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Evening Meeting at Raytheon Company in Andover, MA

Wednesday, November 6, 2019 | 4:00 PM
Location: Raytheon Company, 350 Lowell Street, Andover, MA 01810

SMTA Boston Chapter, IEEE Reliability Chapter, and IMAPs NE cordially invites you to an evening meeting on Wednesday, Nov. 6th, 2019 at Raytheon in Andover, MA.
Pre-registration is required to attend this event and is open only to US citizens due to the secure facility.

Presentation:  Failure Analysis Capabilities - Recent Case Studies
Speaker:   Prisco Tammaro, at Raytheon
Presentation:  Using IPC Standards to Mitigate Counterfeit Risks
Speaker:   Cameron Shearon, Principal Materials Engineer at Raytheon
Bio:  Cameron Shearon is a Principal Materials Engineer at Raytheon’s IDS Division, co-chair of IPC 1782, and a SMTA Distinguished Speaker.  Cameron has given invited speeches at many international events.  He earned a BS and MS in Materials Science and Engineering from North Carolina State University.  He obtained a Physics minor for his BS and a Solid State Science minor for his MS.
Cameron initiated and chaired the development of IPC 1782, a global component traceability standard that contains four traceability levels for materials and four independent traceability levels for the process that was completed in record time with the help of many outstanding contributors, IPC Staff support, and his leadership.  As a result of his contribution to this standard, Cameron received a Committee Leadership Award from IPC at IPC APEX EXPO 2017.
Prior to his current role, he has worked as a Process Engineer in a Wafer Fab, Failure Analysis Engineer and Product Safety Engineer in an R&D Environment, a Lead Quality Engineer with AT&T’s Global Supply Chain, and a Reliability Engineer with AT&T Labs.
Technical Presentation:  QFN Voiding
Speaker:   Norman Armendariz, Ph.D. Engineering Fellow at Raytheon
Bio:  Dr. Armendariz is an Engineering Fellow at Raytheon responsible for materials engineering design, materials analysis, process equipment development, and production support associated with the manufacturing of CCA- circuit card assemblies used in missiles, smart munitions, ground based radars, and mobile sensors across multiple US and international sites. Norm has over 20 years of industrial experience, having worked for Lockheed/NASA, Motorola, TI and Intel, and as Director of Labs / Asst. Engr. Prof. at American University. He holds an interdisciplinary PhD in Chemical Engr. from New Mexico State University, MS in Materials Science Engr. from the University of Illinois at Urbana-Champaign, and BS Metallurgical Engr. from Colorado State University, with 9 US patents and 27 peer-reviewed publications. 
Date: Wednesday, November 6, 2019
Time: 4:00 PM to 9:00 PM
Location: Raytheon Company
350 Lowell Street, Andover, MA 01810
Cost: Members $25; Non-Member  $30 (no walk-ins allowed)
Meeting Agenda:

4:00 – 6:00 PM Registration and Sign in, Socializing, Networking
4:15 – 6:00 PM Factory Tours
6:00 – 7:00 PM Dinner and Announcements
7:00 – 7:15 PM Raytheon Overview and YouTube Video
7:15 – 7:35 PM Failure Analysis Capabilities - Recent Case Studies
7:35 – 8:00 PM Using IPC Standards to Mitigate Counterfeit Risks
8:00 – 8:45 PM Technical Presentation: QFN Voiding
8:45 PM Q&A
9:00 PM Raffle - Adjourn
Our 2019 Expo Sponsors:

Our 2018 Expo Sponsors:

For more information visit:
To register for this event visit: Click Here or copy this address to your browser:
Please use your full name when registering including your middle name in the first name block of the registration form.  Registration dead line is Friday, Nov. 1st, 2019.

Additional Info:   For factory tours - visitors are required to wear closed toe and closed heel footwear.  Safety eyewear are required to be worn in specific areas (safety glass will be provided for use while in these areas).

Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190


Questions? Contact:
Michael G. Jansen (Raytheon Company)

Joint Meeting ESD and Fires and Explosions at BAE Systems in Nashua, NH

Wednesday, October 16, 2019 | 5:30 PM
Location: BAE Systems, 65 Spit Brook Road, Nashua, New Hampshire 03060

SMTA Boston Chapter, ESDA, IEEE Rel Chapter, and iMAPS jointly cordially invites you to an evening meeting on Wednesday, Oct. 16, 2019 at BAE Systems in Nashua, NH.

