Massachusetts (Boston)

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SMTA Evening Meeting on Thursday, Dec. 5th, 2019 at Benchmark Electronics Inc. in Nashua NH

Thursday, December 5, 2019 | 4:30 PM
Location: Benchmark Electronics Inc. 100 Innovative Way, Nashua, NH 03062

SMTA Boston Chapter cordially invites you to an evening meeting on Thursday, Dec. 5th, 2019 at Benchmark Electronics Inc. in Nashua, NH.

Date: Thursday, December 5, 2019
Time: 4:30 PM to 8:45 PM
Location: Benchmark Electronics Inc.
100 Innovative Way, Nashua, NH 03062
Cost: SMTA Members $25; Non-Member  $30; walk-ins $30 and $35
Meeting Agenda:

4:30 – 6:00 PM  Registration and Sign in, Socializing, Networking
4:30 – 6:00 PM  Factory Tours
6:00 – 7:00 PM  Presentation - Dinner and Announcements
7:00 – 7:45 PM  EIT Oven Evaluation
7:45 – 8:30 PM  Presentation - Profiling and Reflow Process Control in Production:  Problems and Solutions
8:30 PM  Q&A
8:45  Adjourn
Technical Presentation:  EIT Oven Evaluation
Abstract:  EIT CORPORATION is a contract manufacturer with headquarters in Virginia and 4 manufacturing sites, including one in Salem, NH. The plant in Salem had a new potential customer with a challenging pcb to thermoprofile.. A large mass pcb with a wide variety of temperature sentive components that had to be run with lead free solder. Using their current 8 zone ovens they were unable to accomplish a profile that would adequately reflow the solder joints without overheating the components on the pcb. The decision was made to purchase either a 10 or 12 zone oven and the engineering staff was assigned the task of qualifying the best oven for the application and ensuring that it could accomplish the new job. The engineering staff had no sample product to run the evaluation so that they had to devise a method that would satisfactorily accomplish the experiment. This presentation will show you the unique way that the experiment was designed and the it’s surprising results.
Speaker:   Adam V. Gnek, Senior Process Engineer for EIT Corp.
Bio:  Currently employed as the Principle Process Engineer at EIT Corp. in Salem, NH.  Over 20 years of experience in Electronics PCB production at Columbia Tech,Osram Syslvania, Vicor and Plexus.
1995             Bachelor of Applied Science (Computer Science)                 
                        Brigham Young University, Provo, UT
1991             High School Diploma     (Basic Study)
                        A.A Stagg High School, Stockton, CA
Certified       Lean/Six Sigma Black Belt Certification (LSSBB)
Certified         Aegis software training certificate – NPI Specialist (Circuit Cam & Factory Logix) 

Technical Presentation:  Profiling and Reflow Process Control in Production:  Problems and Solutions
Abstract:  SMT has taken a change in the US somewhat due to off-shoring.   NPI, advanced technology, densely populated and challenging PCBs are common.  Military, medical, aerospace, hi-reliability products remained.  BTCs are expanding (have you seen 01005 BTC’s?).  With this comes the challenges of setting up reflow profiles for an entire assembly, not just the solder paste.  Add to this the requirement for confirmation that all reflowed PCBs are built in accordance to tight process windows for the paste AND the components.  Solutions for reduction of downtime for the initial process of setting up an optimized profile and the elimination of unknown changes, obstacles and human error during the reflow process, are imperative.  This discussion will provide solutions for quick, easy and precise setup and continued process control for the reflow process.  We will also delve into the automation of useful reflow product data collection and smart factory integration.
Speaker:   Marybeth (MB) Allen, Applications & Sales Manager for KIC
Bio:  . MB Allen is a Manager for KIC’s Applications & Sales in the Americas and Europe. Formerly as Product Manager she coordinated the advancement of new products and features to accommodate customer needs as KIC added to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in
the future development, improvement and sales of the company's product offerings.
MB has worked in the electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.

