Silicon Valley (San Jose)

San Jose, CA 

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June 1 Coplanarity & Warpage Technical Meeting


The SMTA Silicon Valley cordially invites you to attend: 

Warpage & Their Effects & Ramifications for Assembly Reliability


arpage Effects on Flip Chip BGA Solder Joint Quality


Raiyo Aspandiar and Jagadeesh Radhakrishnan,

Intel Corporation


Abstract: Impact of excessive dynamic warpage on BGA solder joint quality


Biographies:  Raiyo Aspandiar is a Senior Process Development Engineer at Intel, Hillsboro, Oregon, with over 32 years’ tenure at Intel. His fields of expertise include solder metallurgy, SMT process and solder joint defect analysis. Raiyo is a member of the Board of Directors of SMTA and he is Chair of the iNEMI Board Assembly TIG.  


Jagadeesh Radhakrishnan is a Senior Quality Reliability Engineer at Intel, Folsom, California. He received his Bachelor’s in Technology in Mechanical Engineering from the Indian Institute of Technology, Madras, and Master’s in Mechanical Engineering from the University of Maryland, College Park, specializing in Electronic Packaging. His areas of interest include thermo-mechanical analysis, design, modeling and testing of semiconductor packaging technology for component, board and system level applications. He is an active participant in IPC/JEDEC, iNEMI and SMTA


      PCB Warpage During Reflow & Effect  

                        on PCBA Yield

                                            Ryan Curry, Akrometrix


Abstract: PCB warpage has been identified as one of several key contributors to unacceptable yield rates during reflow assembly of a PCB module to a PCB carrier board. In an effort to improve attachment yield rates, a design of experiments was performed to evaluate several PCB design variables that are believed to contribute to warpage during reflow, including: 1) laminate material; 2) layer-to-layer copper balance; 3) panel configuration of the 6-up module array; and 4) location of the 6-up array in the PCB fabricator’s working panel. To simplify the investigation, only the variables associated with module PCBs are considered; the carrier PCB design is held constant. Additional graphical and statistical data that shows real-time at-temperature warpage behavior of several PCB modules and carriers will also be presented. This includes a detailed at-temperature gap analysis that shows the co-planarity gap between module and carrier at each critical reflow temperature.


Biography:  Ryan Curry is a Technical Account Manager at Akrometrix. He is a subject matter expert in temperature warpage and strain measurement. Ryan has a mechanical engineering degree from Georgia Institute of Technology


Effects of Warpage on SMT Printing & Placement Process

Mark Ogden, ASM Assembly Systems

Abstract: Discussion of the factors that cause board warpage prior to printing and SMT placement. Examples of defects caused by board warpage will be discussed and explanations given on the mitigation measures that can be taken in the printer and pick and place machines


Biography: Mark Ogden is a Senior Marketing Manager at ASM Assembly Systems. Serving 25 years with the company, Mark's role is to plan and manage all customer marketing events in the Americas region, including trade shows, road shows and technology events. Mark began his career as a SMT production engineer at Siemens in Germany. Since then he has held various management roles in Europe and the United States. Mark has engineering degree from the University of Bath in the UK.





Thursday, June 1, 2017

3:00 p.m.

Location:  Bestronics

2090 Fortune Drive

San Jose, CA

Topic:  Coplanarity & Warpage and their Effects and Ramifications for Assembly Reliability



Watch this spot for more info regarding the agenda and speakers for this meeting, but meanwhile, please hold the date on your calendar.

Sillicon Valley SMTA Technical Conference and Expo

Technical Conference and Exposition

DATE: Wednesday November 29, 2017 

PLACE: Bestronics
2090 Fortune Drive, San Jose, CA 95131





224 LinkedIn Members and Growing!


As of April 29th, 2016, our LinkedIn page has reached 224 MEMBERS! We truly appreciate our members and their support. 

Please feel free to contact our VP of Communications if you'd like to volunteer or contribute to SMTA. 

Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
June 1, 2017
3:00 PM
Coplanarity and Warpage effects Bestronics 408-234-9485   Kevin McClay
September 15, 2017
12:00 PM
SMTA Golf Tournament Spring Valley Golf Course Milpitas (408) 456-1536   Jim Donner
October 12, 2017
Ruggedization of Electronics, TBD 408-234-9485   Kevin McClay
November 29, 2017
10:00 AM
Technical Conference and Expo Bestronics, San Jose 408-234-9485   Kevin McClay

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Our Chapter Leaders

President : Robert A. Boguski  (Datest Corporation)
Phone : 510-490-4600
Email :

Vice President : Kevin McClay  (Captec)
Phone : 510-657-9292
Email :

Secretary : Jasbir Bath  (Bath Consultancy LLC)
Phone : 510-676-5629
Email :

Treasurer : Brian Douglas Carey  (Innovative Capital Resources NC, Inc.)
Phone : 408-927-7159
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VP of Technical Programs : John H. Hawley  (Barnes & Noble Digital)
Phone : 510-323-6800
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VP of Golf (Appointed) : James Donner  (Innovative Equipment Technology)
Phone : 510-413-9902
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Board Liaison : Scott Priore (Cisco Systems, Inc.)
Phone Contact : 408-527-1814
Email Address :

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Global Members of our Chapter


Cisco Systems, Inc.

Keysight Technologies

Global Participating Members of our Chapter

Cisco Systems, Inc.

Creation Technologies Inc.

Keysight Technologies

Corporate Members of our Chapter


Asteelflash, Inc.

Beam On Technology

Beckman Coulter

Canon USA

Cavist Manufacturing

Cisco Systems, Inc.

Datest Corporation


Digitaltest, Inc.

Equipment Services LLC

GE Oil & Gas M&C Minden


JH Technologies

Juniper Networks

Keysight Technologies

Masterwork Electronics, Inc.

Nordson Test and Inspection

PacTech USA

Paramit Corporation

PDR Rework and Test Systems

Photo Etch Technology

PRIDE Industries

Promex Industries Inc.

Quantum Analytics

Rocket EMS

Saki America

Senju Comtek Corporation

Shenmao Technology Inc.


Sonoscan, Inc.

Streamline Circuits Corporation

Technica, USA

Yield Engineering Systems, Inc.

Zollner Electronics Inc.

SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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