Abstract:  Many of us understand the hazards of electrostatic discharge to electronics. This talk covers the basics of electrostatic ignition, its sources and methods for prevention. It will also cover the issues of personnel comfort/ dangers around extreme charging situations such as moving webs. Case studies of fires, explosions and personnel injuries will be included. It is intended to present the issues of dangers from ESD. The result of attending this talk should be a safer environment both in the workplace and at home.

Speaker: Stephen L. Fowler of Fowler Associates, Inc.
Bio:   Stephen L. Fowler - President, Fowler Associates, Inc.
With over 50 years of electrical engineering experience, 45 years of radiation engineering experience and 35 years of electrostatic engineering experience.  Mr. Fowler is considered a leading international expert in electrical engineering, radiation processing technology, radiation safety, electrostatic control and packaging.  He attended the University of South Carolina and graduated, cum laude, with a BS in Electrical Engineering.  Mr. Fowler served with the United States Air Force during the Vietnam War in electronic communications.
He has published papers, given speeches, seminars and lectures on radiation engineering, radiation safety, packaging, static control and static test methods. He is used by several television programs (such as Inside Edition and Dateline) as an expert in electrical and radiation engineering.
Mr. Fowler was previously the Electrostatic Plastics Marketing Manager for the Cryovac Division of W.R. Grace and Company.  He was also the Manager of Radiation Engineering for Cryovac.
Mr. Fowler is the holder of several patents. He is or has been a member of the ASTM, EIA, ESD Association, AATCC and the Health Physics Society.  He is Chairman of the AATCC Static Committee (RA-32) and Past Chairman of the Electronic Industries Association's Packaging ESD Committee (PEPS)
Mr. Fowler holds registrations in North Carolina, South Carolina, New Jersey and Oregon to provide radiation consultation and training. He is a NARTE Certified ESD Control
Engineer no. ESD-00010-NE, a Registered Radiation Protection Technologist (NRRPT) and a Registered Radiation Safety Officer (IRRSO)
Steve has been used by media outlets as an expert in electrical, electrostatic and radiation issues:
Dateline: Russian Spy Death from Polonium 210, Gasoline Refueling Fire
Inside Edition:
Gasoline Refueling Fires
Electrocutions in the Streets
Cell Phone Electrocutions in the Bath Tub
E-Cigarette Explosion
Hover Board Fires
Foot Bath Fakes
Night Hawk Minerals Radioactive Rocks Cure for Cancer
Hand Sanitizer Burns in the Hospital
Lights in Children Shoes Fires

Date: Wednesday, Oct. 16, 2019
Time: 5:00 PM to 8:00 PM
Location: BAE Systems
65 Split Brook Road, Nashua, NH 03060
Meeting Agenda:

5:30 PM Registration, Networking, and Refreshments
6:00 PM Opening and Announcements
6:10 – 7:45 PM Technical Presentation
7:45 – 8:00 PM Q&A
8:00 PM Adjourn
Our 2019 Expo Sponsors:

For more information visit:

This event is open to active members only and please have your membership number handy when you register for this event.
(if your membership expires between and the event, please renew your membership before this event or your registeration will be rejected)
To register for this event visit: click here to register for this event or copy this URL to your browser:
Note:  Registration is required and no walk-ins are allowed at this event.  Event is being held in the un-secure area of BAE Systems so any active member can attend this event but registration is required for all visitors.  Seating is limited to 80 seats so each engineering organization are limited to 20 seats each first come first served.
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

Future Events:

Sept. 30 to Oct. 3, 2019  iMAPS – 52nd International Symposium on Microelectronics at the Boston Hynes Convention Center, Boston, MA.

SMTA – Tuesday, Oct. 8, 2019 – New England Expo & Tech Forum at the Boxboro Regency, Boxborough, MA
iMAPS NE – Tuesday Oct. 11, 2019 – at the Boxboro Regency Hotel & Conference Center, Boxborough, MA

New England Expo & Tech Forum

Tuesday, October 8, 2019
Location: Boxboro Regency Hotel & Conference Center

To attend this event click on the link below and look for and select the "Register Now" radio button with the Attendee Arrow to register for this event.

Click Here => New England Expo and Technical Forum Event Page or copy this URL to your web browser:

To exhibit at this event click on the linke above, then scrow down pass the technical session information and select the "Register Now" radio button with the Exhibitor Arrow to register for a booth.

