Intermountain (ID, UT)ID, UT
Expos | Job Resources | Educational Grant | Students Only
SMTA Intermountain Chapter Boise Expo at BSUTuesday, March 26, 2019 | 9:00 AM
Location: Boise State University
The SMTA Intermountain chapter Boise Expo Technical presentations and vendor show will be held on March 26, 2019.Location: Boise State University
Student Union Building - Jordan D Ballroom
1910 University Drive
Boise, ID 83725
Presentations start at 9:00 am with the vendors show opening after the first talk is finished. Wrap up will be about 3:15 pm.
Parking will be free in the parking terrace directly south of the union building, but attendees must register to get their free parking password.
This is a totally free event for attendees, but please register below.
9:00 Presentation 1: PCA DFM - Path to Higher Quality & Lower Costs,
by Don Saunders, PCA NPI / CPE Engineer, HP Inc, Boise, Idaho.
Abstract: With today’s tariffs, world consortiums, reduced schedules and changing partners … how can PCA designs stay in sync with component, assembly and distribution changes? PCA Design for Manufacturing demonstrates the value of trusted relationships and tools to meet customer’s demands and stay competitive. Understanding and projecting true cost of cost reductions avoids costly product delays, recalls or bad customer experiences. What is total cost? How does a cost reduction to one partner impact other partners & customers costs?
Affinity – “an attraction or force that encourages a group to combine” applies to all of our partners.
DFM helps designers succeed by aligning suppliers and manufacturing/assembly partners strengths with theirs in delivering quality solutions to their customers on time.
Real contributions are achieved at each product proto, during development builds using production processes by NPI DFM team. New technology and components validated on state of the art assembly processes prior to releasing to production, results in strengthened partner relationships and successful product ramps.
10:00 Vendor Show opens. Everyone welcome. No Entrance Fee -
Vendor show continues while talks are ongoing
11:00 Presentation 2: Low Temperature Solder Overview, Opportunities and Risk,
by Kris Troxel, HP Inc. Boise Idaho
Kris Troxel is a Senior Reliability Engineer for the Strategic Quality and Reliability Engineering (SQRE) organization at HP Inc. Kris has been with HP since 1989, and has worked closely with external organizations such as iNEMI and IPC, in both participatory and leadership roles. Kris led the HP Pb-free PCA assembly transition and has been involved with PCA materials, processes and industry & HP standards and has led several pan-HP initiatives. She supports all HP businesses.
12:00 Free Lunch for all attendees in Vendor show area.
Vendor show continues while talks continue
1:00 Presentation 3: “PCB Technology, Assembly and IC packaging”
Miniaturization is one of the main trends going on today that are driving the electronics industry to push the limits of capabilities and driving the implementation of new technologies. Some of the products that are driving miniaturization include: Wearables, Health Sensing, 3D Printing, IIoT, AI and AR/VR. At Jabil, our goal is to understand the technology trends and to implement new solutions for our customers that will also drive the market. For Miniaturization, Jabil does not only focus on the Manufacturing assembly process but also the advances in the PCB technology and IC packaging. This presentation will review these various technology processes and how they impact the industry, as well as the Contract Manufacturers and how it will effect the way they do business.
Rich Brooks has degrees in both Chemistry and Chemical Engineering and he has been in the Electronics industry for 30 years. His first role was with the Advanced Manufacturing Technology group at Motorola where he spent 14 years. After Motorola, he joined the Indium Corporation of America as the Global Technical Manager for 9 years. His most recent positions have been with the GE Oil&Gas Design team for 4 years and now for the past 2 years, he has been with the Jabil Design Organization. At Jabil, he manages a team of SMEs (Subject Matter Experts) with various areas of technical knowledge. Rich Brooks’ area of expertise is in the PCB and soldering materials technology.
Vendor show continues during and between talks - till the door prizes are given away.
3:15 Door prizes to be given away at end of day - must be present to win.
Tony Whitt - Intermountain Chapter Vice President
West Tech Automation
2011 Bannock St.
Denver CO. 80223
Tony Whitt - Intermountain Chapter Vice President
SMTA Intermountain Chapter Utah Golf Tournament - June 18, 2019Tuesday, June 18, 2019 | 8:30
Location: Birch Creek Golf Course, Smithfield Utah
Details still be finalized.
SMTA Intermountain Boise Golf TournamentThursday, August 15, 2019
Location: Shadow Valley
SMTA Intermountain Chapter Utah ExpoMonday, October 28, 2019 | 9:00 AM
Utah Vendor Expo actual date and location TBD. Will not be at U of U this year.
SMTA Intermountain Chapter "End of Year Social" Idaho GroupThursday, December 12, 2019
2019 SMTA Chapter planned activites
Planned SMTA Chapter Activities for 2019:
January: SMTA Intermountain Chapter Dinner and social for the Utah group, Salt Lake City, Utah – Mid January 2019
March: SMTA Intermountain Chapter at Boise State University, Boise, Idaho,– March 26th, 2019
June: SMTA Intermountain Chapter Utah Golf Tournament, Logan Utah– June 18, 2019
August: SMTA Intermountain Chapter Idaho Golf Tournament, Boise, Idaho – Mid August, 2019
October: SMTA Intermountain Chapter Utah Expo – Salt Lake City, Utah, Mid October, 2019
December: SMTA Intermountain Chapter “End of Year Social” Idaho group – Boise, Idaho, December, 2019.
Other activities may be scheduled as the company factory tours and speakers become available.
Photos from the 2018 Golf Outing
|Date / Time||Event||Location||Contact/Email|
June 18, 2019
|SMTA Intermountain Chapter Utah Golf Tournament - June 18, 2019||Birch Creek Golf Course, Smithfield Utah||
August 15, 2019
||SMTA Intermountain Boise Golf Tournament||Shadow Valley||
October 28, 2019
|SMTA Intermountain Chapter Utah Expo||TBD||
October 29, 2019
||Intermountain Utah Expo & Tech Forum||*NEW LOCATION* Weber State University||
December 12, 2019
||SMTA Intermountain Chapter "End of Year Social" Idaho Group||TBD||
Steve W. Greathouse (Plexus Corp.)
Phone : 208-898-1274
Vice President :
Tony Whitt (West Tech Automation)
Phone : 303-881-1623
Don Ellison Saunders (HP Inc. - Hewlett-Packard Company)
Phone : 208-866-5608
Robert Winter (L3 Technologies)
Phone : 801-725-0820
VP of Technical Programs :
Patrick Ryan (Ryan Technical Services)
Phone : 315-534-3316
Utah Golf Coordinator (Appointed) :
Gordan Jackman (Campbell Scientific, Inc.)
Phone : 435-227-9659
Idaho Golf Coordinator (Appointed) :
David C. Bell
Phone : 208-867-6006
Board Liaison :
Martin Anselm (Rochester Institute of Technology (RIT))
Phone Contact : 585-475-2005