Intermountain (ID, UT)ID, UT
Expos | Job Resources | Educational Grant | Students Only
SMTA Boise BSU EXPO - Postponed till July 14, 2020Tuesday, July 14, 2020 | 9:00 AM
Location: Boise State University, Boise Idaho, Student Union Building
SMTA Intermountain Chapter
BOISE STATE EXPO POSTPONED UNTIL JULY 14th
After careful consideration, the Intermountain Chapter of the SMTA is postponing the Boise State Expo, originally scheduled for March 10th, until July 14th. This is due to the impact of Covid-19, which is affecting the ability of speakers, exhibitors, and attendees to participate in this expo. The Intermountain Chapter officers are committed to insuring the health as the top priority, and further to insuring the success of the expo, and all felt that the correct decision from both perspectives was to postpone the show.
Please do no hesitate to reach out the officers with any questions.
Thank you, and we look forward to seeing you all this summer.
SMTA – Intermountain Chapter President
Boise BSU EXPO,
Tuesday, July 14, 2020
Boise State Union Building
18+ Suppliers showing their latest products.
Free lunch for Registered Attendees
COMPLIMENTARY LUNCH FOR ALL REGISTERED ATTENDEES
Door Prizes – Must be Present to Win
15th Annual Utah SMTA Intermountain Golf Scramble for 2020Tuesday, June 16, 2020 | 8:00 am
Location: Birch Creek Golf Course - Smithfield, Utah
Held at Birch Creen Golf Course
What: 15th Annual SMTA Golf Scramble 2020
When: June 16th, Tee Time 8:00 AM Shotgun Start with lunch following
Where: Birch Creek Golf Course, Smithfield Utah
We would like to have all Team and Individual sign-ups done by Tuesday June 9th.
Team and Hole Sponsor sign-ups also due at that time.
If you need a sponsor sign made please send a graphics file of your company logo.
Costs: Team sponsor $375. Includes Golf and Lunch for 4 players, and Team Sponsor Sign Hole sponsors: $175. Includes Golf and Lunch for 1 player, and Hole Sponsor Sign. Prize Hole sponsors for Long Drive (Men and Women), Closest to the Hole (Men and Women), and Straightest Drive. Please Provide Prizes for these special holes.
Mulligans: $10 each, Can Purchase Before or At the event.
Individuals are Welcome!! We will sign you up to a team. Fee is just $75.
This includes Green fees, cart, and lunch.
Please Join us! Contacts to RSVP and for Sponsorships:
Gordan Jackman at 435-227-9659 e-mail firstname.lastname@example.org or Robert Winter at 801- 594-7435 e-mail email@example.com
Contact for details about course, map: Birch Creek Golf, Smithfield, Utah 435-563-6825 www.birchcreekgolf.com
SMTA Intermountain Chapter Utah Expo - Weber State University-Oct 29, 2019Tuesday, October 29, 2019 | 9:00 AM
Location: Weber State University, Ogden, Utah,- Shepherd Student Union Building
Past Event: = Links to Presentations are still active:
Presentations from the Oct 29th, 2019 Utah EXPO at
Weber State University Shepherd Union Building, Ogden Utah.
For Copies of the Presentations - Click the below presentation links:
* Kyzen - Cleaning Process Do's and Don't - Carboni-Cain
* Data IO X-ray Reflow SMTA Weber State (Click Link to presentation)
- Data IO White paper on the X-ray issue: (Click Link to presentation)
* Foresite - Munson- Using Ion Chromatography and Ion(Click Link to presentation)
* Consumer Electronics CES 2019 - Hotvelt(Click Link to presentation)
8:30am - Registration
9:00am - 1st Technical Presenation
Dave Rohona, Senior Product Marketing Manager, brings over 36 years of expertise in customer applications, system service, product marketing and semiconductor relations in the device programming industry. During his tenure, Dave has developed a deep understanding and technical knowledge of device programming technologies and customer’s manufacturing applications and processes. Dave has a degree in Business finance and has attended the Stanford AeA Executive Institute’s, Technology Management program.
