Chapter Tutorial Program (CTP)

CTP

Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.

Want to instruct an SMTA tutorial? View the tutorial guidelines.

Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Upcoming Chapter Tutorial Programs

March 17 - 19, 2020
Oregon Chapter Tutorial Program - DFM to DFX: The World of Shrinking Electronics (HELD VIA WEBINAR)







Oregon Chapter Tutorial Program - DFM to DFX: The World of Shrinking Electronics (HELD VIA WEBINAR)

ATTENTION:  DUE TO RECENT EVENTS AND VIRUS CONCERNS, THIS EVENT WILL NOW BE HELD BY WEBINAR!

Instructor: Dale Lee, Plexus Corp.

TWO Sessions

March 17 and 19, 2020
1:00 - 4:00 p.m. Pacific each day

Instructions for logging in to the webinar will be sent shortly before the live event. 
You will also receive a soft copy of the presentation handout.

 

Price:

Members: $150
Non-Members: $350
Oregon Chapter Officers: $80
Student Members: $45
Student Non-Members $75

Great Value! Half the cost of a tutorial at SMTA International and you never need to leave the comfort and safety of your home or office.  Upon request, a certificate of completion will be sent to you via email at the conclusion of the 2nd session. 

Introduction:

Today's electronic component packaging technologies of  smaller packages (0201/01005/008004), finer lead pitch (0.4/0.35/0.3/...), bottom terminated components (QFN/DFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad plated over (VIPPO), multiple copper thicknesses, copper routing, ...), increased thermal sensitivity, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints.  Using traditional, simplified mass production techniques are not sufficient to address tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.  This course will highlight issues with today's electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.  In addition, the concept of manufacturing, test, reliability by design will be presented.

What you will learn:
• Industry Standards Limitations (IPC/JEDEC)
• Component packaging impacts
• PCB design
        1)    Laminate Limitations – Rigid/Rigid-Flex/Flex
        2)    Via hole closure
        3)    Trace routing size/copper etching effects 
• SMT and PTH solder design impacts
• Components with thermal management impacts: 
        1)    Component design
        2)    PCB Thermal balance: X, Y and Z axis
        3)    Trace routing/solder mask/silk screen  
        4)    Equipment limitation/tolerance
        5)    PCB array tolerance
        6)    Process tooling design
• Process control impacts
• Paste volume, thermal shock SMT and PTH, reflow process warpage
• Compatibility issues, low stand-off components 
• Cleaning impacts
• Test and inspection impacts



Dale Lee About the Instructor:

Dale Lee

Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.

Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of Chip Scale Package (CSP) & Ball Grid Array (BGA) packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 

Dale has authored multiple technical articles and papers and is a frequent instructor/presenter globally on topics including PCB and SMT design, assembly, cleaning, and DFM/DFX.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award and IPC's "President's Award."  He has been or is very involved with multiple industry associations (SMTA, IPC, INEMI), industry standards development, and symposium/ conference technical development committees.



Contact Karen Frericks at 952-920-7682 with questions.

Registrations are being taken through the SMTA Online Registration System.



SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819