Carrollton, TX 75006

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Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design


Greg Smith, Field Applications Engineer, Fineline Stencil


Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability.  These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process.   It’s commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process.  As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.   This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause.   Outer layer copper weight and surface treatment will also be addressed as to their effect on printability.  Experiments using leadless and emerging components will be studied and root cause analysis will be presented on the following common SMT defects:

  • Poor Solder Paste Release: Focus will be placed on small components
  • Solder-balls (Mid Chip Solder Beads): Stencil design to minimize solderballs
  • Tombstoning: Improving tombstoning with stencil design
  • Bridging at Print: Simple guidelines to eliminate bridging
  • Insufficient Solder Volume at SMT Reflow: Look at the correlation of stencil design to solder volume after reflow
  • Bridging at SMT Reflow: What causes bridging after reflow when it is not present after print
  • Voiding: Design ideas to reduce voiding through stencil design

This paper summarizes the results of this study with respect to the variables tested. Root Causes of these challenges will be identified and practical stencil design recommendations will be made with the intent of eliminating defects and improving yields during the printing process.


Date: June 2, 2017 @ 11am
Location: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line (see below)
  • 1:00pm - Adjourn

  • 11:00am - Check in and Networking
  • 11:30am - Lunch Begins
  • 11:45am - Chapter Announcements
  • 12:00am - Feature Presentation
  • 1:00pm - Adjourn

Speaker Bio:

Greg Smith has worked in the electronics industry since 1989. He was the owner and President of a stencil manufacturing company for 23 years prior to joining FCT Assembly.  He now is the Field Applications Engineer supporting customers technically with stencil design and root cause analysis to improve customer yields.  He holds a B.S. in Business Management from Letourneau University and has been in the SMT Stencil industry for 28 years.

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Thank you!

The Dallas Chapter Volunteers and HQ staff thank you for helping to make the 2017 Dallas SMTA EXPO another big success. We already have sponsors, exhibitors, and attendees interested in the 2018 EXPO. If you didn’t get a chance to submit a survey and if you have a comment, we would love to hear from you via call or e-mail.

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Award winners!

The Dallas chapter of the SMTA is proud to announce two award-winners among us!  The SMTA Board of Directors has selected Gary Tanel to receive the prestigious 2016 Founder's Award (SMTA’s highest honor), which will be presented to him at SMTA International in Rosemont in September.  This award recognizes not only Gary’s contributions to the SMTA, but also to the industry at large.  Gary is currently the Dallas chapter president.

The SMTA Board of Directors has also recognized Viswam Puligandla with the 2016 Excellence in Leadership award.  Viswam is currently one of the Dallas chapter’s technical advisers.

Be sure to congratulate these two men when you see them at the next chapter meeting.

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Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
January 13, 2017
11:00 am
Chapter Meeting Aboca's Italian Grill 972-672-2506   Gary Tanel 
April 7, 2017
11:00 am
Protecting the Supply Chain from Counterfeit Electronic Components Aboca's Italian Grill 972-672-2506   Gary Tanel 
May 5, 2017
11:00 am
Chapter Meeting: HDI Manufacturing and Design Aboca's Italian Grill 972-672-2506   Gary Tanel 
June 2, 2017
11:00 am
Stencil Printing and Design Aboca's Italian Grill 972-672-2506   Gary Tanel 
July 15, 2017
06:00 pm
Top Golf Top Golf 972-672-2506   Gary Tanel 
September 10, 2017
09:00 am
SMTA-I Rosemont, IL 972-672-2506   Gary Tanel 
October 6, 2017
11:00 am
Advanced Packaging Aboca's Italian Grill 972-672-2506   Gary Tanel 
November 10, 2017
Geek-A-Palooza TBA 952-920-7682   Karen Frericks 
November 14, 2017
Certification - SMT Processes - November 14-16 (Dallas,TX) Verion Training Systems   Jenny Ng 
December 1, 2017
06:00 pm
Member Appreciation Party Addison Conference and Theatre Centre 972-672-2506   Gary Tanel 
May 16, 2018
Medical Device Conference University of Texas at Dallas 952-920-7682   Jenny Ng 

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Our Chapter Leaders

President : Gary Tanel  (Libra Industries)
Phone : 972-672-2506
Email : gtanel@libraind.com

Vice President : Jack Harris  (The IPS Group, LLC)
Phone : 214-908-3336
Email : jharris@theipsgroup.net

Secretary : Keith Larson CID  (Summit Interconnect)
Phone : 817-915-5664
Email : Keith.larson@summit-pcb.com

Treasurer : Jim Baker  (Spectra Sales Corporation)
Phone : 214-912-4103
Email : jim.baker1@verizon.net

VP of Technical Programs : Darrell Ray  (DRS Technologies)
Phone : 214-507-2117
Email : darrell.ray@gmail.com

VP of Membership : Carol Primdahl  (Krypton Solutions)
Phone : 214-882-2363
Email : carol@krypton-solutions.com

Webmaster (Appointed) : Chintan Sutaria  (CalcuQuote)
Phone : 909-278-8233
Email : csutaria@calcuquote.com

Technical Committee (Appointed) : Riki G. Brown  
Phone : 951-733-2806
Email : rbrown@leemah.com

Technical Committee (Appointed) : Viswanadham Puligandla Ph.D.  (Nokia (Retired))
Phone : 972-355 7107
Email : viswam38@gmail.com

Technical Committee (Appointed) : Glenn Robertson  (Process Sciences Inc.)
Phone : 972-960-2323
Email : glennr@process-sciences.com

Technical Committee (Appointed) : Michael Barnes  (Fujitsu Network Communications, Inc.)
Phone : 972-479-2280
Email : michael.barnes@us.fujitsu.com

Newsletter Editor (Appointed) : Karl S. Doebbert  (Prototron Circuits)
Phone : 214-675-7017
Email : karlD@Prototron.com

Set Up Committee (Appointed) : Jimmy Randolph Fallin  (Philips Entertainment)
Phone : 214-647-7960
Email : jimmy.fallin@philips.com

Board Liaison : Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880
Email Address : s.sparacino@zestronusa.com

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Global Participating Members of our Chapter

Creation Technologies Inc.

Keysight Technologies


Corporate Members of our Chapter

Alliance Rubber Company

BBM, Inc.


Conecsus LLC

CR Assembly Corporation

DG Marketing Corporation

E.T.S. Group, Inc.

Electrolab, Inc.

Fujitsu Network Communications, Inc.

G-Force Reps, Ltd.

GSC (Garland Service Company)

JTAG Technologies

Krypton Solutions

Mek Americas

National Circuit Assembly

NPI Technologies, Inc.

Osai Automation System USA Corporation

PAC Global, Inc.

Philips Entertainment

Precision Technology, Inc.

Raytheon Company

Southwest Systems Technology Inc.

SPEA America

Sunshine Global Circuits

Super PCB

SVTronics, Inc.

Test Technology Associates

TestEquity LLC

The IPS Group, LLC

Trilogy Circuits, Inc.

Variosystems, Inc.


SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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