Intermountain (ID, UT)

ID, UT 

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Chapter News

Utah Expo & Tech Forum

Thursday, October 19, 2017 
Location: University of Utah 
A. Ray Olpin University Union - Saltair Room
200 S Central Campus Drive
Salt Lake City, UT 84112

Attendees
 

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Thursday, October 19, 2017 
10:00AM–3:00PM

Free Technical Program & Schedule:

8:00AM
Registration opens

 

9:00AM – 9:45AM
BucknerIt All Starts with the Stencil
Speaker: Kevin Buckner, KYZEN

Because the majority of printing problems start at the printer level, we will discuss solder paste release, slumping of the solder block, solder balls being left in apertures and over pumping. Also, we will examine multiple ways to clean stencils and their apertures with different types of mechanical energy and different chemistries, including solvent and aqueous solutions. By attending this presentation, you will learn how small changes to process can yield big rewards in production.

10:00AM
Expo Opens

 

11:00AM – 11:45AM
GreathouseWater, Water, Everywhere: Understanding the tremendous damage that moisture causes to electronic components, how to control it, and what FA equipment do we use to analyze it. 
Speaker: Steve Greathouse, Plexus Corp.

Moisture is everywhere and is essential for life to exist. However, it is an unwanted partner in the assembly of electronic products. It is truly amazing to see the severe damage done by moisture to electronic components and boards during the manufacturing process. The sad thing is that most engineers, technicians, and operators don’t see the damage until it is overwhelmingly bad. How do you know how to tell when a part is moisture sensitive, how sensitive it is, how to control its exposure and moisture saturation, and how to protect against it damage will be a significant part of this presentation.

What types of equipment is used to detect these and other failures in products? A discussion of the different types of failure analysis equipment available, what data will it give you, and how to select the right type of equipment to get the results you want will be given.
12:00PM
Complimentary Lunch 

1:00PM - 1:45pm
RyanElectronic Manufacturing Trends and Outlook
Speaker: Patrick Ryan, Ryan Technical Services

After several years of lackluster growth, 2017 is rebounding with diversified growth in many of the key indicator markets. This paper looks at the key drivers and electronic market trends going forward. We will also look at macro-electronic packaging trends along with some consumer electronics trends driving consumer demand.

2:00PM - 2:45pm
BahouUnderstanding SIR
Speaker: Joe Bahou, Indium Corporation

Surface Insulation Resistance (SIR) testing is a commonly accepted means of determining the electrical reliability and corrosive nature of a solder flux residue. This presentation will discuss the basic process and principles of Surface Insulation Resistance (SIR) testing as prescribed by the IPC. It will also give a brief overview and comparison of the changes in SIR testing between J-STD-004A and J-STD-004B as well as the pros and cons of each method.

2:45PM
Tour of Materials Characterization Lab

Dr. Sean Clancy, Associate Director & Program Manager of the Materials Characterization Lab (MCL), will provide a tour of the MCL, a user research facility managed by the Materials Science and Engineering (MSE) Department at the University of Utah. The lab offers clients access to a wide-range of analytical instrumentation and services, including: Cross-Sectioning, DSC, FTIR, Instron mechanical testing, SEM-EDS, XRD, and much more. The MCL has an extensive history of successful collaborations with academia, government, and industry clients ranging from start-ups to multinational corporations in the aerospace, automotive, coatings, geochemical, medical, semiconductor, and other markets. MSE faculty and staff serve as resources in the following areas of specialization: bio-fuel cells, ceramics, composites, computational electronic materials and polymers, electronic materials and assemblies, explosive sensing, nanomaterials, nanotechnology, and more. Additional information is available at https://mcl.mse.utah.edu/.

3:00PM
Expo Closes

 


Current Exhibitor List:

Conductive Containers, Inc. 
Digitaltest, Inc. 
ERSA North America 
Fuji America Corporation 
Indium Corporation 
KYZEN Corporation 
Metcal 
Nikon Metrology, Inc. 
Photo Etch Technology 
PVA 
REStronics Rockies 
TAGARNO USA 
Technica, USA 
TestEquity LLC 
Universal Instruments Corporation 
West Tech Automation 

Companies in bold are SMTA corporate members






SMTA Intermountain Chapter Current Newsletter and Archives

2016 March Newsletter
2012 September Newsletter
2011 March Vendor conference
2011 February
2009 April January
2007 September
2006 November March
2005 August July May April February
2004 September June April






Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
August 11, 2016
8:00 am
Golf in Idaho Shadow Valley Golf Course 208-867-6006   David Bell 
dcbell@q.com
September 26, 2016
8:00 am
SMTAI Conference & Exhibition Donald Stephens Convention Center, Rosemont Ill 952-920-7682   Kaitlyn Gherity 
kaitlyn@smta.org
October 20, 2016
10:00 am
SMTA Utah Expo & Tech Forum University of Utah (952)920-7682   Kaitly Gherity 
kaitlyn@smta.org
November 10, 2016
4:00 pm
Idaho Technical Meeting Boise location - TBD 208-867-6006   David Bell 
dcbell@q.com
January 17, 2017
6:30 pm
Membership Appreciation Dinner, Idaho Izumi Japanese Steak House (208)850-2124   Sheldon Stewart 
sheldon.stewart@plexus.com
March 29, 2017
9:00 am
2017 Boise Expo and Technical Forum Boise State University 208-850-2124   Sheldon Stewart 
Sheldon.Stewart@plexus.com
June 20, 2017
8:00 am
SMTA 12th Annual Golf Scramble Birch Creek Golf Course, Smithfield Utah 435-227-9659   Gordan Jackman or Robert Winter 
gordan@campbellsci.com
August 17, 2017
9:00 am
Boise Golf Scramble Shadow Valley Golf Club (208) 898-1275   Sheldon Stewart 
Sheldon.Stewart@plexus.com
October 19, 2017
Intermountain Utah Expo & Tech Forum University of Utah 952-920-7682  Kaitlyn Gherity 
November 9, 2017
4:00 PM
Intermountain Chapter Meeting TBD (208)615-0063   Sheldon Stewart 
sheldon.stewart@plexus.com


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Our Chapter Leaders

President : Sheldon S. Stewart  (Plexus Corp.)
Phone : 208-898-1275

Vice President : Tony Whitt  (Automation Supply)
Phone : 303-881-1623

Secretary : Don Ellison Saunders  (Hewlett-Packard Company)
Phone : 208-866-5608

Treasurer : Robert Winter  (L3 Technologies)
Phone : 801-725-0820

VP of Technical Programs : Patrick Ryan  (Ryan Technical Services)
Phone : 315-534-3316

Webmaster (Appointed) : Steve W. Greathouse  (Plexus Corp.)
Phone : 208-898-1274

VP of Membership (Appointed) : Josh Matthew Huether  (Plexus Corp.)
Phone : 208-898-1201

Chapter Advisor (Appointed) : David C. Bell  
Phone : 208-867-6006

Director of Utah Golf (Appointed) : Gordan Jackman  (Campbell Scientific Inc.)
Phone : 435-227-9659

Board Liaison : Martin Anselm (Rochester Institute of Technology (RIT))
Phone Contact : 585-475-2005

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Global Participating Members of our Chapter

HISCO, Inc.

Plexus Corp.



Corporate Members of our Chapter

Blackfox Training Institute

Computrol Meridian

Computrol Orem

Krayden, Inc.

Micron Technology Inc



SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819