SMTA Houston Expo and Tech Forum
Thursday, March 9, 2017
Location: Stafford Centre
10505 Cash Road
Stafford, TX 77477
Attendees Free Technical Program & Schedule:
Technology Developments to Increase Reliability of Pb-Free Solders
Tim Jensen, Product Manager, PCB Assembly Materials, Indium Corporation
Since 2006 when Pb was restricted in most electronics, there have been many major efforts to ensure reliable Pb-Free solder joints. The technology of electronics devices has also advanced in many ways that further impact reliability. In this presentation, we will cover many of the trends that have the potential to impact solder joint reliability as well as several material and process advancements that have been developed to improve mechanical and thermal reliability of the solder joints.
Join us for Complimentary Lunch and Networking on the Show Floor – PLUS Raffle Prize Drawings!
Special Thanks to Our Lunch Sponsor: NPI Technologies
Minimizing Voiding In SMT Assembly of BTCs
Ron Lasky, Ph.D., Instructional Professor at Dartmouth College and a Senior Technologist at Indium Corporation
Bottom terminated components (BTCs) are one of the most important components in electronics today. Their combination of small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC) has resulted in BTCs becoming one of the most common packages with the highest growth rate. Prismark estimates that in 2016 the most common BTC, the quad-flat pack no-leads (QFN), will comprise 16% of all IC packages at 44 billion with the highest compound annual growth rate of 17%.
Since one of the main strengths of QFNs is dissipating heat, any voiding of the solder connecting the thermal pad on the QFN to that of the printed wiring board (PWB) will degrade the intended performance of the QFN. This degraded thermal performance may result in reliability and operational issues.
As a result of the voiding concern, we and our colleagues have performed a thorough analysis and experimental plan to minimize voiding in QFN assembly. Our experimental plan covers many process and materials parameters. We were successful in reducing voiding to less than 10% in most instances. This presentation will discuss this work.
End of Show Grand Prize Drawing!
Current Exhibitor List:
Companies in bold are SMTA corporate members
|AIM/Production Automation |
ASM Assembly Systems, LLC
Benchmark Electronics Inc.
Conductive Containers, Inc.
Creative Electron, Inc.
DG Marketing Corporation
ERSA North America
Eternity Technology Corporation
Fablicator 3D Printers by K&L Services Group Inc.
Fuji America Corporation
JBC Tools USA Inc.
LPKF Laser and Electronics
Nikon Metrology, Inc.
Nordson ASYMTEK/Torenko & Associates
|NPI Technologies, Inc. |
PAC Global, Inc.
Panasonic Factory Solutions
PARMI USA INC
ProActive Process Solutions Group, LLC
Rehm Thermal Systems LLC
Seika Machinery, Inc.
Smart Splice LLC
STI Electronics, Inc.
Sunshine Global Circuits
The IPS Group, LLC
Universal Instruments Corporation
V-J Electronic Assemblies
Vision Engineering, Inc.
YXLON International, Inc.
The Houston Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at email@example.com or call 952-920-7682. Thank you!
The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on February 10th, 2017!
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Important Exhibitor Materials:
Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.
VP of Technical Programs :
Navin Kalidas (Texas Instruments (Retired))
Phone : 281-528-2938
VP of Membership :
Don Mayse (Schlumberger)
Phone : 281-769-4613
Technical Committee (Appointed) :
Chandradip Patel (Schlumberger)
Phone : 202-341-3122
Board Liaison :
Timothy Jensen (Indium Corporation)
Phone Contact : 315-853-4900
Email Address : firstname.lastname@example.org
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344