Oven Reflow and X-Ray Best Practices, for Preprogrammed Flash Memories
Abstract: Today’s modern luxury cars are governed by around one hundred million lines of code, and that number is likely to soar for connected and autonomous cars. According to Neil Shah, partner and research director, Counterpoint Research, “Storage is one of the fastest growing semiconductor applications in a connected autonomous car. The advanced in-vehicle infotainment (IVI), AI, and sensor driven autonomous driving systems generate large amounts of data that need to be processed and stored locally at the edge. The average capacity of storage required per vehicle is expected to balloon beyond 2TB by 2022.”
To support this explosive growth in software and data, automotive manufacturers are transitioning their storage architecture from the eMMC interface to Universal Flash Storage (UFS) and PCI express (PCIe/NVMe) to take advantage of the higher capacity, power efficiency, and higher performance that these memory technologies have to offer. Preprogramming is the preferred method used in automotive today, delivering the lowest total cost of programming. Preprogrammed flash memories processed through oven reflow and X-ray inspection require production line managers follow recommended best practices. This presentation will discuss the impact of thermal heat and dose radiation on preprogrammed Flash Memories along with Data I/O’s recommended best practices to ensure data retention post oven reflow and X-ray.
10:00am - Vendor tables and displays open to all attendees and visitors
Please plan to visit every table sometime during the day.
|Conductive Containers / Chemtronics|
|West Tech Automation / Mychronic|
|ASM Assembly Systems|
11:00am - 2nd Technical Presentation
Title: Failure Analysis – Using Ion Chromatography and Ion Chromatography Mass Spec (IC/MS)
Terry Munson – Owner and founder of Foresite Inc. a forensics laboratory for electronic assemblies and systems. Terry has 27 years of experience developing new techniques to better understand fabrication and assembly cleanliness issues and their impact on field performance. Prior to founding Foresite, Terry was employed with Delco Electronics where he applied ion chromatography analysis techniques to wafers, plating samples, and PCB / PCBAs, an industry first. He presented the new analysis techniques to the industry at IPC Expo 1990 in San Diego. As Senior Consultant, Terry directs a team of 20 staff members with four lead investigators supporting client
Abstract: Since the 1980s the electronics industry has utilized ion chromatography (IC) analysis to understand the relationship of ions, and some organics, to product reliability. From component and board fabrication, to electronic assemblies and their end-use environment, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware. Typical ions accounted for have included chloride, bromide, nitrate, sulfate, weak-organic acid (WOA), sodium and ammonium. Environmental and other concerns have driven the industry to adopt myriad flux formulations, which has created a need to further differentiate weak-organic acids beyond what a typical IC system can provide.
By utilizing an Ion Chromatography/Mass Spectroscopy (IC/MS) system optimized for organic separation, we can use the same column technology for the typical suite of anion/organic species, then run the sample through a quad-pole mass spectrometer which provides the molecular weight assessment of residues for over two dozen channels. This capability is critical to our failure analysis work at Foresite, as it allows for identification of specific organic acids and flux activators. This information can aid in identifying specific residue sources (e.g. board fabrication, SMT paste flux, waver solder liquid flux, hand solder flux or a completely different flux pen, or bottle or paste flux.)
12:00pm - Free Hot Lunch for Registered Attendees
1:00pm - 3rd Technical Tutorial/Presentation:
Scot F. Cain with slides prepared by Debbie Carboni
Title: Board Cleaning Process Do's and Don'ts.. Avoiding Common Pitfalls.
Debbie Carboni’s involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to provide customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real-world experience helps guide engineers during qualification to ensure success in production conditions.
Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations and is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. .
You are welcome to call or email Debbie for answers to your questions at firstname.lastname@example.org or +1 (215) 498 8856.
The cleaning approach and technology has significantly evolved over the last 10 years. What used to work may not be enough to meet the new standards, or new assemblies. Understanding the capabilities of your cleaning process is critical to establish process stability.