Our 2019 Expo Sponsors:

Questions? Contact:
Mike Jansen

Evening Meeting at Raytheon Company in Andover, MA

Wednesday, November 6, 2019 | 4:00 PM
Location: Raytheon Company, 350 Lowell Street, Andover, MA 01810

SMTA Boston Chapter, IEEE Reliability Chapter, and IMAPs NE cordially invites you to an evening meeting on Wednesday, Nov. 6th, 2019 at Raytheon in Andover, MA.
Secure Location Logistics: Pre-registration is required (remember to use full name include middle name as appear on ID when registering) to attend this event and open to US citizens only, no walk-ins are allowed.  Must have either state issued driver’s license or passport to gain access to facility.  Last factory tour starts at 5:15 PM and must be in the café by this time so arrive early if you plan on attending the factory tour (visitor are required to wear closed toe and heel footwear are required for the tour).  Must arrive at the security gate at Raytheon, Andover by 5:45 PM or will be turned away.

Date: Wednesday, November 6, 2019
Time: 4:00 PM to 9:00 PM
Location: Raytheon Company
350 Lowell Street, Andover, MA 01810
Cost: SMTA/IEEE/IMAPs Members $25; Non-Member  $30

Meeting Agenda:

4:00 – 6:00 PM 
Registration and Sign in, Socializing, Networking
4:15 – 6:00 PM 
Factory Tours: (every 15 min; duration 45 min.)

  1. CCA SMT lines and soldering robots
  2. CAVE
  3. Materials Lab Area
  4. FA Lab, ETL, and Keyence Booth in Cafe
6:00 – 7:00 PM  Dinner and Announcements (SMTA/IEEE/iMAPS)
7:00 – 7:15 PM  Raytheon Welcome by John Powers – Ops Mgr.
7:15 – 7:35 PM  Failure Analysis Capabilities - Recent Case Studies
7:35 – 8:00 PM  Using IPC Standards to Mitigate Counterfeit Risks
8:00 – 8:45 PM  Technical Presentation: QFN Voiding
8:45 PM  Q&A
9:00 PM  Raffle - Adjourn

Our meeting sponsor:

Presentation:  Failure Analysis Capabilities - Recent Case Studies
Speaker:   Prisco Tammaro, at Raytheon
Presentation:  Using IPC Standards to Mitigate Counterfeit Risks  Click here to download this presentation
Speaker:   Cameron Shearon, Principal Materials Engineer at Raytheon
Bio:  Cameron Shearon is a Principal Materials Engineer at Raytheon’s IDS Division, co-chair of IPC 1782, and a SMTA Distinguished Speaker.  Cameron has given invited speeches at many international events.  He earned a BS and MS in Materials Science and Engineering from North Carolina State University.  He obtained a Physics minor for his BS and a Solid State Science minor for his MS.
Cameron initiated and chaired the development of IPC 1782, a global component traceability standard that contains four traceability levels for materials and four independent traceability levels for the process that was completed in record time with the help of many outstanding contributors, IPC Staff support, and his leadership.  As a result of his contribution to this standard, Cameron received a Committee Leadership Award from IPC at IPC APEX EXPO 2017.
Prior to his current role, he has worked as a Process Engineer in a Wafer Fab, Failure Analysis Engineer and Product Safety Engineer in an R&D Environment, a Lead Quality Engineer with AT&T’s Global Supply Chain, and a Reliability Engineer with AT&T Labs.
Technical Presentation:  QFN Voiding
Speaker:   Norman Armendariz, Ph.D. Engineering Fellow at Raytheon
Bio:  Dr. Armendariz is an Engineering Fellow at Raytheon responsible for materials engineering design, materials analysis, process equipment development, and production support associated with the manufacturing of CCA- circuit card assemblies used in missiles, smart munitions, ground based radars, and mobile sensors across multiple US and international sites. Norm has over 20 years of industrial experience, having worked for Lockheed/NASA, Motorola, TI and Intel, and as Director of Labs / Asst. Engr. Prof. at American University. He holds an interdisciplinary PhD in Chemical Engr. from New Mexico State University, MS in Materials Science Engr. from the University of Illinois at Urbana-Champaign, and BS Metallurgical Engr. from Colorado State University, with 9 US patents and 27 peer-reviewed publications. 

Our 2019 Expo Sponsors:

For more information visit:
To register for this event visit: Click Here or copy this address to your browser:
Please use your full name when registering including your middle name in the first name block of the registration form.  Registration dead line is Friday, Nov. 1st, 2019.