Our 2019 Expo Sponsors:
Lunch Sponsors:

Technical Session, Refreshment, and Tote Bag Sponsors:

Understanding the requirements of IPC-J-STD-001

Tuesday, May 21, 2019 | 5:00 PM
Location: Radisson Hotel Nashua - 11 Tara Boulevard, Nashua, NH 03062

Understanding the requirements of IPC-J-STD 001 Requirements for Soldered Electrical and Electronic Assemblies click here to download slides 
Abstract:  The presentation will cover many elements of the J-STD-001 document which are problematic in the understanding of the criteria. 
For example here are a few of the most misunderstood elements of the document:

  • Understanding the definition of the requirements, especially for the differentiation of the various criteria of acceptable, process indicators, no requirements, and defective conditions.
  • Conflict resolution. As is written it is very difficult to interpret the results of an inspection if the contract states, that the product will be built and inspected to the requirements of J-STD-001. This document is a soldering document.
  • Interpretation of the differences between, conductor and wire diameter as this was a difficult concept to understand my many in the industry.
  • Review the meaning of Objective Evidence and this is a problematic area to substantiate a point and criteria.
  • In the materials section, the need to qualify the materials being used or face rejection of the product as it was not build with qualified materials.
  • The conversion to lead-free solders and other alloys and the due diligence to qualify those materials.
  • Thermal profiles and the need of such.
  • The solder connection.
  • The definition of soldering a wire to a terminal and the new explanation of the visuals.
  • Lead Trimming and the impact of cutting leads after soldering.
  • The physical soldering requirements.
  • The term discernible and what it means.
  • Component with no class 3 requirements
  • Section 8 cleaning section being re-written

 Speaker:  Leo Lambert – Vice President, Technical Director, Consultant – EPTAC Corporation
•    B.S.M.E. Lowell Technological Institute, now University of Massachusetts, Lowell
•    Vice President/Technical Director for EPTAC Corp. Manchester, New Hampshire
        *    Text “Soldering for Electronic Assemblies”, published by Marcel Dekker 1987
        *    Published and presented numerous papers relative to the subject of Soldering and Cleaning at various Technical Seminars and Exhibitions worldwide.
        *    Edited books on soldering for Van Nonstrand Publishers, and Society of Metals,
        *    Former member of the Editorial Review board for Circuit Assembly Magazine 
        *    Develop, published and conducted seminars Deadline to Lead Free Seminars and Thriving in a RoHS/WEEE Environment.
        *    IPC President Award 1989, for work conducted on solderable coatings for printed wiring boards. 
        *    TAEC chair 2008-2010
        *    IPC Hall of Fame 2019
        *    Charter member of the J-STD-001 and 610 committees
        *    Active participant in following IPC committees. 
        *    J-STD-001 and Handbook
        *    IPC-A-610 and 820 Handbook
        *    IPC-A-600
        *    IPC-6012
        *    IPC/WHMA –A-620
        *    Develop and wrote first IPC-A-600 training program
        *    Recipients of many Distinguished Committee Service Awards and Leadership Awards and Special Recognition Awards for the development of training programs
Other Activities:
        *    Charter Member on UNEP (United Nation Environmental Program) Technical Solvent Options Committee, overseeing worldwide activities in reducing CFC from use as cleaning material in Electronic Manufacturing. Part of Montreal Protocol
        *    Member of ICOLP (Industry Cooperative for Ozone Layer Protection)
        *    Past IPC Chairman of many committees relating to soldering and cleaning.
        *    Conducted many soldering seminars worldwide.
        *    Member of Mechanical Engineering advisory board, University of Massachusetts, Lowell MA.
        *    Member of Advisory Board for Greater Lowell Vocational School


“Rework and Assembly Processes for IPC-A-610 & J-STD-001” 
Abstract:  Hand soldering in the electronics industry is increasingly considered a reliability risk in electronics manufacturing.  Control over pc assembly with new software systems in placement, reflow and automated inspections has given engineering better control and traceability, improving yields and reliability.  These improvements have made the difference between automated assembly and hand soldering more apparent.   Some OEM manufactures have eliminated hand soldering by disposal of nonconforming product.  This is not practical when the pc assemblies have a high value.  
In companies with expensive assemblies there is a need to extend the control to the bench assembly.  JBC Tools has developed new software systems that work in conjunction with the soldering equipment for improving controls and providing traceability. IPC J-STD 610 sets standards for soldering that can be used as a basis for setting processes for rework and assembly. This standard can be used in the JBC QST software system; we will explain how this software can be used in the J-STD. The presentation will provide the audience with a demonstration on how the system works and give examples of how it was implemented.

Speaker:   Sean Torrens, US Sales Manager, Business and Engineering in LaSalle School in Barcelona & Manhattan College in New York. Sean has successfully implemented the QST system in class 3 companies all over the US; upgrading their control and traceability process for hand soldering.

