SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Jun 8, 2020 Webinar: Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Jun 9, 2020 Webinar: Industry 4.0 for Electronics Assembly

Jun 10, 2020 Webinar: Supply Chain Impacts on the Electronics Industry in the Covid-19 Era

Jun 16, 2020 iNEMI/ Webinar: Proposed Testing Protocols to Align Connector Reliability with Application Requirements

Jun 18, 2020 Webinar: Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling

Jun 23, 2020 Webinar: Communicating With Impact and Developing Your Authentic Presence

Jun 24, 2020 Webinar: Solder Preform World - Not New Technology but a Very Interesting Option

Jun 30, 2020 Webinar: Problemas de Llenado de Barril: Causas Raices y Oportunidades que tenemos en nuestras manos

Jul 6, 2020 Webinar: Solderability Benchmarking, Failures & Production Testing Methods

Jul 8, 2020 Webinar: Systematic Failure Analysis

Jul 9, 2020 Webinar: Creating the Best Data Package for PCB Fabrication

Jul 21, 2020 Webinar: Human Automation: Hands-Free Industry 4.0

Aug 10, 2020 Webinar: Monitoring & Benchmarking Your Processes & Assembly Yields

Aug 26, 2020 Webinar: Learning to Lead, Leading to Learn

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Free Webinars (4 per year!)
One session lasting 60 minutes
Cost: Free for SMTA members
$95USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Webtorials:
Two sessions lasting 90 minutes each (3 hours total)
Cost: $200USD for SMTA members
$300USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org +1-952-920-7682 or submit your abstract here.






Webinar:
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Organized by SMTA Europe

Hosted by: SMTA Europe Chapter 

Monday 8th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Bob WillisPresenter: Bob Willis, SMTA Europe

Overview

Most of the industry worldwide has been running no clean processes for many years and often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation and the demands of modern circuits cleaning has come back to eliminate selected failures. Conformal coating is another process which has demanded special levels of surface cleanliness to guarantee coating adhesion and long-term reliability. Although there are high reliability producers that use coating with no clean, others want that extra confidence.

Topics included:

  • Testing boards, components and assemblies
  • International specifications and reference books
  • Ionic testing & non-ionic testing
  • Surface insulation measurement
  • Ion Chromatography (IC) test techniques
  • Shop floor test methods
  • Testing frequency during PCB fabrication & assembly
  • Cleanliness failure types

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Industry 4.0 for Electronics Assembly

Organized by SMTA Europe

Hosted by: SMTA Europe Chapter 

Tuesday 9th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenters: Liam Mills (MTC), Stuart Saunders (MTC) & Nigel Burtt (Renishaw)

Free for members!

Overview

Improving operational efficiencies has reached the point where only marginal gains can be achieved and therefore full business system and process transformations are required in order for businesses to stay competitive. Increased autonomy, connected devices & data, and digitalisation must be leveraged by businesses to become more agile and efficient, and by utilising the data and autonomy effectively this can lead to increased productivity, increased flexibility of products and reduced product quality variability. Businesses are at different stages on their Industry 4.0 journeys and there are a number of solutions available on the market to support businesses. In partnership with its members, the Manufacturing Technology Centre (MTC) in the UK has been implementing a Smart Factory demonstration test bed for Electronics Assembly, where upgrading legacy equipment with smart capability has been the primary focus, using these off-the-shelf solutions where possible, and open source tools like the IPC-CFX standard as the machine to machine communication language, that can save huge amounts of time and investment.

Topics included:

  • Overview of the MTC
  • Overview of Industry 4.0
  • IPC-CFX and Hermes
  • Focus on Smart Factory for legacy equipment
  • Future project opportunities

Who should attend?
Production Engineering, Process Engineering, Business Improvement, Continuous Improvement, Automation Engineering, Digital Engineering/Transformation Engineers.