- Modern Cleaning advancements.
- Modern equipment Advancements
- Design considerations
- Environmental Myths
- Common Machine Set Up Blunders
- Common Process Control Blunders.
- Common Board Fixturing Blunders
- Rinsing is not just DI Water
- How to effectively clean modern assemblies to meet the new standards, and more importantly, be reliable and prove it.
- Videos illustrating different nozzle and pressure impact on the cleaning rate
- New test coupons for qualifying, optimizing and monitoring cleanliness
- Passed and Failed test coupons
Title: Consumer Electronics Industry Trends
Biography: Claire Hotvedt is a Product Development Specialist for the PCB Assembly business unit based at Indium Corporation Headquarters.. Claire also oversees product characterization and creation of marketing material to assist the sales team. Prior to joining Indium Corporation in 2018, Claire held two engineering positions one at Orthogonal, Inc. and one at Bristol-Myers Squibb. Claire earned her bachelor’s degree in chemical engineering, with a minor in Mandarin Chinese, from the University of Rochester.
Abstract: You are invited to take a walk through the 2019 Consumer Electronics Show as seen through the eyes of Indium Corporation’s PCB Assembly Product Development Specialist, Claire Hotvedt. You will be introduced to the latest consumer electronics including medical wearables, 5G, autonomous vehicles, displays, and smart home appliances.
4:00 - Drawings for door prizes (Must be present to win!!)
A larger map of the campus can be found at this link:
2020 SMTA Intermountain Chapter planned activities
Planned SMTA Chapter Activities for 2020:
January: SMTA Intermountain Chapter Dinner and social for the Utah group, Salt Lake City, Utah – 18 January 2020
March: SMTA Intermountain Chapter, Boise State University EXPO, Boise, Idaho,– March 10, 2020
June: SMTA Intermountain Chapter Utah Golf Tournament, Smithfield, Utah– June 16, 2020
August: SMTA Intermountain Chapter Idaho Golf Tournament, Boise, Idaho – Mid August, 2020
October: SMTA Intermountain Chapter Utah Expo – Weber State College, Ogden Utah - Oct 20, 2020
December: SMTA Intermountain Chapter “End of Year Social” Idaho group – Boise, Idaho, December, 2020
Other activities may be scheduled as company factory tours and speakers become available.
Check this web site regularly to get further details of the events.
|Date / Time||Event||Location||Contact/Email|
June 16, 2020
|15th Annual Utah SMTA Intermountain Golf Scramble for 2020||Birch Creek Golf Course - Smithfield, Utah||
Gordan Jackman at 435-227-9659 e-mail email@example.com or Robert Winter at 801- 594-7435 e-mail firstname.lastname@example.org
email@example.com or firstname.lastname@example.org
July 14, 2020
||Intermountain (Boise) Expo & Tech Forum||Boise State University - Jordan ABC Room||
July 14, 2020
|SMTA Boise BSU EXPO - Postponed till July 14, 2020||Boise State University, Boise Idaho, Student Union Building||
October 20, 2020
||Intermountain Utah Expo & Tech Forum||Weber State University - in Shepard Union||
Josh Matthew Huether (Plexus Corp.)
Vice President :
Tony Whitt (West Tech Automation)
Robert Winter (L3Harris)
VP of Technical Programs :
Patrick Ryan (Ryan Technical Services)
Webmaster (Appointed) :
Steve W. Greathouse (Plexus Corp.)
Newsletter Editor (Appointed) :
Michael Fric (Plexus Corp.)
VP of Communications (Appointed) :
Brooke Taubenheim (Plexus Corp.)
VP of Golf - Idaho (Appointed) :
David C. Bell
VP of Golf - Utah (Appointed) :
Gordan Jackman (Campbell Scientific, Inc.)
Social Activities Chair (Appointed) :
Sunny Plaisted (Pexus Corp.)
Operations Coordinator (Appointed) :
Sheldon S. Stewart (Plexus Corp.)
Board Liaison :
Robert Boguski (Datest Corporation)