Additional Info:   Safety eyewear are required to be worn in specific areas (safety glass will be provided for use while in these areas).

Questions? Contact:
Michael G. Jansen (Raytheon Company)

New England Expo & Tech Forum

Tuesday, October 8, 2019
Location: Boxboro Regency Hotel & Conference Center

New England Tech Expo
Tuesday, October 8, 2019
Location: Boxboro Regency Hotel, Boxboro, MA

Boxboro Regency Hotel and Convention Center, 242 Adams Place, Boxboro, MA 01719

Morning Sessions:
Tech Session:  The Basics of SIR and ECM  (Click here to download)
        Speaker: Meagan Sloan, Indium Corporation
Tech Session:  Reliability of Robotics for Electronic Manufacturing
        Speaker: Bubba Powers, Weller Professional Tools
Tech Session:  Perfecting a Cleaning Process for Hi-Rel Electronics (Click here to download)

        Speaker: Tom Tattersall, MicroCare

Keynote:  Collaborative Robot Use Cases in Electronics Manufacturing 
        Speaker: Eric Cowan, Stanley Black & Decker

Afternoon Sessions:
Tech Session:  Triple Jeopardy - Are you Game?
        Speakers: Chrys Shea, Shea Engineering; Dr. Mark Currie, Henkel Electronic; Dr. Neil Poole, Henkel Electronic

Our 2019 Expo Sponsors:
Lunch Sponsors:

Technical Session, Refreshment, and Tote Bag Sponsors:

Understanding the requirements of IPC-J-STD-001

Tuesday, May 21, 2019 | 5:00 PM
Location: Radisson Hotel Nashua - 11 Tara Boulevard, Nashua, NH 03062

Understanding the requirements of IPC-J-STD 001 Requirements for Soldered Electrical and Electronic Assemblies click here to download slides 
Abstract:  The presentation will cover many elements of the J-STD-001 document which are problematic in the understanding of the criteria. 
For example here are a few of the most misunderstood elements of the document:

  • Understanding the definition of the requirements, especially for the differentiation of the various criteria of acceptable, process indicators, no requirements, and defective conditions.
  • Conflict resolution. As is written it is very difficult to interpret the results of an inspection if the contract states, that the product will be built and inspected to the requirements of J-STD-001. This document is a soldering document.
  • Interpretation of the differences between, conductor and wire diameter as this was a difficult concept to understand my many in the industry.
  • Review the meaning of Objective Evidence and this is a problematic area to substantiate a point and criteria.
  • In the materials section, the need to qualify the materials being used or face rejection of the product as it was not build with qualified materials.
  • The conversion to lead-free solders and other alloys and the due diligence to qualify those materials.
  • Thermal profiles and the need of such.
  • The solder connection.
  • The definition of soldering a wire to a terminal and the new explanation of the visuals.
  • Lead Trimming and the impact of cutting leads after soldering.
  • The physical soldering requirements.
  • The term discernible and what it means.
  • Component with no class 3 requirements
  • Section 8 cleaning section being re-written

 Speaker:  Leo Lambert – Vice President, Technical Director, Consultant – EPTAC Corporation
•    B.S.M.E. Lowell Technological Institute, now University of Massachusetts, Lowell
•    Vice President/Technical Director for EPTAC Corp. Manchester, New Hampshire
        *    Text “Soldering for Electronic Assemblies”, published by Marcel Dekker 1987
        *    Published and presented numerous papers relative to the subject of Soldering and Cleaning at various Technical Seminars and Exhibitions worldwide.
        *    Edited books on soldering for Van Nonstrand Publishers, and Society of Metals,
        *    Former member of the Editorial Review board for Circuit Assembly Magazine 
        *    Develop, published and conducted seminars Deadline to Lead Free Seminars and Thriving in a RoHS/WEEE Environment.
        *    IPC President Award 1989, for work conducted on solderable coatings for printed wiring boards. 
        *    TAEC chair 2008-2010
        *    IPC Hall of Fame 2019
        *    Charter member of the J-STD-001 and 610 committees
        *    Active participant in following IPC committees. 
        *    J-STD-001 and Handbook
        *    IPC-A-610 and 820 Handbook
        *    IPC-A-600
        *    IPC-6012
        *    IPC/WHMA –A-620
        *    Develop and wrote first IPC-A-600 training program
        *    Recipients of many Distinguished Committee Service Awards and Leadership Awards and Special Recognition Awards for the development of training programs
Other Activities:
        *    Charter Member on UNEP (United Nation Environmental Program) Technical Solvent Options Committee, overseeing worldwide activities in reducing CFC from use as cleaning material in Electronic Manufacturing. Part of Montreal Protocol
        *    Member of ICOLP (Industry Cooperative for Ozone Layer Protection)
        *    Past IPC Chairman of many committees relating to soldering and cleaning.
        *    Conducted many soldering seminars worldwide.
        *    Member of Mechanical Engineering advisory board, University of Massachusetts, Lowell MA.
        *    Member of Advisory Board for Greater Lowell Vocational School


