Dallas

Dallas Expo & Tech Forum

Event Schedule:
Postponed to October 27th
Setup is October 26th, 12:00pm - 4:00pm
 
October 27th

• 8:00 Registration opens
• 8:30 Speaker 1
• 9:15 Keynote Speaker 2
• 10:00 EXPO Opens
• 11:00 Speaker 3
• 12:00 Lunch starts
• 1:30 Speaker 4
• 3:00 EXPO Closes
• 3:30 Happy Hour Starts (with Jeopardy Game)
• 3:45 Live! Jeopardy (A Fun Game with a Technical Format)
  • Moderator: Dr. Mark Currie - Director of Solder (Henkel)
  • Judge: Chrys Shea, Shea Engineering Services
  • Judge: Dr. Neil Poole - Chemistry Fellow (Henkel)
  • Contestants: 4 of the leading DFW Process Engineers

First Expo Speaker:

CT Scanning: 3 Case Studies

Speaker: Rob Boguski, Datest

Digital Computed Tomography, or CT Scanning, has advanced in both equipment as well as techniques in recent years, such that it has now become the method of choice in many applications where workmanship, fabrication, process, and component-related defects are difficult, and often otherwise virtually impossible to find. Nevertheless misconceptions linger concerning the suitability of CT scanning as a nondestructive test and failure analysis methodology. This presentation will address some of those misconceptions by featuring 3 specific and recent applications of CT scanning, illustrating its wide potential for use as a diagnostic tool. Examples will be shown from the medical/biotech, military/aerospace, and electronics sectors. In each case we will state the specific problem to be addressed; highlight some significant, if not decisive images; and show conclusions drawn from compilation and analysis of the images, with any applicable lessons learned along the way.

Second Expo Speaker:

The Future of the Digital Thread - Industry 4.0

Speaker: Dr. Don Kinard, Lockheed Martin Senior Fellow

For the past 20 years the Digital Thread has enhanced development of manufacturing technologies including robotics, automation, graphical work instructions, AR, optical/laser projection, and more recently, the introduction of laser and structured light scanning. This digital thread has also brought industry to the foothills of the next industrial revolution, Industry 4.0, the revolution of data. The introduction of integrated IT architectures, the application of analytics and AI, as well as the focus on data strategy and data automation will dramatically change the landscape of corporations as they look for these new technologies to provide improved unprecedented insight into performance and the ability to predict and mitigate disruptions. As with previous revolutions some companies will fail to embrace the technology and flounder, and others will ride the data wave to secure their future.  
 

Third Expo Speaker:

See the Heat - Troubleshooting PCB & Electronic Product Design with Thermal Imaging

Speaker: Desmond Lamont, FLIR Systems Inc.

As electronic circuit boards and components get smaller and more powerful, inherent heat can cause failures and significant damage. FLIR Business Development Manager for Science, Jerry Feeney, compares traditional temperature measurement devices with infrared imaging. He uses real-world infrared images and examples to detail how infrared thermography can more easily identify hot spots, allowing for improved thermal management and greater advances in circuit board design.

Fourth Expo Speaker:

Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations

Speaker: Dale Lee, Plexus Corporation

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume.  The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces.  However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.  This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

Thank You to Our Door Prize Sponsor:

Thank You to Our Breakfast Sponsor:

Thank You to Our Happy Hour Sponsor:

Other Sponsors:

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President : Gary Tanel  (Electronics Alliance)

Vice President : Jack Harris  (Koki Solder America)

Secretary : Keith Larson CID  (Summit Interconnect)

Treasurer : Jim Baker  

VP of Membership : Melanie Rodriguez  (HumCap)

VP of Technical Programs : James David Boyd  (Krypton Solutions)

Technical Committee (Appointed) : Dr. Viswam Puligandla Ph.D.  (Nokia)

Technical Committee (Appointed) : Darrell Ray 30715  (DRS Technologies)

Newsletter Editor (Appointed) : Karl S. Doebbert  (Prototron Circuits)

VP of Events : Glenn Robertson  (Process Sciences Inc.)

Webinars and Social Media Coordinator (Appointed) : Chintan Sutaria  (CalcuQuote)

Website and Invitations Coordinator (Appointed) : Kaitlyn Dotson  (CalcuQuote)

Board Liaison : Richard Coyle (Nokia Bell Labs)

Creation Technologies Inc.

Nokia

Alliance Rubber Company

Ampthink

BBM, Inc.

Conecsus LLC

DG Marketing Corporation

E.T.S. Group, Inc.

Electrolab, Inc.

Electrolube

Fujitsu Networks Comunications

Garland Service Company

Krypton Solutions

LeeMAH Electronics

National Circuit Assembly

NPI Technologies, Inc.

PAC Global, Inc.

PCBA Supplies

Precision Technology, Inc.

SPEA America

Sunshine Global Circuits

Super PCB

SVTronics, Inc.

Test Technology Associates

Trilogy Circuits, Inc.

Variosystems, Inc.

CalcuQuote

Epec

Kentzy International, Inc.

Precision PCB Services, Inc.

Verion Training Systems

SMTA Global Members