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Chapter News

Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications

Tuesday, October 23, 2018 | 04:30PM
Location: Axiom Electronics

Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications
Date: October 23rd, 2018
Time: 4:30-7:00PM
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006 ]
 
Abstract
The electronics design, packaging, and assembly industries are being challenged to adapt to the needs of all industry sectors from consumer and retail to military/aerospace/defense segments based on the fast changing requirements of the novel enabling technologies.  The result is the revolution of new materials and assembly techniques that require significant investigation.  This research focuses on the development, characterization, and implementation of a novel soldering process that enables the end user to apply localized heating while maintaining the throughput of conventional reflow processes.  This stepwise discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce the aforementioned devices to the market.

 
Denis C. Barbini, Ph.D - Bio
Denis is the General Manager of Crucial Machines, USA.  Denis has traveled the electronics manufacturing world visiting over 30 countries over the past 20 years providing solutions to people and companies designing and manufacturing a vast array of devices.  Denis’ current focus is to provide these companies with the ability to implement cost-effective, reliable and robust processes that deliver the specified functionality and reliability.
 




Questions? Contact:
Pedro Martinez
5036961542
pedro.j.martinez@intel.com





What Does Clean Really Mean and How Can It Be Achieved?

Tuesday, November 13, 2018 | 04:30PM
Location: Axiom Electronics

What Does Clean Really Mean and How Can It Be Achieved?
Date: Nov 13th, 2018
Time: 4:30-7:00PM
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006 ]
 
Abstract
The definition of clean has changed with time and usage application. 
 
The definition of clean varies with the application that it is in reference.  With electronic assemblies, this definition has evolved with component packaging technologies, solder methods, flux chemistries, cleaning solvents, legislative and end use applications.  Early electrical soldering chemicals were based on soldering technologies developed over the centuries for non-electrical products and definition of clean was determined by visual inspection of residue.  As electrical assembly processes and end product applications evolved, so has the definition for clean.  Today, the definition of clean is measured in many different ways depending on what is required by the end use application.  Over the years, producibility, manufacturability, testability, inspectability and reliability methods have been incorporated into product development methods with cleanability provide minimal thought if any at all. 
 
With increased design densities, component packaging technologies, higher electrical performance requirements/restrictions, not addressing cleanliness requirements into the design and the method of cleanliness of the product can have detrimental impacts to customers and/or equipment providers.  This presentation will discuss design for cleaning guideline options to meet a proposed definition for clean of electronic assemblies


Dale Lee - Bio
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
 
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 
 
Dale has authored, instructed and presented globally on topics including advanced SMT packaging, PCB and SMT design, assembly, cleaning, DFM/DFX and rework.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.  He has been very involved with multiple industry associations and activities including SMTA, INEMI and IPC.
 




Questions? Contact:
Pedro Martinez
5036961542
pedro.j.martinez@intel.com





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Chapter Calendar of Events

Date / Time Event Location Contact/Email
October 23, 2018
04:30PM
Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications Axiom Electronics Pedro Martinez 
5036961542
pedro.j.martinez@intel.com
November 13, 2018
04:30PM
What Does Clean Really Mean and How Can It Be Achieved? Axiom Electronics Pedro Martinez 
5036961542
pedro.j.martinez@intel.com


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Our Chapter Leaders


President : Alexander Schreiner  (Newson USA LLC)
Phone : 503-758-6491

Vice President : Michael David Brinkley  (Axiom Electronics LLC)
Phone : 509-240-4615

Secretary : Ayman Fayed  (Intel Corporation)
Phone : 503-750-7740

Treasurer : Daniel J. Yantz  (Milwaukee Electronics)
Phone : 503-263-7301

VP of Technical Programs : Charles E. Bauer Ph.D.  (TechLead Corporation)
Phone : 303-674-8202

VP of Membership : James L Mills  (Vanguard EMS)
Phone : 503-672-4303

Events Coordinator (Appointed) : Ruth A Conner  (RAD Services)
Phone : 503-819-4895

Social Media Development (Appointed) : Pedro J. Martinez  (Intel Corporation)
Phone : 503-696-1542

Chapter Advisor (Appointed) : David A. Larson  (TEK Products, Inc.)
Phone : 503-780-5177

CTP Committee (Appointed) : Scott K. Buttars  
Phone : 503-314-5478

Board Liaison : William Capen (Honeywell FM & T)
Phone Contact : 920-312-1313

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Global Participating Members of our Chapter

Micro Systems Engineering, Inc.



Corporate Members of our Chapter

Ascentec Engineering

Ascentron, Inc

Axiom Electronics LLC

CheckSum

ControlTek

Dorigo Systems Ltd.

ECD

Garmin AT, Inc.

Hi-Tek Electronics

IBE Electronics USA LLC

Intel Corporation

LPKF Laser & Electronics

Micro Systems Engineering, Inc.

Pentagon EMS Corporation

Quality Production Ltd.

Reliable Controls Corporation

Surtek Industries Inc.

Tektronix, Inc.

UltraTape

VersaLogic Corporation



SMTA Global Members

Amazon Celestica, Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC PERFORMANCE CHEMICALS ITW EAE Keysight Technologies KYZEN Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA, Inc. NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819