The webinar will run for between 30-45min with question and answer session. The webinar is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Supply Chain Impacts on the Electronics Industry in the Covid-19 Era

Free for Everyone!
Register Now

Hosted by: SMTA Puget Sound Chapter

Wednesday, June 10th @ 1:00pm US Eastern Time

BaffiPresenter: Robert Baffi, Arrow Account Manager 

Overview

Presenting on the market impacts COVID-19 has had and the impact on the future of supply chain overall.

About the Presenter

Arrow Account Manager Robert Baffi will provide us with context regarding the current component market. Robert comes to us with a total of 10 years’ experience in developing and selling technology solutions with 5 years’ of direct experience in the electronic components space in the PNW (2 years as a manufacturers rep and three as a distributor at Avnet). In his current role within Avnet, he's responsible for supporting customers at each stage of the product life cycle. From idea to design and from prototype to production. Avnet’s comprehensive portfolio of design and supply chain services makes Avnet the go-to guide for innovators who set the pace for technological change, especially during the uncertain business land scape COVID-19 provides.

 

 

Registrations are being taken through a third party - Register Now.









iNEMI/SMTA Webinar:
Proposed Testing Protocols to Align Connector Reliability with Application Requirements

Free for Everyone!
Register Now

Tuesday, June 16 @ 11:00am US Eastern Time

Presenter: Vincent C. Pascucci, TE Connectivity’s Aerospace, Defense, and Marine Business Unit

Co-Hosted by iNEMI

 

Overview

Since the 1980s there has been enormous growth in the use of electronic devices which has driven similar, if not greater, growth in the number of electrical interconnects. As we become more dependent on these devices the need to ensure their reliability becomes more important. Two factors complicate this effort. The first is the reduction in size of electrical contacts and the commensurate reduction in contact normal force available to ensure a stable interface. The other factor is that reliability is not free. Thus, as the number of interconnects increases, cost considerations drive a need to ensure the reliability of connectors is matched to the needs of their specific applications. Testing protocols to help achieve this match will be discussed in this presentation. 

 

About the Presenter:

Vincent C. Pascucci is Senior Principal Engineer, managing the Failure Analysis and Reliability Engineering group within TE Connectivity’s Aerospace, Defense, and Marine business unit. He has worked with TE Connectivity, and previously AMP, since 1984.

Vincent serves as US Technical Advisor to IEC committees TC48 and SC48B and covenor (chair) of SC48B Working Group 5 responsible for electrical and electronic connector testing standards. He has authored papers on connector reliability topics presented at IEEE Holm and American Society for Quality conferences, along with the International Conference on Electrical Connectors, and others.

He is an American Society for Quality Certified Reliability Engineer and a graduate of the University of Rochester with degrees in Mechanical and Geomechanical Engineering. 

Registrations are being taken through a third party - Register Now.









Webinar:
Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling

Free for Everyone!
Register Now

Hosted by: SMTA Atlanta Chapter

Thursday, June 18th @ 4:00pm US Eastern Time

Presenter: Francy Akkara, Auburn University

Overview

Reliability of the new solder alloys has been a serious concern, especially in the harsh environment. Aging at elevated temperature alters the structural and mechanical properties of the solder joint and leads to the coarsening of the precipitates in the bulk solder and growth of the intermetallic compound layer, which in turn deteriorates the solder joint.  Various new elements such as bismuth, antimony, and nickel are micro-alloyed into the SnAgCu based alloys to slow down this deterioration process and improve the reliability. There haven’t been many studies about the effect of solder sphere alloys with bismuth pastes on the harsh thermal reliability. In this paper, the effect of mixing solder sphere alloys (SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.  Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to +125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres.   

About the Presenter:

Francy Akkara is pursuing his doctoral degree in Industrial and Systems Engineering at Auburn University. He has been working on electronics reliability for the past four years with focus on component reliability in thermal cycling. Francy has Masters degree in Electrical Engineering (Microelectronics) from Auburn University and is currently interning at Western Digital as  RAMP SSD Assembly Development Engineer. His research interests include reliability test design, effect of solder alloy composition and surface finishes, failure analysis, thermal cycling/mechanical shock reliability and defects in SMT assembly.

