SMTA Webinars and Webtorials

Webinars and Webtorials

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars and Webtorials

Feb 11, 2019 Webinar: Solder Paste Evaluation & Simple Tricks of the Trade

Feb 12, 2019 Webinar: BGA and Area Array Process Defects - Causes & Cures - FREE for Members!

Feb 19, 2019 Webinar: BGA Reballing- Theory and Hands On

Mar 18, 2019 Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects

Apr 29, 2019 Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys

May 20, 2019 Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process

Jun 17, 2019 Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions

Jul 15, 2019 Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process

Aug 12, 2019 Webinar: Conformal Coating - Successful Implementation & Quality Control

Looking for a past webinar? Check the knowledge base.


Webinar vs Webtorial: What's the Difference?

Free Webinars (4 per year!)
One session lasting 60 minutes
Cost: Free for SMTA members
$95USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Webtorials:
Two sessions lasting 90 minutes each (3 hours total)
Cost: $200USD for SMTA members
$300USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar or webtorial, contact Jenny Ng, jenny@smta.org +1-952-920-7682 or submit your abstract here.






Webinar:
Solder Paste Evaluation & Simple Tricks of the Trade

Bob WillisMonday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.

There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

  • Solder paste type
  • Low & high temperature alloys
  • Solder beading
  • Solder slump
  • Reflow spitting
  • Flux condensation
  • Printing trials & test boards
  • Common paste & print failures

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
BGA and Area Array Process Defects - Causes & Cures - FREE for Members!

Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Keith BryantPresented by: Keith Bryant, SMTA Europe

Free for members!


What You Can Learn From This Course:

This webinar is FREE for members to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.

With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.

The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.

 

During the webinar the following will be discussed:

  • Area Array Inspection methods
  • Inspection criteria

Selected defect types include:

  • Opens
  • Shorts
  • Voids
  • Head on Pillow
  • Solder wicking
  • Solder beads
  • PCB plating variations
  • Plating voids

Registrations are being taken through the SMTA Online Registration System.









Webinar:
BGA Reballing- Theory and Hands On

Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Stencil Design for Solder Paste, In Process Inspection & Process Defects

Bob WillisMonday 18th March @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

  • Design of lands and apertures for fine pitch SMT & BGA
  • Through hole printing requirements
  • Selection of stencils
  • Evaluation of solder pastes
  • Practical machine set-up and trial prints
  • Elimination of board wash-off
  • Assessment of paste and stencil combinations
  • Solder paste inspection, measurement and quality control
  • Stencil Inspection and quality control
  • Cleaning stencils
  • Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Flexible Circuit Board Design & Assembly with Lead-Free Alloys

Bob WillisMonday 29th April @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process

Bob WillisMonday 20th May @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions

Bob WillisMonday 17th June @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process

Bob WillisMonday 15th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Conformal Coating - Successful Implementation & Quality Control

Bob WillisMonday 12th August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.

  • After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
  • Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.


  • All cancellation requests must be received prior to the start time of the event.

    The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.

    Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


    CONSIDERATIONS FOR RECEIVING THE BROADCAST

  • Register via GoToWebinar upon recieving the email with confirmation and instructions.
  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial) or email gotowebinar@citrixonline.com.
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819