“Rework and Assembly Processes for IPC-A-610 & J-STD-001” 
Abstract:  Hand soldering in the electronics industry is increasingly considered a reliability risk in electronics manufacturing.  Control over pc assembly with new software systems in placement, reflow and automated inspections has given engineering better control and traceability, improving yields and reliability.  These improvements have made the difference between automated assembly and hand soldering more apparent.   Some OEM manufactures have eliminated hand soldering by disposal of nonconforming product.  This is not practical when the pc assemblies have a high value.  
In companies with expensive assemblies there is a need to extend the control to the bench assembly.  JBC Tools has developed new software systems that work in conjunction with the soldering equipment for improving controls and providing traceability. IPC J-STD 610 sets standards for soldering that can be used as a basis for setting processes for rework and assembly. This standard can be used in the JBC QST software system; we will explain how this software can be used in the J-STD. The presentation will provide the audience with a demonstration on how the system works and give examples of how it was implemented.

Speaker:   Sean Torrens, US Sales Manager, Business and Engineering in LaSalle School in Barcelona & Manhattan College in New York. Sean has successfully implemented the QST system in class 3 companies all over the US; upgrading their control and traceability process for hand soldering.

Meeting Photos:

Sponsor for this event:

For more information visit:
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

Future Events:
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA


Questions? Contact:
Mike Jansen

Our Chapter Leaders

President : Peter Bigelow  (IMI, Inc.)

Vice President : Michael G. Jansen  (Raytheon Company)

Secretary : Claire Jamieson  (NCAB Group USA, Inc.)

Treasurer : Charles Bickford  (Wall Industries Inc.)

VP of Membership : Neeta Agarwal Ph.D.  (SMTA Boston Chapter)

VP of Technical Programs : Joe Kwong  (Draper Laboratory)

Technical Advisor (Appointed) : Louis Feinstein  (DS Solidworks)

Board Liaison : Tim Jensen (Indium Corporation)

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Global Members of our Chapter


Global Participating Members of our Chapter



Juniper Networks

Juniper Networks

Specialty Coating Systems, Inc.

UTC Aerospace Systems

Corporate Members of our Chapter

AIM Solder

BTU International


Cobar Solder Products

Colonial Electronic Manufacturers Inc.

Corfin Industries LLC

Eltek USA Inc.

Epoxy Technology Inc.

EPTAC Corporation

FKN Systek, Inc.

IMI, Inc.


JJ Technologies


Micron Corporation

Miraco, Incorporated

Mycronic, Inc

Nordson EFD

OSDA Contract Services

PCB Connect Inc.

Photo Etch Technology, Inc.



Seica Inc.


Teradyne, Inc.

Transition Automation, Inc.

VJ Electronix, Inc.

Professional Members of our Chapter


Performance Technologies Group, Inc.

PFC Flexible Circuits

SMTA Global Members

Amazon Celestica, Inc. Collins Aerospace Creation Technologies Inc. Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC Performance Chemicals ITW EAE Juniper Networks Keysight Technologies KYZEN Corporation L3HARRIS Lenovo System Technology Company Limited, Shenzhen, PRC MacDermid Alpha Electronics Solutions Metallic Resources, Inc. Micro Systems Technologies Management AG Nokia Bell Labs Plexus Corp. Samtec Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819