Chapter Tutorial Program (CTP)
Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.
Want to instruct an SMTA tutorial? View the tutorial guidelines.
Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.
Upcoming Chapter Tutorial Programs
Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"Learn what it is and how to choose it, print it, reflow it and clean it
|Instructors: Phil Zarrow & Chrys Shea |
April 3, 2019
9:00 a.m. - 4:30 p.m.
7505 Technology Drive
Melbourne, FL 32904
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
The Chrys and Phil Show
Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea. Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards. Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.
- Some SMT assembly process experience
- A working sense of humor
Come to the BRAND NEW Space Coast Tutorial to learn:
Solder Paste - what is it?
- How it is made, particle size classifications
- How it behaves - viscosity, thixotropy, rheology
- Balancing performance properties and why every formulation is different
- 25 paste characteristics that affect SMT line performance
- Finding the right product for the job
- Environmental and handling considerations
Stencils - aperture rules (5 ball rule, area ratio...)
Stencils - techniques and materials (fine grain ss, nano, etc.)
- Printing considerations and parameters
- Stencil cleanliness
Troubleshooting Printing Related defects
Factory Tour of BlueRing Stencils and LUNCH
Solder Paste Inspection
- SPI Basics
- Types of SPI technologies
- Reasons for deploying
- Implementation tips
- Setting tolerances
- Understanding thresholds
- Methodologies: Vapor phase, convection, laser
- Profile Objective
- Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
- Solder Paste/solder behavior during reflow
Troubleshooting common defects:
- Solder balls
Cleaning (time permitting)
- Why clean - pictures of dendrites and corrosion
- NC vs OA
- Why clean the no-clean?
- ROSE testing vs ion chromatography
- The importance of monitoring the cleaning process
About the Instructors:
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as
- SMT Implementation and Assembly facility set-up
- SMT Assembly and Soldering Failure Analysis
- EMS/Supplier Process and Quality Assessment Audits
- Counterfeit Component Avoidance and Interception Programs
- Manufacturing yield improvement
- Equipment Evaluation and Selection
- No-clean and lead-free solder paste evaluation and process implementation
- SMT Manufacturing Process Audits and process improvement
- On-site training for all levels of personnel
- Design for Manufacturability (DFM) specification development
- Reflow of Through-hole feasibility, development and implementation
- Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
- SMT process equipment benchmark testing and evaluation
- SMT product development
- Lead-free Process Implementation and Optimization
- Technical evaluations related to business acquisitions and mergers
- Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.
Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms. He is currently producer and co-host of IPC Update's "Boardtalk" audio program.
Contact Karen Frericks at 952-920-7682 with questions.