Registrations are being taken through a third party - Register Now.









Webinar:
Communicating With Impact and Developing Your Authentic Presence

Free for Everyone!

Tuesday, June 23rd @ 11:00am US Eastern Time

Stephanie GoetzPresenter: Stephanie Goetz, Goetz Communications

Overview

The way you communicate and how you're perceived have a much bigger impact on your bottom line and your leadership than you think. But the good news is these are skills that anyone can refine and master with proper training and practice. In this webinar, you'll learn the best techniques of excellent communication and influential presence from renowned communication expert Stephanie Goetz of Goetz Communications. Stephanie coaches C-suite leaders and executives at Fortune 500 companies on how to be more dynamic, influential and impactful. You'll learn the skills of influencing your team, leading people in turbulent times, and the keys to having lasting influence.  

About the Presenter:

Stephanie Goetz is an award-winning journalist, executive speaker coach, pilot, philanthropist, and professional trainer. This Emmy-nominated broadcaster anchored and reported more than 5,000 newscasts at NBC, CBS, and ABC affiliates over 10 years. She is the founder and owner of Goetz Communications where she works with C-suite leaders, top executives and all walks of life to develop communications skills, media training, brand influence, and speaker effectiveness in preparing them for engagements with any size of audience. Her client list includes Fortune 500 companies like Microsoft,  Nike, T-Mobile, Cessna Aircraft, Thomson Reuters, Northwestern Mutual, Mastercard and more.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Solder Preform World - Not New Technology but a Very Interesting Option

Organized by SMTA Europe
Register Now

Wednesday, 24th June @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)Bob Willis

Presenter: Bob Willis, SMTA Europe and Graham Wilson, Indium Corporation

Overview

Solder preforms are normally solid solder shapes specifically designed to make one or multiple solder joints in one reflow operation. Solder preforms can be coated, flux laminated between layers of different alloy or simply compressed cored solder wire. In the distant past some assembly operations have simply employed cored wire wrapped around a screwdriver or knitting needle and cut to form rings. Now preforms are incredibly engineered options which are as wide as your imagination

Preforms provide a defined volume of solder to form a reliable joint with the assembly process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms

Back in the day the presenter used preforms with vapour phase and hot air guns for feed through capacitors, wire wrap back planes, heat shields and cable forms. Welcome to the interesting and creative world of solder preforms

Our first preform webinar includes:
Soldering Applications
Solder alloys
Preform types
Fluxing options
Preform packaging
Soldering and temperature profiling
Reducing void formation
Traditional soldering, wire connections, die mounting & more
Inspection and process defect

 

Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities
Mind – Better Mental Health  https://www.mind.org.uk/donate
Marie Curie – Living with Terminal Illness https://www.justgiving.com/mariecurie

Registrations are being taken through a third party - Register Now.









Webinar:
Problemas de Llenado de Barril: Causas Raices y Oportunidades que tenemos en nuestras manos

Free for Everyone!

*This webinar will be presented in Spanish*

Tuesday, June 30th @ 11:00am US Eastern Time (date/time is tentative)

Presenter: Omar Garcia, Flex

Overview

Los problemas de llenado de barril son cada dia mas complejos, en ensambles muy grandes con cientos de THs complican el soldado uniforme. Ensambles con mas capas/layers, conexiones internas, Capas mas gruesas de Cu internas de tierra y problemas de balance de Cu que los diseñadores no pueden compensar, dificultan en gran medida el llenado de barril con los procesos acuales. La ventana de proceso cada dia es mas pequeña dificultando la repetibilidad de los procesos de soldado que utilizados.
La intencion de este webinar es darte un punto de vista diferente en lo que podemos hacer que este en nuestras manos para incrementar la ventana de proceso de nuestro proceso.


Barrel fill issues are becoming every day more complex, Large assemblies with hundreds of TH quantities in large assemblies create a problem with the soldering uniformity. More # of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current soldering processes narrowing process window and reduce process repeatability currently in use. This webinar intention is to give you a different point of view in regards what we can do to improve our current process window.

