SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

May 14, 2018 Webinar: Robotic Soldering Using Laser & Iron Soldering in Production

May 17 & 18, 2018 Webtorial: Tin Whisker – All You Should Know

Jun 14 & 15, 2018 Webtorial: SMT Process Fundamentals for Tin-Lead and Lead Free Assembly

Jun 20, 2018 Free Webinar: Consider the options-How should I mask for Conformal Coating?

Jul 16, 2018 Webinar: Solder Ball Elimination – In Wave, Selective & Reflow

Jul 17 & 18, 2018 Webtorial: Fan Out Packaging- Technology Overview and Evolution

Sep 17, 2018 Webinar: Manual Cleaning of Printed Board Assemblies – Step By Step Guide

Oct 8, 2018 Webinar: Wave Soldering Lead-Free – Setting up Your Process Parameters

Nov 19, 2018 Webinar: Hand Soldering & De-Soldering with Lead-Free Solder

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Free Webinars (4 per year!)
One session lasting 60 minutes
Cost: Free for SMTA members
$95USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Webtorials:
Two sessions lasting 90 minutes each (3 hours total)
Cost: $200USD for SMTA members
$300USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org +1-952-920-7682 or submit your abstract here.






Webinar:
Robotic Soldering Using Laser & Iron Soldering in Production

Bob WillisMay 14 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Practical guide to the use of robotic soldering irons and laser soldering on printed board assemblies will be covered in this webinar along with the use of different alloys and substrates. Most of the work reported is covered in two NPL reports on through hole soldering When we start to talk about high temperature electronics it’s not the solder it’s all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200°C, however, there are many applications that have to work at much higher levels, up to 300°C. Typically, the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used telecom and automotive producers with different cored wire combinations.

The webinar is a mixture or theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory. A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.

Topics include:

Reference books, specification and standards
Product temperature range
Component compatibility
PCB substrate choices & specifications and design
Soldering alloy choices
Assembly & soldering options
Setting up and assessment
Process and quality control
Process failures in automated soldering

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









SMTA Webtorial:
Tin Whisker – All You Should Know

Two (2) 90 minute Sessions
May 17 and 18, 2018
1:00pm to 2:30pm Eastern
Dr. Jennie S. Hwang Presented by: Dr. Jennie S. Hwang, H-Technologies Group

Overview:

For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on relevant aspects of tin whiskers from both physical/phenomenal occurrence and fundamental scientific perspectives. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Tin whisker mitigating measures and their relative effectiveness will be highlighted. Your questions and issues for solutions and discussions are welcome.

Main Topics for Part 1:

  • Definition & clarification;
  • Physical phenomena;
  • Reference point;
  • Causes and factors;
  • Concerns & impact;
  • Case Study.

Main Topics for Part 2:

  • Reliability;
  • Test conditions;
  • Mitigation remedies;
  • Relative effectiveness of mitigating measures;
  • Plausible mechanism;
  • Tin whisker vs. tin pest;
  • Summary.

Who Should Attend:
The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.

About the Instructor
Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.

Registrations are being taken through the SMTA Online Registration System.









SMTA Webtorial:
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly

Two (2) 90 minute Sessions
June 14 and 15, 2018
1:00pm to 2:30pm Eastern
Presented by:  S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly

Rochester Institute of Technology

Overview:
This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues.

Who Should Attend:
Who should attend?
♦ People with very little or no background in SMT
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
♦ Operators
♦ Marketing, Sales and Purchasing Staff
♦ Managers


After completing this course, you will be able to:
1. Identify various SMT components, their terminology and nomenclature
2. Understand what a PCB is and also the need for effective thermal management
3. Identify types of mixed technology PCB assemblies and their assembly sequence
4. Understand the influence of design on the ease of manufacturing and assembly
5. Understand thoroughly the entire assembly process and the various parameters that influence it.
6. Understand the influence of various materials such as solder paste, adhesives, flux, etc.
7. Detect assembly process defects and troubleshoot them.
8. Evaluate equipment required for setting up assembly lines
9. Understand Lead Free Implementation and Issues.

Registrations are being taken through the SMTA Online Registration System.









Free SMTA Webinar:
Consider the options-How should I mask for Conformal Coating?

June 20, 2018
1:00pm-2:00pm Eastern
Presented by: Bob Wetterman, MIT, BEST Inc.

Complimentary Webinar for Members!

There are numerous masking options available when conformal coating a PCB. The question is: which one should I chose? The answer lies in optimizing a variety of variables including the time it takes, the economics of the build, the material compatibility and the process of coating being employed.

There are several masking options available to process engineers and technicians when it comes to masking of the PCB prior to conformal coating:

  • Silicone rubber boots
  • 3D printed boots
  • Masking tape
  • Custom tape dots
  • Custom cut tape shapes
  • Peelable mask

In addition to comparing and contrasting these various options this “lunch and learn” webinar will address the various considerations a process engineer or technician would have to make when it comes to choosing the best conformal coating masking alternative. One of the considerations is the amount of labor content in the masking technique. The labor content will drive the lead time and cost included to mask and damask the conformal coating keep out areas. Another consideration is material compatibility. Does natural silicone have any impact on the laminate being used? Is the viscosity of the conformal coating material as it is applied allow it to leach underneath the mask? Does the adhesive on the tape leave behind a residue that will be harmful to the long term reliability of the assembly? Another issue is one of process compatibility. Certain masking techniques work with certain conformal coat application methods and others do not. These and other questions will be considered in this lunch time session.

