Chapter Tutorial Program (CTP)

CTP

Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.

Want to instruct an SMTA tutorial? View the tutorial guidelines.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Upcoming Chapter Tutorial Programs

March 28, 2019
Capital Chapter Tutorial Program - "Supporting High Reliability at the OEM: A PCB Perspective"

April 3, 2019
Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"







Capital Chapter Tutorial Program - "Supporting High Reliability at the OEM: A PCB Perspective"

Instructors: Yaad Eliya and Jim Barry, PCB Techologies

March 28, 2019

9:00 a.m. - 3:00 p.m.
Country Inn & Suites
1717 West Nursery Road
Linthicum Heights, MD 21090
(443) 577-1036
 
Price:
  • Members: $200
  • Non-Members: $400
  • Capital Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80


Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Topics Covered:

  • Solderability Issues from the PCB Fabrication Perspective
    - Speaker:  Yaad Eliya
    - Synopsis:
       *  The speaker will discuss the PCB Manufacturing process and how it has a direct effect on the solderability process
        *  Items such as plating technique (DC plating vs. Reverse plating), Final finished and other processes that effect the assembly
     
  • Design for Reliability
    - Speaker:  Yaad Eliya
    - Synopsis:
        *  The speaker will discuss how design aspects can directly affect the reliability of the raw card at the assembly level
        *  Items such as Non-functional pads, via-fill, cross hatched grounds, conductor routing, PTH preparations, etc. -- and their effects on reliability
     
  • RF/Microwave Design Considerations and Options
    - Speaker:  Yaad Eliya
    - Synopsis:
        *  The speaker will discuss the Do's and Don'ts for RF & Microwave success
        *  Items such as materials, lamination cycles, Single vs. double cavities and "Air Cavity" for varying frequencies will be discussed
     
  • Thermal Mitigation Options at the Raw Card Level
    - Speaker:  Jim Barry
    - Synopsis:
        *  The speaker will discuss the options available for Thermal mitigations at the raw card level
        *  As designs get smaller and faster, high temperature is becoming a big issue - we will look at Materials, Heatsinks and Coins to help mitigate heat


About the Instructors:
Yaad Eliya

CTO, R&D and Technology Manager

  • Working in PCB Technologies for the last 12 years
  • B.Sc. Engineering at Ben-Gurion University of the Negev
  • Electronic Materials Expert, with especially at Rigid Flex, RADAR/Microwave and RF applications
  • Process and machinery design & architecture manager, in the PCB industry
  • Responsible for R&D and special application development, for Medical/Space & Military segments
  • Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
  • Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)

Jim Barry

Solutions Architect and North American Sales Manager - PCBT

  • Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales...  PCB Technologiest including Design, Assembly and Box build...
  • Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis.  Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
  • Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
  • Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications

 

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

SMTA Capital Chapter    Circuits Assembly


Contact Karen Frericks at 952.920.7682 with questions.
 

Registrations are being taken through the SMTA Online Registration System.








Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"

Learn what it is and how to choose it, print it, reflow it and clean it
Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993

Registration Deadline is March 15!
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys She.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from indepndent research, and both of the like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys Shea Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

Phil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.

Registrations are being taken through the SMTA Online Registration System.



SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819