Call for Participation
"How clean is clean?" is more challenging to answer as conductors and circuit traces are increasingly narrower. What is acceptably clean for one segment of the industry may be unacceptable in more demanding segments. You are invited to submit an abstract, presenting new developments in the following categories:
Submission Guidelines for Technical Paper and Presentation Abstracts
Abstracts are solicited to describe original and unpublished work. The abstract should be at least 300 words and must clearly state purpose, results and conclusions. Technical conference agenda presentations will be limited to 30–40 minutes, including five minutes for questions. Professional development courses will take place on November 3, and the Technical Conference will take place November 4-5.
July 10 - Submission of abstract
August 1 - Notification of acceptance
October 10 - Submission of completed presentation
ABOUT THE CONFERENCE
The 2020 High-Reliability Cleaning and Conformal Coating Conference is focused on electronics assembly reliability and the influence that cleanliness and coating has on producing reliable hardware.
The Conference will feature technical sessions, workshops, tabletop exhibits and networking activities. This comprehensive event will cover technological developments in all areas of cleaning and coating, applied to electronics assemblies.
The High-Reliability Cleaning and Conformal Coating Conference is chaired by Dr. Mike Bixenman, KYZEN Corporation and is supported by IPC and SMTA. It has developed into a highly-regarded international event that is well-attended by subject matter experts and industry leaders.