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LEAD TINNING REQUIREMENTS FOR THE 21ST CENTURY

Wednesday, February 21, 2018 | 05:00
Location: Axiom Electronics

LEAD TINNING REQUIREMENTS FOR THE 21ST CENTURY  
Presenter: Roger Cox, President, BS Chem, MS ME  

Abstract:
The solderability of components in the process of manufacturing printed circuit assemblies is key to the longevity and reliability of the finished product. Hot solder lead tinning is the most dependable method to mitigate tin whiskers and prevent their growth when changing from a RoHS finish to a tin-lead finish for high-reliability parts; or when changing to a RoHS-compatible finish when a lead-free finish is required; and hot solder lead tinning is also used to remove oxidized or contaminated solder surfaces in the instance of legacy components.  

Molten solder tinning is also used for prevention of gold embrittlement. Successful solder attachment of components to a circuit assembly relies largely on the solderability of surfaces to be joined, establishing the optimum thickness of intermetallics for a strong, yet compliant joint. Achieving this requires complimentary chemistries with the appropriate
temperatures and dwell times. Many factors necessary for a successful, repeatable and reliable process must be understood and controlled, and the end product finally tested to show that the end result meets or exceeds a customer’s requirements.


This presentation will examine the need for a two pot, molten solder lead tinning process, what it achieves, and how it is successfully implemented and proven from a solderability
proof perspective, including results obtained from XRF analysis, wetting balance measurements and ionic cleanliness testing, in conjunction and in compliance with IPC/EIA JSTD-002 and ANSI/GEIA STD-0006 standards.
  

Biography:
Roger Cox, has worked for HP for 23 years, was Director of Engineering and Quality for KeyTronic EMS for 5 years. Now President of CTS (Component Tinning Services). CTS specialty is hot solder dip of components to improve solderability to circuit board assemblies. Roger has BS in Chemistry and a Masters in Mechanical Engineering
 




Questions? Contact:
Pedro Martinez
5038091215
pedro.j.martinez@intel.com





SMTA/IEEE Joint Meeting: HARSH ENVIRONMENT EFFECTS & MANAGEMENT OF COMPLEXITY


Thursday, Feb 1st, 2018 6:00-8:00PM
PCC Willow Creek Center, Room 313

241 SW Edgeway Drive, Beaverton Oregon
Directions: http://www.pcc.edu/about/locations/willow-creek/

Agenda:
6:00pm Refreshments and social
6:30pm Weide-Zaage
7:15pm Hein Presentation
8:00pm End


Abstract – Talk 1
Simulation of Harsh Environment Effects Related to Automotive and Drilling Applications
The technology evolution worsens the stress level of microelectronic applications. On chip level the dimension increase, higher interconnect stacks, the diversity of functions, higher frequencies and power density lead to higher stress and more interaction of effects. At package and assembly level the densification of internal interconnections, the combination of RF, digital, analog and power, new materials like lead free solder, more aggressive processes and 3D packages deliver new challenges for reliability performance. Requirements of harsh environment applications, the use of consumer products in cars or challenging mission profiles for automotive applications trigger new considerations about mission profile specific reliability, higher robustness and robustness validation. Under harsh environment conditions like corrosion, radiation, high temperature and vibration the aging of the components is drastically accelerated. In some cases the tests standards are not anymore sufficient. For example the AEC-Q100 is not matching the demands of the conditions in e-mobility this will be discussed in detail. Furthermore corrosion comes in the focus in drilling, automotive and air vehicles. Nowadays, reliability studies pass through the joint use of experimental evaluation and finite element simulations. Simulation can give a look on special aspects in terms of thermal-electrical-mechanical issues, radiation effects and corrosion sensitivity.

Abstract– Talk 2
Management of Complexity in Research and Development Work
Research and development work always has the challenge to act under complexity. A complex system/ problem is characterized by several traits. Such systems/ problems have a high number of inter-dependent variables. Complex systems are self-dynamical. In complex development processes there are some time periods without any actions, effects and information.
Some parts of a complex system/ problem are non-transparent. In research work it is common to follow different goals which contradict each other. In interactions between some effects and processes, only weak relations exist. Often the complex system is novel for the scientist or engineer. Six fundamental failures in the handling of complex problems or systems have to be considered. The first failure is a wrong goal description. The 
second failure is analyzing a complex system like a linear system. Early fixed focus on wrong topics and disregarding important themes and interactions are the third failure. Fourth failure is to forget to take side effects into account. The fifth failure is the overdrive of a dynamical system and underestimation of time delays. The sixth failure is the tendency to authoritarianism by humans. The presentation will give an introduction about the traits of complex systems, problems, projects and social work interactions on examples of the experience from reliability work in microelectronics. The theoretical base for the special social components of complex problem handling will be explained on the psychological theory for management of complexity. Some conclusions and recommendations for the daily work will be given.