About the Presenter:

Omar currently works in Flex as Operations Engineering Director, working for AME (Advanced Manufacturing Engineering) for the America region. He provided technical support to all operations and implemented all new technologies in Flex for several customers.

He has been at Flex for last 12 years and been in the electronic industry for almost 22 Years; worked as a Technical Assistance Manager at Jabil for 3 years & as NPI Manager for Sanmina-SCI for close to 7 years

Omar has Mechanical Engineering degree from ITM (Instituto Tecnológico de Morelia). He also hold a Master degree in Metallurgy and Material Science by IIM (Instituto de Investigaciones Metalúrgicas) from the Universidad Michoacana. He is certified as a Six Sigma Black and has earned his certification as an SMTA Process Engineer. 

He participate at several SMTA regional events, also has participation at APEX as speaker, with different papers, holds 4 patents for Flex

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Solderability Benchmarking, Failures & Production Testing Methods

Organized by SMTA Europe

Monday, 6th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)Bob Willis

Presenter: Bob Willis, SMTA Europe

Overview

The webinar provides an introduction and a better understanding of the soldering process and the effect of poor solderability on modern manufacture. Surface mount components can be a problem area, as are some of the surface finishes used on printed circuit boards. The online session aims to provide a basic understanding of solderability failure including ageing, test methods, both theoretical and practical, for circuit boards and components. It also shows how to test BGAs, LGA, CSP, PoP and flip chip packages on the shop floor in 10min

The webinar gives practical hands-on experience of solderability testing of different solder finishes and assessment of results. Using the instructor’s unique video material many process faults will be demonstrated. In process testing non laboratory testing is illustrated as well as the correlation with real process conditions.

Webinar Content:

  • What is solderability ?
  • Component and printed board storage life
  • Storage conditions for longer life
  • Artificial ageing tests and impact on yields
  • International specifications and test methods
  • Cost of Gold, Copper, Palladium, Silver, tin etc
  • Protective coatings and effects of soldering operations
  • Solderability reflow wetting patterns
  • Solderability tests:

                Dip and inspect, wetting balance, rotary dip test

                Simple production reflow test methods and criteria

                Wetting balance measurements

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Systematic Failure Analysis

Organized by SMTA Europe

Hosted by: SMTA Europe Chapter 

Wednesday 8th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Stefan Strixner, ZESTRON Europe

Free for members!

Stefan StrixnerOverview

In case of malfunctions of electrical assemblies in the field a proper failure analysis to identiy its root cause and define future avoiding measures is mandatory. This presentation will give each delegate a step by step practical procedure to execute a proper failure analysis and introduces meaningful examination methods on field cases.


Topics included:
•    Definition: "Failure/Damage"
•    Field cases
•    Methodology for Arranging and Systematical Processing of Information for the Damage Event
•    Practical tips
•    Potential Examination methods
•    Data Collection
•    Hypotheses and Key Figures
•    Practical Examples

 

Stefan Strixner has a Master of Science in Technical Chemistry and supports customers since foundation of ZESTRON. He has supported the implementation of hundrets of post soldering cleaning process and consults and trains partners and ZESTRON subsidiaries in Europe and Asia in terms of cleanliness, reliability and failure analysis.

 

The webinar will run for between 60-90min with question and answer session. The webinar is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Creating the Best Data Package for PCB Fabrication

Free for SMTA & PCEA Members!

In association with: PCEA (Printed Circuits Electronics Association)

PCEA

Thursday, July 9th @ 11:00am US Eastern Time

Presenters: Stephen Chavez, Collins Aerospace & Mike Creeden, Insulectro

Overview

With this presentation attendees will learn what it takes to create a good manufacturing Data Package. A good data package starts with having good circuit data. Today’s circuit engineer must meet 3 Competing Perspectives for Success.  