This FREE 60-minute webinar reviews the reasons for masking, the types of masking methods, the “gotchas” in masking for conformal coating and the compatibility with different application methods.

The webinar will be sprinkled with practical application tips to help guide you towards the right masking process for a variety of conformal coating work ahead of you.

 

About the Presenter:Bob Wetterman
Bob Wetterman is the principal at BEST Inc. a rework/repair services company in Chicago, IL.  BEST Inc. is a contract rework/repair services provider, solder training and certification center as well as manufacturing a variety of rework/repair/assembly tools such as stencils and reballing preforms. Bob is a BSEE from the University of Illinois and holds several patents in the fields of surface science, industrial controls and PCB rework. He is also a master instructor of IPC-A-610 and is a member of SMTA having been active in several Midwest chapters.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Solder Ball Elimination – In Wave, Selective & Reflow

Bob WillisJuly 16 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls.

This webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action.

Topics include:

What are solder beads & balls?
What causes these defects?
Why does PCB design & specification matter?
Solder process & materials
Tin/lead v Lead-Free
Solder ball & bead formation
Causes/cures for random & designer balls
Inspection criteria

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









SMTA Webtorial:
Fan Out Packaging- Technology Overview and Evolution

 

Two (2) 90 minute Sessions
July 17 and 18, 2018
1:00pm to 2:30pm Eastern
John Hunt Presented by: John Hunt, ASE (US) Inc.

 

Overview:
Mobile electronics has driven the need for ever increasing density and performance in electronics packaging. This has only accelerated with the advent of advanced smart phones and the burgeoning Internet of Things. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging, resulting in a wide variety of new packaging options.

We will review how the integration of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into what is being called Fan Out Packaging. These packages are for both low density mobile and high density server applications. They have higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fan Out, Panel Level Fan Out, and Chip Last Fan Out packaging. All of these can combine low cost materials and varied process flows to create both simple devices, and more complex System in Package and Package on Package applications. This course will provide an overview of the drivers, technology, advantages and disadvantages of various structural options, as well as a view of potential future trends for Fan Out Packaging.

 

Course Outline:
1. Evolution to Fan Out
     a. WLCSP
     b. Fan Out
2. Drivers for Fan Out
     a. Historical Drivers
     b. Advanced Drivers
3. Definition of “Fan Out”
4. Advantages of Fan Out
5. Fan Out Market
     a. Forecast
     b. Low Density vs High Density
6. Brief History of Fanout
     a. Early Variations
7. 2D Fan Out Structures
     a. Low Density 2D Fan Out
     b. High Density 2D Fan Out
8. Fan Out System in Package (SiP)
     a. Passive Components in Fan Out
     b. 3D Interconnectivity Structures
9. 3D Fan Out Structures
     a. Low Density 3D Fan Out
     b. High Density 3D Fan Out
10. Comparison of Fan Out Technologies
11. Reliability Considerations
     a. Structural Reliability Variations
12. Panel Fan Out
     a. Drivers
     b. Considerations

 

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Manual Cleaning of Printed Board Assemblies – Step By Step Guide

Bob WillisSeptember 17 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process.

Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning.

Topics include:

Why clean
Material selection
Manual cleaning techniques
Testing cleanliness
Inspection requirements
Component compatibility
Reliability test techniques

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Wave Soldering Lead-Free – Setting up Your Process Parameters

Bob WillisOctober 8 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Do we have all the answers to successful lead-free wave soldering? No, and to quote a well-known soldering metallurgist, we often don’t even know all the questions. Lead-free is new to many and the wave soldering process is the most affected by the change of materials with cost increase in alloy, solder bath and copper erosion plus increased temperatures all make process change demanding. During this presentation we will look at the practical experience to date and try to provide answers to as many questions that have come to light during early introduction. The presenter has produced training video and interactive CD-ROMs on wave soldering and conducted the Electrovert “Workshop of Machine Soldering” for over 10 years with theory and hands on sessions worldwide.

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

Topics include:

Checking key aspects in design
Copper erosion problems
Effect of tin-lead on joint reliability
Equipment settings, pre heat, fluxer, wave settings
Inert soldering
Effect of bath contaminates
Quality control checks
Common soldering defects, causes and cures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Hand Soldering & De-Soldering with Lead-Free Solder

Bob WillisNovember 19 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Hand soldering and de-soldering with lead-free solders does requires higher process temperatures. This material change can impact on the printed circuit board and components used. It can also impact on the tooling leading to increased cost and maintenance in your facility.  Soldering with lead-free can be simpler than you think if staff are provided with the correct procedures and a better understanding of the process and the type of joints they will be producing.  Changes to material and processes in your factory is an ideal time to eliminate poor practices that have been used for many years leading to extra rework and cost.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

Soldering theory and what is different
Cored solder wire
Soldering operation
Soldering iron care
Tip corrosion issues with lead-free
De-soldering techniques
Lead-free inspection criteria
Typical lead-free defects

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


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