Meeting Photos:

Sponsor for this event:

Our 2018 Expo Sponsors:

For more information visit:
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

Future Events:
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA


Questions? Contact:
Mike Jansen

Selecting High Tech Adhesives

Tuesday, April 16, 2019 | 5:00 PM
Location: Honle UV America, Inc. 261 Cedar Hill Street, Bldg C, Marlboro, MA 01752

SMTA Boston Chapter evening meeting on Tuesday, April 16, 2019 at Honle UV America, Inc. in Marlboro, MA.

What You Need To Consider Before Selecting High Tech Adhesives
Abstract:  Choosing the best adhesive for a specific application can be complex. There are many variables to be considered and numerous types of chemistries, all with different capabilities. An understanding of the most important parameters will help to narrow the choices.  The discussion will cover some of the more important issues and chemistries needed for choosing the best adhesive.  These parameters are applicable to macro and micro applications for all industries.

Speaker:   Barry Siroka – Business Development Manager – EpoxySet Inc.

Bio:  Barry Siroka started in the chemical industry as a urethane production chemist and moved into technical service of specialty materials in 1980.  Over the course of his 40+ year career, he has worked for several polymer manufacturers and distributors in various technical service/sales/marketing roles.  He has been responsible for training in the use of adhesives to sales personnel, distributors and engineers in most high tech industries. His emphasis is in customer service and solving material problems.  Barry has continued his marketing/sales/customer relationship efforts as the Business Development Manager since joining EpoxySet in 2015.


"UV vs. LED "

Abstract:  For many years UV Technology has been a reliable method for the curing of photo reactive chemicals and adhesives.  In response to increasing production speeds and new applications, lamp technology has also developed.  With increased innovative ideas comes the need for more options in the curing devices.  Thus, within recent years, a completely new branch of UV technology has developed:  UV LED’s.  The discussions will include the main differences between UV and LED and how the solutions can impact your ideas and applications.  Examples of UV and LED equipment will also be available to view and ask questions.

Speaker:   Deivis Parejo - Sales Engineer - Honle UV America.

Deivis Parejo: Worked as a sales engineer for manufactures since graduation from High School
Bachelor’s Degree in Mechanical Engineering from UMASS
Associate Degree in Engineering Design from MASS Bay
Married with 4 children
Graduated in 2010 and sales engineer role since.

Event Photos: 

Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

Future Events:
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA

Questions? Contact:
Mike Jansen

Photo Etch Technology Meeting

Tuesday, March 19, 2019 | 5:00 PM
Location: Photo Etch Technology, 71 Willie Street, Lowell, MA 01854

SMTA Boston Chapter cordially invites you to an evening meeting on Tuesday, March 19, 2019 at Photo Etch Technology in Lowell, MA.
The evolution of solder paste stencil coatings
Abstract:  The evolution of solder paste stencil coatings will be discussed in depth.  Presentation to include types, applications, longevity and performance.
Topics:  1) Stencil Design; 2) Nano Coatings; 3) Evolution of Stencils; 4) 
Where the industry is headed 

Speaker:  Arthur Guidi Founder of Photo Etch Technology (PET) and Chairman of the Board of PET.
Bio:  Arthur Guidi brings over 50 years of collective experience to tonight's event. Art Guidi Early Days can be rooted to a starting Draftsman at the Raytheon Corporation,(shortly after leaving the USMC), further leading him to the advanced industry of Electronic Manufacturing. With a solid education in Electronic MFG, Art's  Career soon took him to Heading up the Manufacturing floors of several Electronics groups through the New England area, This Savvy Engineering Mind soon saw the Landscape of Electronics growing and changing in the early 1970's, many believe this period to be the Renaissance of manufacturing in New England.  Arts Career would eventually lead him to become engineering manager for Digital Equipment Corporation based then in Maynard Massachusetts. In the Early 80's Art Decided To start His own Manufacturing company. Taking the business from a garage think tank to a thriving player in the EMS Industry, with 5 USA locations.

Photos taken at this meeting:

Our 2018 Expo Sponsors:


Questions? Contact:
Michael (Mike) Jansen

Printing and Cleaning

Tuesday, February 19, 2019 | 05:00
Location: ITW EAE (Electrohic Assembly Equipment; 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748

SMTA Boston Chapter and iMAPS New England cordially invites you to an evening meeting on Tuesday, Feb. 19, 2019 at ITW EAE in Hopkinton, MA.
“Conquering Your Latest Challenge in Miniaturization”

Printing experts Edward Nauss and Michael Butler will present the key elements of repeatable solder paste deposition needed to successfully meet the miniaturization trend:  (Click here to download this presentation)

  • High quality stencils with nanocoatings
  • Board support and snugging
  • Proper alignment between PCB and stencil
  • Underwiping solvents and textiles
  • High quality solder paste
  • The importance of separation parameters on paste release
Attendees will see:

  • Live demonstrations of printing on the SMTA Miniaturization Test Vehicle
  • Automated Solder Paste Inspection
  • Visual inspection under a digital microscope
  • Videos of solder paste release from the stencil
Michael will describe the process development path and the statistical methods he used to define a robust 008004/0201M printing process.
Chrys Shea, of Shea Engineering Services will be available to answer questions about the new SMTA test board, the DOES embedded in it for smaller components, and update the commercial launch schedule of the board through Practical Components. 

