Oregon

OR 

Chapter News  |  Calendar  |  Chapter Officers  |  Corporate Members
Expos  |  Job Resources  |  Educational Grant  |  Students Only




Chapter News

Joint Technical Seminar Program

IEEE Joint CPMT/CAS & SMTA Oregon Chapters

(in cooperation with IMAPS, IPC & EMA) presents

Microelectronic Systems for Improved Quality of Life

With Julius Georgiou, University of Cyprus,

Distinguished Lecturer of IEEE Circuit and

Systems Society

 

Thursday, June 1st, 2017, 6.00–8.00pm

PCC Willow Creek Center, Room 311

(the seminar room sponsored by the PSU ECE department)

241 SW Edgeway Drive (near SW 185th and Baseline Road)

Beaverton, OR 97006

Directions: http://www.pcc.edu/about/locations/willow-creek/

Information: https://meetings.vtools.ieee.org/m/45443

Registration: https://meetings.vtools.ieee.org/meeting_registration/register/45443

 

(No cost Registration to help in planning the refreshments)

 

Agenda:

6:00pm Refreshments and social

6:30pm Presentation

7:30pm Questions and Discussion

Abstract:

Microelectronic revolutions come in waves that are driven by necessity. Currently, the aging population is creating a need for various kinds of electronic systems to improve their quality of life. These include the restoration of lost functionality via electronic implants, better health screening technology and noninvasive monitoring in the home environment. In this talk I will present work that has been done towards addressing these needs, whether it be through the development of new required building blocks or through the development of more complex systems that combine custom built hardware and software. In particular the talk covers work done towards developing a vestibular implant for balance restoration, a single chip low-power imager for a bionic eye, a cancer screening capsule for detecting early-stage carcinomas in the small intestine and a bio-inspired acoustic scene analysis system.

 

Biography:

Julius Georgiou (IEEE M’98-SM’08) is an Associate Professor at the University of Cyprus. He received his M.Eng degree in Electrical and Electronic Engineering and Ph.D. degree from Imperial College London in 1998 and 2003 respectively. For two years he worked as Head of Micropower Design in a technology start-up company, Toumaz Technology. In 2004 he joined the Johns Hopkins University as a Postdoctoral Fellow, before becoming a faculty member at the University of Cyprus from 2005 to date.

 

Prof. Georgiou is a member of the IEEE Circuits and Systems Society, is the Chair of the IEEE Biomedical and Life Science Circuits and Systems (BioCAS) Technical Committee, as well as a member of the IEEE Circuits and Systems Society Analog Signal Processing Technical Committee. He served as the General Chair of the 2010 IEEE Biomedical Circuits and Systems Conference and is the Action Chair of the EU COST Action ICT-1401 on “Memristors-Devices, Models, Circuits, Systems and Applications - MemoCIS”. Prof. Georgiou has been selected as an IEEE Circuits and Systems Society Distinguished Lecturer for 2016-2017. He is also is an Associate Editor of the IEEE Transactions on Biomedical Circuits and Systems and Associate Editor of the Frontiers in Neuromorphic Engineering Journal. He is a recipient of a best paper award at the IEEE ISCAS 2011 International Symposium and at the IEEE BioDevices 2008

Conference. In 2016 he received the 2015 ONE Award from the President of the Republic of Cyprus for his research accomplishments. His research interests include Low-power analog and digital ASICs, implantable biomedical devices, bioinspired electronic systems, electronics for  space, braincomputer-interfaces (BCIs), memristive devices, inertial and optical sensors and related systems.






SMTA Members of Distinction Awards

SMTA has recognized exceptional Individual and Corporate Members for their immeasurable contributions to the Association since 1994.

Please join us to show our 
appreciation for SMTA members dedicated to preserving the traditions of the association and maintaining high standards of professionalism in the industry.

We invite you to take a 
few minutes to nominate individual or corporate members for one of the prestigious SMTA awards to be presented at the SMTA International Conference.

Click here for more information and to view last year's honorees!

Nominations can be submitted online at http://smta.org/awards/awardscfm.  The nomination deadline is May 30, 2017






Low-Temperature Solders

Date: Wednesday March 22, 2017

Time: 4:30PM-7:00PM

Venue: Axiom Electronics

Address: 19545 NW Von Neumann Drive, Beaverton, OR 97006

 

The transition to Pb-free solders in electronics began in the early 1990s as a follow-on to the elimination of Pb-bearing solders from potable water systems and food handling equipment (1986).  The objective was to develop a single alloy having solidus and liquidus temperatures that were equal to, or less than, the eutectic temperature of the 63Pb-37Pb solder.  Three alloy development efforts were undertaken by Sandia Laboratories either as standalone projects or as a participant in one of the following partnerships: (1) U.S. Army, Redstone Arsenal (Huntsville, AL); (2) AT&T Engineering Research Center (AT&T/ERC, Princeton, NJ), and (3) National Center for Manufacturing Sciences (NCMS, Ann Arbor, MI).   The soldering technology data, which were developed from these efforts, were in three general categories: (a) existing, very low melting temperature solders 52In-48Sn (In-Sn) and 97In-3Ag (In-Ag); (b) development of the Sn-Ag-Bi solder (largest effort); and (c) the creation of non-Pb alloy compositions that achieved melting temperatures equivalent to eutectic Sn-Pb solder.  The In-Sn and In-Ag solders continue to find niche applications in optoelectronics and sensor products.  A materials and modeling database was developed for these solders as a toolset for predicting solder joint reliability.  The most widely-studied alloy is the 91.84Sn-3.33Ag-4.83Bi solder having the solidus temperature of 212°C.  Materials data included solderability testing to support process development activities as well as intermetallic compound (IMC) growth behavior and Pb contamination data necessary for predicting solder joint reliability.  The temperature cycling of printed wiring assembly (PWA) test vehicles provided TMF test data while materials properties data supported the computational models for predicting TMF.  The discussion will wrap up with a brief analysis of the Pb-free solder composition having solidus temperature (Ts) equivalent to that of the eutectic Sn-Pb alloy: 66Sn-5.0Ag-10Bi-5.0Au-10In-4.0Cu alloy, Ts = 178°C.  This material exhibited good solderability on Cu with a contact angle of 34.2+0.7°.  The physical metallurgy principles will be discussed that were used to develop this and similar, Sn-based, very low melting temperature solders.

