Intermountain (ID, UT)


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SMTA International

Chapter News

Utah Expo & Tech Forum - Held Thurs, Sept 20, 2018 at University of Utah-Student Union Bldg

Thursday, September 20, 2018 | 8:00 am
Location: University of Utah - Union Building

Free Technical Program & Vendor EXPO:

Registration Opens

9:15am - 10:00am:
1st Speaker


Expo Opens with vendor tables and display 

11:00am - 11:45am:
2nd Speaker 


12:00pm - 1:00pm:
Complimentary Lunch

A Big "Thank you" to Our Lunch Sponsors:

1:00pm - 1:45pm:
3rd Speaker:

2:30pm - 3:15pm
4th Speaker: 

4:00  Close and Cleanup
Parking is to the east of the Student Union building in the east parking lot. 

Get details and register here!

Questions? Contact:
Steve Greathouse

Boise SMTA Golf Scramble - Aug 21, 2018

Tuesday, August 21, 2018 | 8:00 am
Location: Shadow Valley Golf Club, 15711 Highway 55, Boise Idaho

Boise SMTA Golf Scramble - Aug 21, 2018
Shadow Valley Golf Club
SMTA Intermountain Chapter
Boise Golf Scramble
What:  SMTA Shadow Valley Golf 2018 - Golf Scramble
When:  Aug. 21st Shot gun start 8:00 AM with lunch following
Where:  Shadow Valley Course - Boise, Idaho

Team and Individual sign-up deadline Aug. 14th
Team and Hole Sponsor sign-ups also due at that time
We also welcome donations for prizes like closest to the pin, longest drive and others
Team sponsor $350—fees and lunch for 4 (sponsor may provide shirts or caps) Team Sponsor sign.
Hole sponsors:  $200 and choice of available hole.  Includes one player and hole sponsor sign.
Mulligans:  $10 each, Must purchase in advance
Individuals are Welcome!!  We will sign you up to a team.  Fee is just $65.  This includes Green fees, cart, range balls and lunch.  Please Join us! 
We guarantee you will have a good time!

Contacts to RSVP and for Sponsorships:
David Bell 208-867-6006 or

Contact for details about course, map: Shadow Valley Golf Club
15711 Highway 55, Boise Idaho.  Course Phone #208-939-6699

Questions? Contact:
David Bell

Plexus Nampa factory tour and technical presentation

Tuesday, May 1, 2018 | 5:00
Location: Plexus Corp, 16399 North Franklin Blvd, Nampa Idaho 83687

Plexus Factory Tour and Technical Presentation
Nampa Idaho
May 1, 2018
Sponsored by the SMTA Intermountain Chapter

What:  Plexus Factory Tour and Technical Presentation – Nampa Idaho
When:  May 1, 2018 (Tuesday) – 5:00- 7-00 pm
A short Plexus overview starts at 5:00.
Free Pizza and Soda will be served at 6:00 pm (during presentation)
Where:  Plexus Corp, 16399 North Franklin Blvd, Nampa, Idaho 83786
Technical Presentation:
New Advances In Humidification Technology, More Than Just ESD Control.
Presentation will be given by:
Richard (Ryk) Williams:
Business Development Manager – Aerospace, Defense & Electronics

Image result for nortec logo humidification
We Are Your Humidification & Evaporative Cooling Experts
MOBILE 509 628 6139   |   TOLL FREE 866 NORTEC1

Click on link for full details:

Questions? Contact:
Steve Greathouse
208 898-1274

Download a copy of the Moisture Sensitivity Presentation given Oct 19, 2017 at the U of U SMTA Expo.

Boise Expo & Tech Forum - Held March 20, 2018 at Boise State University

Tuesday, March 20, 2018 | 9:00 am
Location: Boise State University - Student Union Building, Jordan D Ballroom

Free Technical Program & Schedule:

Registration Opens

9:15am - 10:00am:
Strengths & Weaknesses of Current Stencil Technologies
Speaker: Greg Smith, Blue Ring Stencils
Download Presenation:

There are many stencil technologies available to the SMT Assembly industry.  Understanding these technologies can help the SMT Engineer choose the correct technology to maximize yields and maintain costs.  This presentation will explain current stencil technologies including laser and electroforming processes, stencil foil materials, step technology and nano-coating technologies currently available.   Solder paste transfer efficiency data will be shown in relation to specific manufacturing processes and foil materials.  Data related to the different step stencil and nano-coating technologies will also be presented.  Finally, SEM analysis of different manufacturing processes and foil technologies will be shown.


Expo Opens


11:00am - 11:45am:

How does Controlling Only Two Process Principles of Adhesives and Coatings Avoid Most Material Failure Mechanisms?

