Intermountain (ID, UT)

ID, UT 

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SMTA thanks all current officers for their generous support.





Chapter News

Utah Expo & Tech Forum - Held Thurs, Sept 20, 2018 at University of Utah-Student Union Bldg

Thursday, September 20, 2018 | 8:00 am
Location: University of Utah - Union Building

Completely Free Technical Program & Vendor EXPO:

Morning: 
8:00 am
Registration Opens - Exhibit hall desk will have preregistered badges and handouts.
(Vendors are welcome to come in and setup) 

1st Speaker: 9:15am - 10:00 am:

Jeff Mogensen - Cyberoptics 
Presentation Title: SPI, Printers, and the Financial Impact 

Engineers can't babysit processes all day - that's where SPI and closed loop come in.  No Process has more vaiables or challenges than printing the paste on the boards.   Jeff presents a new inovation in machine technology that helps to resolve most of the present problems. 
 

10:00 am
Expo Opens with vendor tables and displays 
Current Exhibitor List:

Cluff & Associates, Inc.
Conductive Containers, Inc.
ERSA North America
Fuji America Corporation
Hisco
Indium Corporation
Kyzen Corporation
Metcal / OK International
Pemro
Powell Industries Inc
PVA
REStronics
Seika Machinery, Inc.
SMTXTRA USA INC
StenTech
Technica, USA
Universal Instruments Corporation
Vision Engineering
West Tech Automation

Companies in bold are SMTA corporate members

2nd Speaker: 11:00 am - 11:45 am:

Rich Brooks - Senior Manager Design Engineering - Jabil Corp, St. Petersburg, FL

Presentation Title: PCB Technology Trends
3D PCB printing, Printed Electronics and Stretchable PCB materials.
There are many trends going on today that are driving the electronics industry to implement new technologies.  These trends include, Wearables, Health Sensing, 3D printing, Internet of Things, AI and AR/VR.  At Jabil, our goal is to understand the technology trends and to implement new solutions for our customers.  For PCB assemblies, Jabil is focusing on a number of technologies that will impact the industry, such as, 3D Printed Circuit boards, Ultra-thin substrates, Printed Electronics and Stretchable PCB materials.  This presentation will review these various technologies and how they can be utilized and impact the industry.

 

12:00 pm - 1:00 pm:
Free Complimentary Lunch - A great lunch this year!!
A Big "Thank you" to Our Lunch Sponsors:

Afternoon: 
3rd speaker: 1:00 ~ 2:00

Dale Lee -
Senior Staff DFX Strategy Engineer with Plexus Corporation, Neenah Wis.
Presentation Title: PCB and Solder – Not Just Your Normal Failure Modes Any More
Presenation Description:
Design densities for electronic assemblies have increased the interconnection density of PCB’s and component solder connections.  This increase density has resulted in smaller via diameters for traditional and micro via hole, complex via structures, terminations of via  holes into component mounting pads, decreased component mounting pads and increased diversity of routing terminations to component lead pads.  This complexity in interconnection and density of interconnections combined with decreasing component lead pitches and lagging development of industry standards to address these changes has created opportunities for new PCB and solder joint formation failure modes. 

As technology continues to march forward, new interconnection failure modes will continue to develop.  This presentation will review many of the new PCB interconnection/PCB to solder joint/solder joint failure modes and methods for identification of potential failures/reliability and some recommended potential design/assembly process solutions. 
Bio:
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields

2:30-3:15  PM

Gus Mavrou - Regional Sales Manager at SEHO North America

Presentation Title: Selective Miniwave Soldering and Detailed Design Guidelines. 

Bio: 
Graduate of DePaul University 1974 and in January 1980 I went to work for the Kester Solder company as a production expeditor and over the next 11 years Supervised the Metal Alloying and Extrusion area, Warehouse and Logistics Manager, and finally Production Control Manager.  In 1992 I moved from production to outside sales and for the next the next 26 years I was responsible for Distributor and OEM Sales.   In January 2009 I went to work for SEHO Systems as their Sales Manager for North America responsible for Wave, Selective and Reflow Soldering systems.  

Door prizes and other awards will be given out just before closing. 

4:00  Close and Cleanup

Parking is immediately to the north of the student union building. 

Get details and register here!


Questions? Contact:
Steve Greathouse
208-908-8458
steve.greathouse@plexus.com





Photos from the 2018 Golf Outing


Awards given out    Getting awards
Driving Range    Resort

Team standings
 






Boise SMTA Golf Scramble - Aug 21, 2018

Tuesday, August 21, 2018 | 8:00 am
Location: Shadow Valley Golf Club, 15711 Highway 55, Boise Idaho

Boise SMTA Golf Scramble - Aug 21, 2018
Shadow Valley Golf Club
SMTA Intermountain Chapter
Boise Golf Scramble
What:  SMTA Shadow Valley Golf 2018 - Golf Scramble
When:  Aug. 21st Shot gun start 8:00 AM with lunch following
Where:  Shadow Valley Course - Boise, Idaho


Team and Individual sign-up deadline Aug. 14th
Team and Hole Sponsor sign-ups also due at that time
We also welcome donations for prizes like closest to the pin, longest drive and others
    
COSTS:
Team sponsor $350—fees and lunch for 4 (sponsor may provide shirts or caps) Team Sponsor sign.
Hole sponsors:  $200 and choice of available hole.  Includes one player and hole sponsor sign.
Mulligans:  $10 each, Must purchase in advance
Individuals are Welcome!!  We will sign you up to a team.  Fee is just $65.  This includes Green fees, cart, range balls and lunch.  Please Join us! 
We guarantee you will have a good time!



Contacts to RSVP and for Sponsorships:
David Bell 208-867-6006 or dcbell@q.com

Contact for details about course, map: Shadow Valley Golf Club
http://www.shadowvalley.com/directions/
15711 Highway 55, Boise Idaho.  Course Phone #208-939-6699




Questions? Contact:
David Bell
208-867-6006
dcbell@q.com





SMTA Intermountain Chapter Current Newsletter and Archives


2016 March Newsletter
2012 September Newsletter
2011 March Vendor conference
2011 February
2009 April January
2007 September
2006 November March
2005 August July May April February
2004 September June April








Our Chapter Leaders


President : Steve W. Greathouse  (Plexus Corp.)
Phone : 208-898-1274

Vice President : Tony Whitt  (West Tech Automation)
Phone : 303-881-1623

Secretary : Don Ellison Saunders  (HP Inc. - Hewlett-Packard Company)
Phone : 208-866-5608

Treasurer : Robert Winter  (L3 Technologies)
Phone : 801-725-0820

Past President : Sheldon S. Stewart  (Plexus Corp.)
Phone : 208-898-1275

Chapter Advisor (Appointed) : David C. Bell  
Phone : 208-867-6006

Utah Golf Coordinator (Appointed) : Gordan Jackman  (Campbell Scientific, Inc.)
Phone : 435-227-9659

VP of Technical Programs (Appointed) : Patrick Ryan  (Ryan Technical Services)
Phone : 315-534-3316

Board Liaison : Martin Anselm (Rochester Institute of Technology (RIT))
Phone Contact : 585-475-2005

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Global Participating Members of our Chapter

HISCO, Inc.

Plexus Corp.



Corporate Members of our Chapter

Blackfox Training Institute

Computrol Meridian

Computrol, Inc.

Krayden, Inc.

Micron Technology, Inc.



SMTA Global Members

Amazon Celestica, Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC PERFORMANCE CHEMICALS ITW EAE Keysight Technologies KYZEN Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA, Inc. NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819