SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Dec 6 & 13, 2017 Webtorial: X-Ray Inspection of PCBs

Jan 29, 2018 Webinar: Moving from "F" to "G"- Changes to IPC A-610/J-STD-001

Feb 13 & 15, 2018 Webtorial: Fan Out Packaging- Technology Overview and Evolution

Looking for a past webinar? Check the knowledge base.

Webinar vs Webtorial: What's the Difference?


  • One session lasting 60 to 90 minutes.
  • Covers introductory concepts or broadly covers multiple topics.
  • Comparable to a conference session.
  • Cost: Free for SMTA members
    $75USD for non-members.*


  • Two sessions lasting 90 minutes each.
  • In depth, focused topics with demos and working examples.
  • Comparable to a tutorial.
  • Cost: $200USD for SMTA members
    $300USD for non-members.*

    *The price of an individual membership is included in non-member registration.

    Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

    If you have any questions, contact Ryan Flaherty, 952-920-7682.

    If you are interested in presenting a webinar or webtorial, contact Jenny Ng, 952-920-7682 or submit your abstract here.

    SMTA Webtorial:
    X-Ray Inspection of PCBs

    Two (2) 90 minute Sessions
    December 6 and 13, 2017
    1:00pm to 2:30pm Eastern
    Presented by: Kamran Iqbal, Nikon Metrology and Bob Wetterman, BEST

    This webinar series will focus on the x-ray inspection of printed circuit boards. This seminar will be taught by two subject matter experts, one coming from the vantage point of inspection as part of being a service provider and the other from an x-ray researcher who will come at the discussion from an imaging and machine capability standpoint.

    With the ever increasing trend towards miniaturization and the use of components with non-visual inspect able criteria, x-ray as QC tool is becoming a necessity even to the Tier 1 PCBA assembly area. Devices with pads underneath the device such as QFNs, LCCCs and LGAs have become the most placed component body style. Without x-ray the inspection and quality inspection cannot be made. Couple this to other devices such as traditional BGAs and ever finer-pitch connectors and the need for x-ray imaging augmenting optical inspection is getting to be a necessity. Even older throughhole devices, with lead-free solders and large thermal masses will test the ability to create proper hole fill. Verification of this hole fill becomes increasingly necessary.

    This webinar series will have the following overarching goals:

  • Understand the most important specifications in procuring a modern x-ray machine
  • Understand how x-ray inspection is used to inspect a variety of electronic component body styles including leadless devices, area array devices, high density connectors, throughhole connections and standard SMT components
  • Understand how x-ray inspection is used for inspection, defect analysis and troubleshooting in the SMT process
  • Understand how industry standards tie in with the use of x-ray inspection

    Who Should Attend:

  • SMT assembly process engineers and technicians responsible for production or new product introduction processes
  • SMT quality personnel interested in helping improve end-of-line yields and identifying root causes of failures
  • OEM supply chain engineers responsible for supporting and/or assessing SMT assembly contractors
  • Engineers and technicians just entering the SMT field who want to master the science and art of x-ray inspection

    Kamran Iqbal Kamran Iqbal is currently a product manager with Nikon Metrology having experience with Nordson/Dage and Goepel Eectronics He also has experience in the automotive, medical and defense industries. He has extensive applications experience within the semiconductor industry, device packaging, SMT, Manufacturing, test and inspection. He holds both a bachelors and masters degree in engineering from the University of Bradford.

    Bob Wettermann Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webinar:
    Moving from "F" to "G"- Changes to IPC A-610/J-STD-001

    January 29, 2018
    1:00pm-2:00pm Eastern
    Presented by: Norman Mier, BEST

    Complimentary Webinar for Members!

    This webinar discusses at a high level the newest versions of the IPC A 610 (Acceptability of Electronic Assemblies) and the companion J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies) specifications which came out late in 2017. Heading in to the new year there will be some changes in inspection criteria and board assembly process specifications. The IPC-A-610 document is one of the most widely-circulated by the electronics assembly industry. It defines the acceptance standard for assembled boards. The companion JSTD-001 is a document describing how boards should be assembled. Both of these document shave been "up-rev'd" to version "G" from version "F" effective November 2017.

