Webinars and Webtorials
Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.
Upcoming Webinars and Webtorials
|Dec 6 & 13, 2017||
Webtorial: X-Ray Inspection of PCBs
|Jan 29, 2018||
Webinar: Moving from "F" to "G"- Changes to IPC A-610/J-STD-001
|Feb 13 & 15, 2018||
Webtorial: Fan Out Packaging- Technology Overview and Evolution
Looking for a past webinar? Check the knowledge base.
Webinar vs Webtorial: What's the Difference?
$75USD for non-members.*
$300USD for non-members.*
*The price of an individual membership is included in non-member registration.
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, firstname.lastname@example.org 952-920-7682.
If you are interested in presenting a webinar or webtorial, contact Jenny Ng, email@example.com 952-920-7682 or submit your abstract here.
Two (2) 90 minute Sessions
X-Ray Inspection of PCBs
December 6 and 13, 2017
1:00pm to 2:30pm Eastern
Presented by: Kamran Iqbal, Nikon Metrology and Bob Wetterman, BEST
This webinar series will focus on the x-ray inspection of printed circuit boards. This seminar will be taught by two subject matter experts, one coming from the vantage point of inspection as part of being a service provider and the other from an x-ray researcher who will come at the discussion from an imaging and machine capability standpoint.
With the ever increasing trend towards miniaturization and the use of components with non-visual inspect able criteria, x-ray as QC tool is becoming a necessity even to the Tier 1 PCBA assembly area. Devices with pads underneath the device such as QFNs, LCCCs and LGAs have become the most placed component body style. Without x-ray the inspection and quality inspection cannot be made. Couple this to other devices such as traditional BGAs and ever finer-pitch connectors and the need for x-ray imaging augmenting optical inspection is getting to be a necessity. Even older throughhole devices, with lead-free solders and large thermal masses will test the ability to create proper hole fill. Verification of this hole fill becomes increasingly necessary.
This webinar series will have the following overarching goals:
Who Should Attend:
Kamran Iqbal is currently a product manager with Nikon Metrology having experience with Nordson/Dage and Goepel Eectronics He also has experience in the automotive, medical and defense industries. He has extensive applications experience within the semiconductor industry, device packaging, SMT, Manufacturing, test and inspection. He holds both a bachelors and masters degree in engineering from the University of Bradford.
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.
January 29, 2018
Moving from "F" to "G"- Changes to IPC A-610/J-STD-001
Presented by: Norman Mier, BEST
Complimentary Webinar for Members!
This webinar discusses at a high level the newest versions of the IPC A 610 (Acceptability of Electronic Assemblies) and the companion J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies) specifications which came out late in 2017. Heading in to the new year there will be some changes in inspection criteria and board assembly process specifications. The IPC-A-610 document is one of the most widely-circulated by the electronics assembly industry. It defines the acceptance standard for assembled boards. The companion JSTD-001 is a document describing how boards should be assembled. Both of these document shave been "up-rev'd" to version "G" from version "F" effective November 2017.
Both documents most significant and important changes will be highlighted in this session.
If you have already purchased your copy of revision "G" of both documents then please e-mail specific questions to Norman ahead of time so that your issue, time allotting can be addressed in this one-hour session.
Process engineers, QC inspectors, designers and procurement personnel all use the IPC-A-610 document and could find use in the review of the new documents. IPC trainers within companies will also find some good information as they prepare for their new 2018 certification classes.
Topics will include:
Norman Mier is a U.S. Marine Corp. retired veteran with over 20 years of experience in the electronics rework and repair industry. He received his training through the Navy's Micro Miniature (2M) Electronic Repair Program. He has progressed through every level of rework and repair recognized in the industry. Norman has also earned the highest certifications awarded by IPC in electronics training, being certified as a Master Instructor in IPC A-610, IPC J-STD-001D, IPC/WHMA-A-620 and IPC 7711/7721.
He has worked through BEST for several electronics industry leaders and created tailored courses for their equipment. This also includes providing training to technicians and engineers in surface mount and advanced surface mount technology. The knowledge Norm has brought to these companies has been invaluable to their process improvement efforts. His skill has also been a major factor in keeping BEST training at the forefront in the electronics-training field. He has taught several sessions at local and international conferences as part of APEX, SMTA International.
Two (2) 90 minute Sessions
Fan Out Packaging- Technology Overview and Evolution
February 13 and 15, 2018
1:00pm to 2:30pm Eastern
Presented by: John Hunt, ASE (US) Inc.
Mobile electronics has driven the need for ever increasing density and performance in electronics packaging. This has only accelerated with the advent of advanced smart phones and the burgeoning Internet of Things. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging, resulting in a wide variety of new packaging options.
We will review how the integration of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into what is being called Fan Out Packaging. These packages are for both low density mobile and high density server applications. They have higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fan Out, Panel Level Fan Out, and Chip Last Fan Out packaging. All of these can combine low cost materials and varied process flows to create both simple devices, and more complex System in Package and Package on Package applications. This course will provide an overview of the drivers, technology, advantages and disadvantages of various structural options, as well as a view of potential future trends for Fan Out Packaging.
1. Evolution to Fan Out
b. Fan Out
2. Drivers for Fan Out
a. Historical Drivers
b. Advanced Drivers
3. Definition of “Fan Out”
4. Advantages of Fan Out
5. Fan Out Market
b. Low Density vs High Density
6. Brief History of Fanout
a. Early Variations
7. 2D Fan Out Structures
a. Low Density 2D Fan Out
b. High Density 2D Fan Out
8. Fan Out System in Package (SiP)
a. Passive Components in Fan Out
b. 3D Interconnectivity Structures
9. 3D Fan Out Structures
a. Low Density 3D Fan Out
b. High Density 3D Fan Out
10. Comparison of Fan Out Technologies
11. Reliability Considerations
a. Structural Reliability Variations
12. Panel Fan Out
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
All cancellation requests must be received prior to the start time of the event.
The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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