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Chapter News

SMTA Houston Expo and Tech Forum

Thursday, March 9, 2017 
Location: Stafford Centre 
10505 Cash Road
Stafford, TX 77477


Free Technical Program & Schedule: 

Registration Opens

Expo Opens

Tim Jensen Technology Developments to Increase Reliability of Pb-Free Solders 
Tim Jensen, Product Manager, PCB Assembly Materials, Indium Corporation 

Since 2006 when Pb was restricted in most electronics, there have been many major efforts to ensure reliable Pb-Free solder joints. The technology of electronics devices has also advanced in many ways that further impact reliability. In this presentation, we will cover many of the trends that have the potential to impact solder joint reliability as well as several material and process advancements that have been developed to improve mechanical and thermal reliability of the solder joints. 

Complimentary Lunch!

Join us for Complimentary Lunch and Networking on the Show Floor – PLUS Raffle Prize Drawings! 

Special Thanks to Our Lunch Sponsor: NPI Technologies


Ron LAskyMinimizing Voiding In SMT Assembly of BTCs 
Ron Lasky, Ph.D., Instructional Professor at Dartmouth College and a Senior Technologist at Indium Corporation

Bottom terminated components (BTCs) are one of the most important components in electronics today. Their combination of small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC) has resulted in BTCs becoming one of the most common packages with the highest growth rate. Prismark estimates that in 2016 the most common BTC, the quad-flat pack no-leads (QFN), will comprise 16% of all IC packages at 44 billion with the highest compound annual growth rate of 17%.

Since one of the main strengths of QFNs is dissipating heat, any voiding of the solder connecting the thermal pad on the QFN to that of the printed wiring board (PWB) will degrade the intended performance of the QFN. This degraded thermal performance may result in reliability and operational issues.

As a result of the voiding concern, we and our colleagues have performed a thorough analysis and experimental plan to minimize voiding in QFN assembly. Our experimental plan covers many process and materials parameters. We were successful in reducing voiding to less than 10% in most instances. This presentation will discuss this work. 


End of Show Grand Prize Drawing!

Current Exhibitor List:

AIM/Production Automation 
ARQ Electronics 
ASM Assembly Systems, LLC 
BBM, Inc. 
Benchmark Electronics Inc. 
Chem Logic 
Cirexx International 
Conductive Containers, Inc. 
Creative Electron, Inc. 
DG Marketing Corporation 
Eatman Associates 
Electronic Interconnect 
ERSA North America 
Eternity Technology Corporation 
Europlacer Americas 
Fablicator 3D Printers by K&L Services Group Inc. 
FHP Reps 
Fuji America Corporation 
Geospace Technologies 
GPD Global 
Hisco, Inc. 
JBC Tools USA Inc. 
KYZEN Corporation 
LPKF Laser and Electronics 
Nikon Metrology, Inc. 
Nordson ASYMTEK/Torenko & Associates 
Nordson DAGE 
Nortec Humidity 
NPI Technologies, Inc. 
PAC Global, Inc. 
Pace Worldwide 
Panasonic Factory Solutions 
ProActive Process Solutions Group, LLC 
Prototron Circuits 
Rehm Thermal Systems LLC 
Rich Sales 
Seika Machinery, Inc. 
Smart Splice LLC 
Southwest Sytems 
STI Electronics, Inc. 
Sunshine Global Circuits 
TestEquity LLC 
Texmac/Takaya Inc. 
The IPS Group, LLC 
Transforming Technologies 
Trylene, Inc. 
Universal Instruments Corporation 
V-J Electronic Assemblies 
Vi Technology 
Vision Engineering, Inc. 
YXLON International, Inc. 

Companies in bold are SMTA corporate members

The Houston Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on February 10th, 2017! 

Click here for Ad and Sponsorship opportunities!

Important Exhibitor Materials:

Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
March 9, 2017
10:00 am
17th Annual SMTA Houston Expo & Tech Forum Stafford Center 832-374-0057   Julio Estrada 

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Our Chapter Leaders

President : Mario Perez Dipasupil Jr.  (FairfieldNodal, Inc.)
Phone : 713-294-3757
Email : mdipasupil@fairfieldnodal.com

Vice President : Julio A. Estrada  (STI Electronics, Inc.)
Phone : 832-374-0057
Email : jestrada@stielectronicsinc.com

Secretary : John K. Ng  (ABC Assembly)
Phone : 713-983-7192
Email : jng@abc-assembly.com

Treasurer : Glen A Herzog  
Phone : 281-851-5923
Email : glen.herzog@sbcglobal.net

VP of Technical Programs : Navin Kalidas  (Texas Instruments (Retired))
Phone : 281-528-2938
Email : nc_kalidas@yahoo.com

VP of Membership : Don Mayse  (Schlumberger)
Phone : 281-769-4613
Email : dmayse@slb.com

Technical Committee (Appointed) : Chandradip Patel  (Schlumberger)
Phone : 202-341-3122
Email : cpatel7@slb.com

Board Liaison : Timothy Jensen (Indium Corporation)
Phone Contact : 315-853-4900
Email Address : tjensen@indium.com

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Global Members of our Chapter


Corporate Members of our Chapter

ARQ Electronics Manufacturing Services, Inc.


Houstech, Inc.

N.F. Smith & Associates, L.P.

Nortec Humidity


Trylene, Inc.

SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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