    Both documents most significant and important changes will be highlighted in this session.

    If you have already purchased your copy of revision "G" of both documents then please e-mail specific questions to Norman ahead of time so that your issue, time allotting can be addressed in this one-hour session.

    Intended Audience:
    Process engineers, QC inspectors, designers and procurement personnel all use the IPC-A-610 document and could find use in the review of the new documents. IPC trainers within companies will also find some good information as they prepare for their new 2018 certification classes.

    Topics will include:

  • New figures in tables and acceptance criteria updates in Butt/I Cconenctions (610)
  • Cross referenced and added applicability of both MIL and international standards for worldwide acceptance (JSTD)
  • New figures and requirements for various cable configurations (JSTD)
  • Variety of criteria for various SMT components was updated (JSTD, 610)
  • Scope and purpose sections updated as well as an objective section were added (JSTD)
  • Wiring section changes were made to variety of topics (610)
  • Changes to supported hole acceptance criteria including but not limited to solder conditions and meniscus in solder (610)

    Norman Mier Bio:
    Norman Mier is a U.S. Marine Corp. retired veteran with over 20 years of experience in the electronics rework and repair industry. He received his training through the Navy's Micro Miniature (2M) Electronic Repair Program. He has progressed through every level of rework and repair recognized in the industry. Norman has also earned the highest certifications awarded by IPC in electronics training, being certified as a Master Instructor in IPC A-610, IPC J-STD-001D, IPC/WHMA-A-620 and IPC 7711/7721.

    He has worked through BEST for several electronics industry leaders and created tailored courses for their equipment. This also includes providing training to technicians and engineers in surface mount and advanced surface mount technology. The knowledge Norm has brought to these companies has been invaluable to their process improvement efforts. His skill has also been a major factor in keeping BEST training at the forefront in the electronics-training field. He has taught several sessions at local and international conferences as part of APEX, SMTA International.

    Registrations are being taken through the SMTA Online Registration System.

    SMTA Webtorial:
    Fan Out Packaging- Technology Overview and Evolution

    Two (2) 90 minute Sessions
    February 13 and 15, 2018
    1:00pm to 2:30pm Eastern
    John Hunt Presented by: John Hunt, ASE (US) Inc.

    Mobile electronics has driven the need for ever increasing density and performance in electronics packaging. This has only accelerated with the advent of advanced smart phones and the burgeoning Internet of Things. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging, resulting in a wide variety of new packaging options.

    We will review how the integration of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into what is being called Fan Out Packaging. These packages are for both low density mobile and high density server applications. They have higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fan Out, Panel Level Fan Out, and Chip Last Fan Out packaging. All of these can combine low cost materials and varied process flows to create both simple devices, and more complex System in Package and Package on Package applications. This course will provide an overview of the drivers, technology, advantages and disadvantages of various structural options, as well as a view of potential future trends for Fan Out Packaging.

    Course Outline:
    1. Evolution to Fan Out
         a. WLCSP
         b. Fan Out
    2. Drivers for Fan Out
         a. Historical Drivers
         b. Advanced Drivers
    3. Definition of “Fan Out”
    4. Advantages of Fan Out
    5. Fan Out Market
         a. Forecast
         b. Low Density vs High Density
    6. Brief History of Fanout
         a. Early Variations
    7. 2D Fan Out Structures
         a. Low Density 2D Fan Out
         b. High Density 2D Fan Out
    8. Fan Out System in Package (SiP)
         a. Passive Components in Fan Out
         b. 3D Interconnectivity Structures
    9. 3D Fan Out Structures
         a. Low Density 3D Fan Out
         b. High Density 3D Fan Out
    10. Comparison of Fan Out Technologies
    11. Reliability Considerations
         a. Structural Reliability Variations
    12. Panel Fan Out
         a. Drivers
         b. Considerations

    Registrations are being taken through the SMTA Online Registration System.

    Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.

  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819