Speakers
Kirsten Weide-Zaage
is Apl. Professor in the field of microelectronics at the Faculty of electrical electrical engineering engineering and Computer Science of the Gottfried Wilhelm Leibniz Universität in Hannover, Germany. She is leader of the group ‘Reliability: Simulation and Risk Analysis’ (RESRI) to the Institute of Microelectronic Systems. Her main research activities are in the field of thermal-electrical-mechanical static and dynamic simulation of microelectronic reliability. She is author/ co-author of more than 100 scientific articles, including journal and conference publications, book chapters, a book, invited papers, keynotes and editor of a book. Kirsten Weide-Zaage is member of the IEEE, SMTA and VDE. Furthermore she is 1st deputy-chair of the VDE-ITG group 8.5.6 (fast) fWLR/ Wafer Level Reliability, Reliability-Simulation & Qualification. 

Verena Hein was born in Potsdam, Germany, in 1964. She received the Diploma in Crystallography from the Karl- Marx University, Leipzig, Germany, in 1988. 2001 she joined Company Melexis Erfurt and was responsible for WLR tests in the Reliability group. Since 2005 she is with XFAB AG in Erfurt and is presently the Technical Coordinator- Interconnect
Reliability in the global Process Characterisation Group. In her second profession she has education as Personal-Coach, HypnoCoach, and therapist for dolphin assisted therapy and non-medical practitioner for Psychotherapy. She finished Bachelor of Psychology at University Hagen in 2014 and is presently Master student. She works as freelancer in her own company 4academy.

 






Oregon Chapter Member Appreciation Dinner


 Date: Wednesday, Jan 17th, 2018
Time: 5:00-7:30PM
Venue: Ernesto’s Italian Restaurant in Capri Room
Address: 8544 SW Apple Way, Portland, OR 97225

 
Buffet Dinner includes:
Caesar Salad
Herb Roasted Chicken, Lasagna, Penne Pasta w/meat Sauce.
Coffee/Iced Tea/Soft Drinks
 
No Host Bar
First 20 members to RSVP will be free, guest will be $31 each.






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Our Chapter Leaders


President : Alexander Schreiner  (Newson USA LLC)
Phone : 503-758-6491

Vice President : Michael David Brinkley  (Axiom Electronics LLC)
Phone : 509-240-4615

Secretary : Ayman Fayed  (Intel Corporation)
Phone : 503-750-7740

Treasurer : Daniel J. Yantz  (Milwaukee Electronics)
Phone : 503-263-7301

VP of Technical Programs : Charles E. Bauer Ph.D.  (TechLead Corporation)
Phone : 303-674-8202

VP of Membership : James L Mills  (Vanguard EMS)
Phone : 503-672-4303

Events Coordinator (Appointed) : Ruth A Conner  (RAD Services)
Phone : 503-819-4895

Social Media Development (Appointed) : Pedro J. Martinez  (Intel Corporation)
Phone : 503-696-1542

Chapter Advisor (Appointed) : David A. Larson  (TEK Products)
Phone : 541-514-5875

CTP Committee (Appointed) : Scott K. Buttars  
Phone : 503-314-5478

Board Liaison : William Capen (DRS Technologies)
Phone Contact : 814-534-8451

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Global Participating Members of our Chapter

Micro Systems Engineering, Inc.

Micro Systems Technologies, Inc.



Corporate Members of our Chapter

Ascentec Engineering

Ascentron, Inc

Axiom Electronics LLC

CheckSum

ControlTek

Dorigo Systems Ltd.

ECD

Garmin AT, Inc.

Hi-Tek Electronics

IBE Electronics USA LLC

Intel Corporation

LPKF Laser & Electronics

Micro Systems Engineering, Inc.

Pentagon EMS Corporation

Quality Production Ltd.

Reliable Controls Corporation

Surtek Industries Inc.

Tektronix, Inc.

VersaLogic Corporation



SMTA Global Members

Amazon Celestica, Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems VEXOS ZESTRON Americas

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Phone 952.920.7682
Fax 952.926.1819