organized by SMTA India - Bangalore Chapter

Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: Shantanu Joshi, Koki Solder America Inc.

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.

 

About the Presenter

Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.

He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".

 

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions

Bob WillisMonday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process

Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Conformal Coating - Successful Implementation & Quality Control

Bob WillisMonday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819