Design For:

  • DFSolvability
  • DFPerformance
  • DFManufacturability

One must understand the end user’s requirements. These include cost targets, build quantities, performance, environment, testing, compliance, quality, and reliability goals. Manufacturing support starts with a partnership between your company and your supply chain. Early collaboration ensures that all expectations and requirements are established at the beginning of the development phase, prior to design completion. All these issues play a part of the design, manufacturing and performance of our end products.

Attendees will receive an understanding of how to create good design-data, allowing for manufacturing tolerance allowances. The goal is to ensure that the design data is correct by construction, can be manufactured with high producibility, high-yield, low-cost, and high-reliability.

Formats:

• Standard, non-intelligent data, such as Gerber files, NC Drill data, NC Rout Profile, Multi-up Array information; Fabrication & Assembly Drawings with all applicable materials, processes, manufacturing tolerances and acceptance criteria.

• ODB++ or IPC-2581 – Intelligent data output (With controlled settings).

Creation of manufacturing output should be a tightly controlled and accurate event providing exactly what the manufacturer needs to complete the build. 

About the Presenters:

Mike has over 43 years of industry experience: as an Educator, PCB designer, applications engineer and business owner.  

• Insulectro - Technical Director Design Education; helping OEM’s & fabricators to achieve design success for best material utilization  

• Executive Board, Vice Chairman - PCEA Printed Circuit Engineering Association

• Master Instructor CID+ IPC Designer Certification program 

• Primary Contributor for the CID+ curriculum 

• Currently teaching IPC-CID/CID+ curriculum with EPTAC  

• Founder of San Diego PCB Designs (Nationally recognized design center, sold in 2016) 

Steph Chavez

 

 A senior-level Printed Circuit Engineer with 29 years’ experience, Stephen Chavez has spent the last 10 years as a Staff Engineer and Technical Lead of PCB design for the Electronic Systems Center (ESC) division of Collins Aerospace. He is an acknowledged and recognized Subject Matter Expert (SME) in PCB design globally within the industry, and within Collins Aerospace. He is the Chairman of the PCEA, an IPC Certified Master Instructor Trainer (MIT), and an IPC Certified Advanced PCB Designer (CID+) for PCB Design. He has been an active IPC member and an industry contributor since 2003. He created an industry column in both Iconnect007 (PCBDesign007) magazine called “The Digital Layout” and in UP Media (Printed Circuit Design & Fabrication) magazine called the “The Digital Route”. As Chairman of PCEA, he continues to write under both these two columns, but under the sections “Message From The Chairman”. He has a very strong and extensive background regarding PCB design within the diverse fields of commercial, aerospace, military, space and medical electronics industries. He has Principal level industry experience which covers the full spectrum of PCB design, fabrication, and assembly. His experience ranges from simple two layer prototypes through complex multi-layer HDI and micro HDI technology PCBs where the structures ranged from rigid, flex, rigid-flex, and hybrids, with circuits containing analog, digital, RF, mixed signal, high speed, high power, and high voltage PCBs. He is a veteran of the United States Marine Corps, where he served five years as an Avionics Technician, and holds an A.S. degree in mathematics.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Human Automation: Hands-Free Industry 4.0

Free for Members!

Tuesday, July 21st @ 11:00am US Eastern Time

Michael FordPresenter: Michael Ford, Aegis Software, UK

Overview

So many examples already exist of the utilization of Augmented Reality (AR), as it relates to assembly manufacturing operations. The vast majority of these are demos, carefully and painstakingly crafted to show the potential of the technology. Others are somewhat niche cases of real applications, again however, supported by significant customization and preparation behind the scenes, for each and every application instance.

This is only the first step however for Augmented Reality technology, which has a central part to play in our standards-driven Industry 4.0 Smart digital factory. AR provides hands-free, fully focused assembly support, when properly integrated into the latest digital MES tools. Providing interactive step by step guidance, allows operators to be fully flexible, without the need to be experts or specifically experienced in what they are doing.

This presentation details how AR technology available today, is to be a critical part of any Smart digital Industry 4.0 factory, sooner than you may think.