Speaker: Robert Hubbard, Ph.D., Lambda Technologies
Download Presenation

Many apparently different reliability failure problems can be traced back to a misunderstanding of basic material properties and the effects of temperature in assembly processes. Common industry practices in the design and manufacture of electronic products are based on incorrect assumptions and or misleading information about the choice, use, and process specifications of the organic adhesives, coatings, and dielectrics used in conjunction with metals, glasses, and semiconductor components. Fundamental thermomechanical properties of organic materials, their measurements, and their limits will be examined with examples of preventable failure mechanisms. Some simple basic rules will be provided to avoid these failure mechanisms in the design and process development stages of assembly and production of microelectronic packages.


12:00pm - 1:00pm:

Complimentary Lunch 

Thank you to Our Lunch Sponsors:


1:00pm - 1:45pm:

Understanding Lead-Tinning Requirements for Improved Quality and Reliability 
Speaker: Roger Cox, Component Tinning Services

This paper examines the need for a two, dynamic flow, solder pot, molten solder lead tinning process, what it achieves, and how it is successfully implemented and proven from a solderability proof perspective, including results obtained from XRF analysis, wetting balance measurements and ionic cleanliness testing, in conjunction and in compliance with IPC/EIA JSTD-001, IPC/EIA JSTD-002 and ANSI/GEIA STD-0006 standards.


2:30pm - 3:15pm
Voids in Solder Joints
Speaker: Raiyo Aspandiar, Intel Corporation
Download Presentation

Voids in solder joints continues to be a hot topic of discussion within the electronics manufacturing industry. The main interest stems from the impact that these voids have on the long term reliability of solder joints. But, not all solder joints voids are the same. This presentation will describe various types of voids observed in many types of solder joints. These void types include: Macrovoids, also called process voids, and inclusion voids specifically for leaded solder joints, which are the most widely known and studied voids in the literature; Planar Microvoids, also called champagne voids, which are mainly observed when soldering to certain types of surface finishes; Shrinkage Voids, also called sink holes, which are more common to lead-free Sn-Ag-Cu(SAC) solders than tin-lead solders, Micro Via voids, which are caused by vias in PCB lands; Pin hole voids, which are initially seen on the un-soldered PCB lands, and Intermetallic Compound (IMC) voids which generally occur within the IMC formed between two metals that have different diffusion rates within each other. Each category of Voids in Solder Joints will be described, their known root causes explained, ways of minimizing or even eliminating them will be listed, and the commonly understood effects of these voids on solder joint reliability will be discussed.


Expo Closes

Questions? Contact:
Steve Greathouse

SMTA Intermountain Chapter Current Newsletter and Archives

2016 March Newsletter
2012 September Newsletter
2011 March Vendor conference
2011 February
2009 April January
2007 September
2006 November March
2005 August July May April February
2004 September June April

Chapter Calendar of Events

Date / Time Event Location Contact/Email
August 21, 2018
8:00 am
Boise SMTA Golf Scramble - Aug 21, 2018 Shadow Valley Golf Club, 15711 Highway 55, Boise Idaho David Bell 
September 20, 2018
Intermountain Utah Expo & Tech Forum University of Utah Hannah Funk 
September 20, 2018
8:00 am
Utah Expo & Tech Forum - Held Thurs, Sept 20, 2018 at University of Utah-Student Union Bldg University of Utah - Union Building Steve Greathouse 

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Our Chapter Leaders

President : Steve W. Greathouse  (Plexus Corp.)
Phone : 208-898-1274

Vice President : Tony Whitt  (West Tech Automation)
Phone : 303-881-1623

Secretary : Don Ellison Saunders  (HP Inc. - Hewlett-Packard Company)
Phone : 208-866-5608

Treasurer : Robert Winter  (L3 Technologies)
Phone : 801-725-0820

Past President : Sheldon S. Stewart  (Plexus Corp.)
Phone : 208-898-1275

VP of Membership (Appointed) : Josh Matthew Huether  (Plexus Corp.)
Phone : 208-898-1201

Chapter Advisor (Appointed) : David C. Bell  
Phone : 208-867-6006

Utah Golf Coordinator (Appointed) : Gordan Jackman  (Campbell Scientific Inc.)
Phone : 435-227-9659

VP of Technical Programs (Appointed) : Patrick Ryan  (Ryan Technical Services)
Phone : 315-534-3316

Board Liaison : Martin Anselm (Rochester Institute of Technology (RIT))
Phone Contact : 585-475-2005

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Global Participating Members of our Chapter


Plexus Corp.

Corporate Members of our Chapter

Blackfox Training Institute

Computrol Meridian

Computrol, Inc.

Krayden, Inc.

Micron Technology, Inc.

SMTA Global Members

Amazon Celestica, Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA, Inc. NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819