 

[1] Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy’s National Nuclear Security Administration under Contract No. DE-AC04-94AL85000.

Paul T. Vianco received a Ph.D. degree in Materials Science from the University of Rochester (New York) in 1986. He joined Sandia National Laboratories, Albuquerque, New Mexico in 1987 where he is currently a distinguished member of the technical staff.  Paul has been involved in all aspects of packaging interconnection technology: materials, processing, and reliability. Paul is a fellow of the American Welding Society (AWS) and ASM, International. He is also the author of the Soldering Handbook – Third Edition (2000) and Guideline for Hand Soldering Practices (2016), both of which are published by the AWS.






SMTA Certification

 SMT Processes- August 15-17, 2017 (Portland, OR)

                Now available in Oregon!

 

·        August 15- Course (8:30-5pm)

·        August 16- ½ day of course + exam

·        August 17- All day exam (8:30-5pm)


Instruction: English 
Test: English 
Instructor: Jim Hall, ITM Consulting

               For more information, http://www.smta.org/certification/






Follow us on Twitter and Join our Facebook Page!

 
 






Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
January 18, 2017
4:30 pm
Understanding PCB Design & Material Warpage Challenges BiAmp 503-696-1542   Pedro J Martinez 
pedro.j.martinez@intel.com
February 27, 2017
04:30 pm
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Axiom Electronics, LLC 503-696-4072   Pedro J Martinez 
pedro.j.martinez@intel.com
March 22, 2017
4:30 pm
Low Temperature Solders; Processing and Reliability Axiom 5036961542   Pedro J Martinez 
pedro.j.martinez@intel.com
April 19, 2017
08:30 am
Chapter Training Day : Defect Analysis & Process Trouble Shooting Axiom 5036961542   Pedro J Martinez 
pedro.j.martinez@intel.com
June 1, 2017
06:00 pm
Microelectronic Systems for Improved Quality of Life PCC Willow Creek Center, Room 311 5036961542   Pedro J Martinez 
pedro.j.martinez@intel.com
August 15, 2017
Certification - SMT Processes - August 15-17 (Portland, OR) - -   Jenny Ng 
August 15, 2017
08:30 am
SMT Processes Certification Course TBD 952-920-7682   Jenny Ng 
jenny@smta.org


Back to Top



Our Chapter Leaders

President : Alexander Schreiner  (Newson USA LLC)
Phone : 503-758-6491
Email : alex.schreiner@frontier.com

Vice President : Pedro J. Martinez  (Intel Corporation)
Phone : 503-696-1542
Email : pedro.j.martinez@intel.com

Treasurer : Daniel J. Yantz  (Milwaukee Electronics)
Phone : 503-263-7301
Email : dyantz@milwaukeeelectronics.com

VP of Technical Programs : Charles E. Bauer Ph.D.  (TechLead Corporation)
Phone : 303-674-8202
Email : chuck.bauer@techleadcorp.com

VP of Membership : James L Mills  (Vanguard EMS)
Phone : 503-672-4303
Email : james.mills@vanguard-ems.com

Events Coordinator (Appointed) : Ruth A. Conner  (RAD Services)
Phone : 503-819-4895
Email : radservices24@aol.com

Social Media Development (Appointed) : Michael David Brinkley  (Axiom Electronics LLC)
Phone : 509-240-4615
Email : michael.brinkley@axiomsmt.com

Chapter Advisor (Appointed) : David A. Larson  (TEK Products)
Phone : 541-514-5875
Email : dlarson@tekproducts.com

Newsletter Editor (Appointed) : Ayman Fayed  (Intel Corporation)
Phone : 503-750-7740
Email : ayman.a.fayed@intel.com

CTP Committee (Appointed) : Scott K. Buttars  
Phone : 503-314-5478
Email : scott.k.buttars@gmail.com

Board Liaison : Raiyo Aspandiar (Intel Corporation)
Phone Contact : 503-696-2627
Email Address : raiyo.f.aspandiar@intel.com

Back to Top



Global Participating Members of our Chapter

Micro Systems Engineering, Inc.

NCAB Group



Corporate Members of our Chapter

Ascentec Engineering

Axiom Electronics LLC

CheckSum

ControlTek

Dorigo Systems Ltd.

ECD

Garmin AT, Inc.

Hi-Tek Electronics

Intel Corporation

Micro Systems Engineering, Inc.

Pentagon EMS Corporation

Quality Production Ltd.

Reliable Controls Corporation

Surtek Industries Inc.

Tektronix, Inc.

VersaLogic Corporation



SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG Microsoft Corporation NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

Back to Top
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344

Phone 952.920.7682
Fax 952.926.1819
Home
Site Map
Update Your Info
Related Links
Send Us Feedback
Contact Us
Privacy Policy
↑ Top