About the Presenter:

Working for Aegis Software, provides Michael the opportunity to apply his years of electronics assembly manufacturing experience, to drive both business process and technology solution innovation with customers and partners, that satisfies evolving needs in digital manufacturing, in a way that is value-driven and sustainable.

Starting his career with Sony, including eight years working in Japan, Michael has been instrumental in creating and evolving leading software solutions for assembly manufacturing, that meet the most demanding expectations, leading industry forward.

Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to IPC industry standards, including the Connected Factory Exchange (CFX) and IPC-1782 traceability standard, as well as helping promote and position others that together form IPCs digital manufacturing “best practices”. Michael regularly contributes articles, columns and blogs in several leading industry publications.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Monitoring & Benchmarking Your Processes & Assembly Yields

Organized by SMTA Europe

Bob Willis

Hosted by: SMTA Europe Chapter 

Monday, 10th  August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

There are no easy methods for companies to compare their manufacturing yields with other similar businesses. A common question asked by many company managers is "How does my process compare with other companies in terms of yield"? The information does not exist or is not easily available to small and medium volume companies

The most commonly used method of illustrating yield is Part Per Million (PPM) Defective. This provides a measure of the defect level against a process stage or a specific product compared against a known number of opportunities for defects to occur. There are IPC and IEC documents and procedures which do exist to monitor a process. This webinar will show how to implement a defect monitoring project in your company and the yield data produced. Bob Willis ran the SMART Group PPM Monitoring project supported by DTI and helped implement the LEADOUT project. these were the first project or their type in the world

Topics included in our webinar:

  • Why monitor your process for yield?
  • PPM, DPM or DPU
  • Collecting Inspection Data
  • Screen Printing
  • Inspection Criteria
  • Common Defects
  • Component Placement
  • IPC Inspection Criteria
  • Reflow Soldering
  • IPC Inspection Criteria
  • Wave Soldering
  • Collaborative Data Collection
  • Assembly Types
  • Comparing company yields

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Learning to Lead, Leading to Learn

Free for Everyone!

Wednesday, August 26 @ 12:00pm US Eastern Time

Presenter: Katie Anderson, KBJ Anderson Consulting

Overview

Katie Anderson will share insights and practices about leadership and learning – and challenge you to set your intention for your personal improvement. Katie will provide you with examples from the forthcoming book “Learning to Lead, Leading to Learn” – the result of years of conversations between her and Isao Yoshino, a 40-year Toyota leader and John Shook’s first manager at Toyota - and both of their practices as leaders, coaches, and learners. In this session you will:

• Understand the three principle roles of a leader

• Hear stories and quotes that appear in the book , "Learning to Lead, Leading to Learn: Lessons from Toyota Leader Isao Yoshino on a Lifetime of Continuous Learning".

• Discover three practices that can help you become a more intentional people-centered leader

• Set your intention for practice for personal improvement.

About the Presenter:

Katie Anderson is an internationally recognized leadership coach, consultant, and professional speaker, Katie is best known for her focus on helping individuals and organizations lead with intention. In 2013, Katie launched KBJ Anderson Consulting to work with leaders at all levels and organizations of all sizes to connect and align their purpose, process, and practice to achieve higher levels of performance. Katie has lived in five countries outside the United States – including the UK, Australia, and Japan. It was during her family’s 18-month experience in Japan that she developed a professional relationship with 40 year Toyota leader Isao Yoshino. What began as a connection filled with deep conversations evolved into the forthcoming book, Learning to Lead, Leading to Learn: Lessons from Toyota Leader Isao Yoshino on a Lifetime of Continuous Learning. Katie retains a strong connection to Japan and regularly leads study trips to Japan for leaders looking to deepen their knowledge of lean practices and Japanese culture. Visit www.kbjanderson.com - or email Katie directly at katie@kbjanderson.com.

Registrations are being taken through the SMTA Online Registration System.




Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


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  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone +1 952.920.7682
    Fax +1 952.926.1819