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Chapter News

Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.

Tuesday, December 4, 2018 | 5:00 PM
Location: iRobot Corpoeration in Bedford, MA

Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.
By:  Timothy O’Neil Technical Marketing Manager for AIM Solder
Date: Tuesday, Dec. 4th, 2018
Time: 5:00 PM to 9:00 PM
Location: iRobot Corporation 8 Crosby Drive Bedford, MA 01730
Cost: Members $25 / Non-Members $30
 
Technical Topic:  The choices for solder alloys are expanding rapidly as new application requirements materialize. This presentation will highlight the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. Whether low temperature or high reliability alloys, attendees will gain a better understanding of how implementing these materials can impact process and affect product reliability.
Click here to download presentation
 
 
Speaker Bio:  Timothy O'Neill is the Technical Marketing Manager for AIM Solder.  AIM Solder is a leading global manufacturer of assembly materials for the electronics industry.  Mr. O’Neill who has 25 years of industry experience is a Certified IPC Specialist. 
Mr. O’Neill’s responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.

Agenda:

5:00 PM Registration, Socializing, Networking
5:15 – 6:00 PM iRobot Corporation Museum Tours
6:00 – 7:00 PM Dinner
7:00 – 7:15 PM SMTA Boston Welcome, Announcement, Introduction
7:15 – 8:45 PM Technical Presentation
8:45 – 9:00 PM Questions & Answers
9:00 PM Meeting Adjourn
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598

Vice President : Louis Feinstein  (DS Solidworks)
Phone: 781-810-7261

VP of Technical Programs : Joe Kwong  (Draper Labs)
Phone: 617-258-1746








2018 New England Technical Forum Slides


Attached below are the techincal session slides from our 2018 New England Technical Forum and Expo.

Keynote by Jay Gorajia, Global Services Director, PCB Design and Electronics Manufacturering atMentor Graphics; A Siemens Company
"Smart Manufacturing in the Electronics Industry – An Overview"

Tech Sessions by Charles E. Bauer, Ph.D., TechLead Corporation
"Nanotechnology for Advanced Electronics Packaging"
"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"

Tech Sessions by Denis Barbini, Ph.D., Crucial Machines ( currently not available, check back at a later date)
"Failure Analysis: Case Studies and Implementing Practical Solutions"
"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"

Our 2018 Expo Sponsors:
  
 








Chapter Calendar of Events

Date / Time Event Location Contact/Email
December 4, 2018
5:00 PM
Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials. iRobot Corpoeration in Bedford, MA  


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Our Chapter Leaders


President : Michael G. Jansen  (Raytheon Company)
Phone : 978-470-7598

Vice President : Peter Bigelow  (IMI, Inc.)
Phone : 978-373-9190

Secretary : Claire Jamieson  (NCAB Group USA, Inc.)
Phone : 603-362-1034

Treasurer : Charles Bickford  (Wall Industries Inc.)
Phone : 603-778-2300

VP of Technical Programs : Joe Kwong  (Draper Laboratory)
Phone : 617-258-1746

VP of Membership : Neeta Agarwal Ph.D.  (Benchmark Electronics)
Phone : 603-879-7002

Technical Advisor (Appointed) : Louis Feinstein  (DS Solidworks)
Phone : 781-810-7261

Board Liaison : Tim Jensen (Indium Corporation)
Phone Contact : 315-853-4900

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Global Members of our Chapter

NCAB Group USA, Inc.



Global Participating Members of our Chapter

HISCO, Inc.

ITW EAE

NCAB Group USA, Inc.

NEO Technology Solutions

NEO Technology Solutions (OnCore Manufacturing, LLC)

Specialty Coating Systems, Inc.



Corporate Members of our Chapter

2E Syscom

AIM Solder

Alternative Manufacturing Inc.

BTU International

CIRCUITS ASSEMBLY Magazine

Cobar Solder Products

Colonial Electronic Manufacturers Inc.

Corfin Industries LLC

Eltek USA Inc.

Epoxy Technology Inc.

EPTAC Corporation

FKN Systek, Inc.

GreenSource Fabrication LLC

Hardware Specialty Co., Inc.

IMI, Inc.

Lenze

Lewis & Clark, Inc.

Micron Corporation

Miraco, Incorporated

Mycronic, Inc.

NCAB Group USA, Inc.

Nordson EFD

Optical Control Americas

OSDA Contract Services

Photo Etch Technology, Inc.

Polyonics

Seica Inc.

SelecTech

Teradyne, Inc.

VJ Electronix, Inc.



Professional Members of our Chapter

Advanced Assembly Technologies

EMT Company

PFC Flexible Circuits



SMTA Global Members

Amazon Amazon Lab126 Celestica, Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC Performance Chemicals ITW EAE Keysight Technologies KYZEN Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA, Inc. NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819