“Don’t Panic: What YOUR ROSE Number Really Means

The review and revision to J-STD-001 on ionic cleanliness has a new protocol.  The new standard changes how we qualify the cleanliness of our assemblies.

Cleaning expert Debbie Carboni will present:  (Click here to download this presentation)

·         An overview of the new protocol

·         What the changes mean for assemblers

·         The impact on process qualification and process control

·         Generating “Objective Evidence” for level 1 and level 2 qualification


All attendees will see:

·         New test coupons for qualifying, optimizing and monitoring cleanliness

·         Passed and Failed test coupons

An open Question and Answer session will enable attendees to discuss their specific process needs and changes to gain compliance with the new standard.

Our 2018 Expo Sponsors:

Questions? Contact:
Mike Jansen
Michael Jansen

2018 New England Technical Forum Slides

Attached below are the techincal session slides from our 2018 New England Technical Forum and Expo.

Keynote by Jay Gorajia, Global Services Director, PCB Design and Electronics Manufacturering atMentor Graphics; A Siemens Company
"Smart Manufacturing in the Electronics Industry – An Overview"

Tech Sessions by Charles E. Bauer, Ph.D., TechLead Corporation
"Nanotechnology for Advanced Electronics Packaging"
"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"

Tech Sessions by Denis Barbini, Ph.D., Crucial Machines ( currently not available, check back at a later date)
"Failure Analysis: Case Studies and Implementing Practical Solutions"
"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"

Our 2018 Expo Sponsors:

Chapter Calendar of Events

Date / Time Event Location Contact/Email
October 8, 2019
New England Expo & Tech Forum Boxboro Regency Hotel & Conference Center  
October 16, 2019
5:30 PM
Joint Meeting ESD and Fires and Explosions at BAE Systems in Nashua, NH BAE Systems, 65 Spit Brook Road, Nashua, New Hampshire 03060  
November 6, 2019
4:00 PM
Evening Meeting at Raytheon Company in Andover, MA Raytheon Company, 350 Lowell Street, Andover, MA 01810 Michael G. Jansen (Raytheon Company) 

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Our Chapter Leaders

President : Michael G. Jansen  (Raytheon Company)

Vice President : Peter Bigelow  (IMI, Inc.)

Secretary : Claire Jamieson  (NCAB Group USA, Inc.)

Treasurer : Charles Bickford  (Wall Industries Inc.)

VP of Technical Programs : Joe Kwong  (Draper Laboratory)

VP of Membership : Neeta Agarwal Ph.D.  

Board Liaison : Tim Jensen (Indium Corporation)

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Global Members of our Chapter


Global Participating Members of our Chapter


NEO Technology Solutions

NEO Technology Solutions (OnCore Manufacturing, LLC)

Specialty Coating Systems, Inc.

UTC Aerospace Systems

Corporate Members of our Chapter

AIM Solder

BTU International


Cobar Solder Products

Colonial Electronic Manufacturers Inc.

Corfin Industries LLC

Eltek USA Inc.

Epoxy Technology Inc.

EPTAC Corporation

FKN Systek, Inc.

IMI, Inc.



Micron Corporation

Midstate Electronics

Miraco, Incorporated

Mycronic, Inc

Nordson EFD

OSDA Contract Services

Photo Etch Technology, Inc.



Seica Inc.


Teradyne, Inc.

Transition Automation, Inc.

VJ Electronix, Inc.

Professional Members of our Chapter

EMT Company


Performance Technologies Group, Inc.

PFC Flexible Circuits

SMTA Global Members

Amazon Celestica, Inc. Collins Aerospace Creation Technologies Inc. Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC Performance Chemicals ITW EAE Keysight Technologies KYZEN Corporation L3HARRIS Lenovo System Technology Company Limited, Shenzhen, PRC Metallic Resources, Inc. Micro Systems Technologies Management AG NEO Technology Solutions Nokia Bell Labs Plexus Corp. Samtec Microelectronics Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819