Chapter Tutorial Program (CTP)
Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.
Want to instruct an SMTA tutorial? View the tutorial guidelines.
Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.
Upcoming Chapter Tutorial Programs
Best Practices in Electronic Assembly Processes - Capital Chapter Tutorial Program
|Instructor: Phil Zarrow, ITM Consulting |
March 15, 2018
9:00 a.m. - 3:00 p.m.
Best Western Plus Hotel & Suites
1251 W Montgomery Ave
Rockville, MD 20850
Registration Deadline is March 1!
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
You have the responsibility and resources to improve the productivity of an assembly operation…what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.
- Optimization Objective
- Getting the Most Productivity from an Existing Line
- Definition of "Best Practices"
- Process Characterization
- Best Practices in the Assembly Process
- Solder Paste Printing Process Best Practices
- Pick and Place Best Practices
- Reflow Soldering Best Practices
- Wave Soldering Best Practices
- Selective Soldering Best Practices
- Cleaning vs No-Clean Considerations and Best Practices
- Q & A
Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.
About the Instructor:
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as
- SMT Implementation and Assembly facility set-up
- SMT Assembly and Soldering Failure Analysis
- EMS/Supplier Process and Quality Assessment Audits
- Counterfeit Component Avoidance and Interception Programs
- Manufacturing yield improvement
- Equipment Evaluation and Selection
- No-clean and lead-free solder paste evaluation and process implementation
- SMT Manufacturing Process Audits and process improvement
- On-site training for all levels of personnel
- Design for Manufacturability (DFM) specification development
- Reflow of Through-hole feasibility, development and implementation
- Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
- SMT process equipment benchmark testing and evaluation
- SMT product development
- Lead-free Process Implementation and Optimization
- Technical evaluations related to business acquisitions and mergers
- Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update's “Boardtalk” audio program.
Contact Karen Frericks at 952.920.7682 with questions.