Technical Program

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Technical Program

Monday, May 22, 2017

Cleaning Printed Circuit Assemblies, Design & Process Control Workshop

1:00pm — 4:30pm

  • Bob Willis –
  • Helmut Schweigart, Ph.D. - ZESTRON
  • Mike Bixenman, DBA – KYZEN Corporation
  • Get details

    Tuesday, May 23, 2017

    Tuesday Keynote Address

    Prabjit Singh, Ph.D. IBM Corporation
    Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers

    Session 1: Residues Trapped under Component Terminations

    As electronic devices build in more features using smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create other issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with monolayers of moisture, there is the potential for ion mobilization causing current leakage. How clean is clean enough is a question that OEMs struggle with when designing electronic hardware. Today, more than 50% of components placed onto the board assembly are bottom terminated. The number of connections, component pitch, standoff gap, flux composition and volume of solder reflowed under the bottom termination can impact reliability.

    By attending this session you will learn:

  • Risk of residues left under fine pitch leadless components
  • How important is cleaning these residues
  • Is a No-Clean flux residue trapped under the component safe?
  • Test methods for localized testing
  • Cleaning process performance measurements


  • Karthik Vijay, Indium Corporation
    Dendritic Growth & Corrosion under Low-Standoff Components in Automotive Electronics – A Flux Solution
  • Bruno Tolla, Ph.D., Kester
    Impact of Reflow and Cleaning Conditions on the Electrochemical Activity of Flux Residues under Surface Mount Components
  • Mike Bixenman, DBA, KYZEN Corporation
    Development of a Risk Profile from Flux Residues Trapped under Leadless Components
  • Bob Willis and Martin Wickham, NPL
    Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
  • Vladimir Sitko, PBT Works
    Cleaning Process Performance Measurement

    Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

    Residues trapped under fine pitch leadless devices are not visible and hard to inspect for. This session will build off of Session 1 to further characterize the nature of these residues. This session will work to answer the question as it relates to the chemical reliability of soldering residue.

    By attending this session you will learn:

  • The use of Surface Insulation residue to qualify assemblies populated with fine pitch leadless devices
  • Are residues trapped under components "bad."
  • Where do the sources of contamination come from?
  • Chemical reliability of soldering residue


  • Doug Pauls, Rockwell Collins
    Surface Insulation Resistance Testing to Best Simulate Humidity Exposure and Potential for Leakage Currents
  • Dave Hillman, Rockwell Collins
    Flux Residues under Components – Are they Bad?
  • Eric Camden, Foresite
    Electronic Assembly – Where do Contaminants come from?
  • Bart van de Lisdonk, Interflux
    Chemical Reliability of Soldering Residue

    Session 3: Process Control and Cleaning Material Innovations

    Electronic assemblies must control their processes to assure repeatability from lot to lot. Process control methods that monitor a validated processes baseline can be achieved. Process control is not specific to one process but to all distinct processes performed to complete the finished product.

    By attending this session you will learn:

  • Measures for minimizing contamination during wave and reflow soldering
  • Optimized a vapor phase cleaning process
  • Process control of ionic contamination


  • Andreas Reinhardt, SEHO Systems GmbH
    Measures to Minimize Contamination During Wave and Reflow Soldering
  • Patrick Duchi, Inventec
    Optimization of Chemistry for a Vapour Phase Process for Defluxing No-Clean Lead Free Materials
  • Mark Routley, GEN3 Systems
    Process Control of Ionic Contamination achieving 6-Sigma Criteria in the Assembly of Electronic Circuits
  • Todd Rountree, Austin American Technology
    Addressing the Problems with Ionic Cleanliness Testing Modern Circuits

    Wednesday, May 24, 2017

    Wednesday Keynote Address

    Ruediger Knofe, Siemens AG
    Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal

    Session 4: Conformal Coating Materials and Processes

    More and more electronic devices are mobile and exposed to humidity (moisture) and other contaminants such as dust, chemicals and temperature extremes. Coatings that truly conform to the circuit card and components protect the assembly from harsh environments. Similar to cleaning, process considerations and best practices to obtain coating adhesion are more challenging.

    By attending this session you will learn:

  • The effects of climatic stress and how to protect against it
  • The effects of Plasma treatment to improve adhesion and eliminate ESD induced failures
  • The use of Air Plasma and how it can improve the coating process
  • Design considerations to improve conformal coating adhesion
  • Coatings that withstand high temperature applications


  • Helmut Schweigart, Ph.D. ZESTRON
    Selection of Protective Measures against Climatic Stress
  • David Foote, Nordson March
    Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures without Impact on Coating Performance
  • Marie Kaing, Humiseal
    Conformal Coating Materials for High Temperature Automotive Applications
  • Rakesh Kumar, Ph.D., Specialty Coatings
    Challenges of Designing Electronics for Conformal Insulation to Enhance their Protection and Reliability
  • Eva Rogge, Euro Plasma
    Innovative Plasma Coatings for High Volume Conformal Coating of Electronics
  • Michael Szuch, Nordson Asymtek
    Transitioning from Manual to Automated Conformal Coating
  • Mathieu Gonsolin, Exelsius
    Air Plasma at Atmospheric-Pressure for Improving Conformal Coating Reliability

  • Supported by:
    Global SMT & Packaging