SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Feb 10, 2020 Webinar: PCB Outgassing and How to Test Bare or Assembled Boards

Mar 16, 2020 Webinar: BGA & Area Array Failures, Causes & Corrective Actions

Apr 6, 2020 Webinar: Reflow Simulation – X-ray & Optical Help Solves Design & Process

Apr 7, 2020 FREE Pre-Conference Webinar: Harsh Environment Failure - Causes & Cures

May 4, 2020 Webinar: Ball Grid Array Rework – How to Do It Successfully

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Free Webinars (4 per year!)
One session lasting 60 minutes
Cost: Free for SMTA members
$95USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Webtorials:
Two sessions lasting 90 minutes each (3 hours total)
Cost: $200USD for SMTA members
$300USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org +1-952-920-7682 or submit your abstract here.






Webinar:
PCB Outgassing and How to Test Bare or Assembled Boards

Organized by SMTA Europe

Bob WillisMonday 10th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Printed circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There are some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!

Topics include:

  • Outgassing from vias, through holes and solder masks

  • How to test samples in manufacture

  • Test method procedures

  • Type of defects and how they can appear with tin/lead and lead-free alloys

  • Void formation in wave selective and PIHR joints

  • Correct specification of your boards

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
BGA & Area Array Failures, Causes & Corrective Actions

Organized by SMTA Europe

Bob WillisMonday 16th March @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Ball Grid Array or area array packages have been used in the industry for many years and are widely available for commercial and military applications. Everyone blames the BGA for failure, often because you can’t see under the package but is it the real failure in your process?  Bob will outline the correct assembly process, the most common failure modes and corrective action. Just like surface mount, the use of BGAs can affect printed board layout, assembly, inspection and repair process. However, BGAs provide significant advantages over fine pitch components on assembly yield.

Topics include:

  • Modern Lead-Free Assembly Processes

  • Issues with Plastic BGA, Ceramic BGA, Column Grid Array, Land Grid Arrays

  • Lead-free and tin/lead paste

  • Moisture cracking

  • Effect of incorrect profiling

  • Head in or on Pillow

  • Secondary reflow

  • Hot tearing of joints

  • Voiding in solder joints

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Reflow Simulation – X-ray & Optical Help Solves Design & Process

Organized by SMTA Europe

Bob WillisMonday 6th April @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Reflow defects can be examined and eliminated in manufacture by following some simple steps. Often companies have all the equipment and materials on site to solve process issues very quickly. Bob will illustrate how using optical and x-ray reflow simulation you can examine area array, pin in paste, Package on Package & Underfill failures

 
With over 30 years’ experience solving assembly and soldering defects Bob Willis will show you how using video simulation you can demonstrate defects happening in real time. The information captured can help prove the root cause of process defects and product failures

 

Topics included in our webinar:

  • Benefits of video simulation
  • How to conduct reflow simulation
  • What equipment have you got onsite
  • Planning your tests
  • Recording results
  • Type of defects examined

 

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

 

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









FREE Pre-Conference Webinar:
Harsh Environment Failure - Causes & Cures

Organized by SMTA Europe Chapter
Register Now

Tuesday 7th April 2.30pm UK Time (10:30am US Eastern Daylight Time)

Join Keith Bryant & Bob Willis to find out more about the demands on Electronics in Harsh Environments as they showcase the challenges faced by design and process engineers worldwide including some of the key issues that are faced in Power Electronics, Automotive, High Voltage, Assembly and High Reliability Products.

For the fourth year running SMTA Europe will present the Electronics in Harsh Environments Conference and Exhibition 21-23 April 2020 in Amsterdam, Netherlands. For more information visit https://www.smta.org/harsh.

Still unsure if you should be in Amsterdam or need more info to convince your boss? This webinar provides an ideal way of seeing in advance some of the people you will meet and things you will learn from industry experts, plus you will be able to show examples of what you have learned on the different failure modes in electronics.

By attending this FREE webinar, you also have the opportunity of winning a FREE pass to attend one day of the conference plus a FREE copy of High Temperature Soldering Wall Charts.

Topics include:

  • High Temperature
  • Condensing Environments
  • Water Immersion
  • Mechanical Strain
  • Corrosive Environments

The webinar lasts between 30-45min and you will receive a copy of the slides in pdf from each presenter after the webinar.

Registrations are being taken through a third party - Register Now.









Webinar:
Ball Grid Array Rework – How to Do It Successfully

Organized by SMTA Europe

Bob WillisMonday 4th May @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Surface mount and BGA rework and repair can be straight forward if simple rules are followed. This presentation will give each delegate a step by step blueprint to introduce rework successfully into manufacture. Guidelines will be given on selecting rework equipment, materials and training procedures for defect free soldering. Bob Willis was the creator of the world's first video tapes and interactive CD-ROM on BGA Technology, X-Ray Inspection and BGA Rework which are sold worldwide by IPC and SMTA

  

Topics included:

  • Introduction to rework, where and why rework
  • Soldering standards & defects, IEC, IPC, BT standards
  • Temperature profiling rework sites
  • Rework methods for:
  • BGA, CSP and other area array package
  • Hot gas/IR systems
  • Rework of single/double sided boards
  • Reballing BGA
  • Rework related defects

 

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
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    Phone +1 952.920.7682
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