Massachusetts (Boston)

Boston, MA 

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Chapter News

Printing and Cleaning

Tuesday, February 19, 2019 | 05:00
Location: ITW EAE (Electrohic Assembly Equipment; 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748

SMTA Boston Chapter and iMAPS New England cordially invites you to an evening meeting on Tuesday, Feb. 19, 2019 at ITW EAE in Hopkinton, MA.
“Conquering Your Latest Challenge in Miniaturization”

Printing experts Edward Nauss and Michael Butler will present the key elements of repeatable solder paste deposition needed to successfully meet the miniaturization trend:

  • High quality stencils with nanocoatings
  • Board support and snugging
  • Proper alignment between PCB and stencil
  • Underwiping solvents and textiles
  • High quality solder paste
  • The importance of separation parameters on paste release
Attendees will see:

  • Live demonstrations of printing on the SMTA Miniaturization Test Vehicle
  • Automated Solder Paste Inspection
  • Visual inspection under a digital microscope
  • Videos of solder paste release from the stencil
Michael will describe the process development path and the statistical methods he used to define a robust 008004/0201M printing process.
Chrys Shea, of Shea Engineering Services will be available to answer questions about the new SMTA test board, the DOES embedded in it for smaller components, and update the commercial launch schedule of the board through Practical Components. 
 

“Don’t Panic: What YOUR ROSE Number Really Means

The review and revision to J-STD-001 on ionic cleanliness has a new protocol.  The new standard changes how we qualify the cleanliness of our assemblies.

Cleaning expert Debbie Carboni will present:

·         An overview of the new protocol

·         What the changes mean for assemblers

·         The impact on process qualification and process control

·         Generating “Objective Evidence” for level 1 and level 2 qualification

 

All attendees will see:

·         New test coupons for qualifying, optimizing and monitoring cleanliness

·         Passed and Failed test coupons

An open Question and Answer session will enable attendees to discuss their specific process needs and changes to gain compliance with the new standard.
 

Date: Tuesday, Feb. 19, 2019
Time: 5:00 PM to 9:00 PM
Location: 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748
Cost: SMTA/iMAPS/IEEE Members $25 ($30 after Thursday, Feb. 14, 2019)
Non-Member  $30 ($35 after Thursday, Feb. 14, 2019)
Retired-Unemployed Member $20 ($25 after Thursday, Feb. 14, 2019)
Student Member $10 ($15 after Thursday, Feb. 14, 2019)
 
Meeting Agenda:

5:00 PM Registration, Socializing, Networking
5:00 – 6:00 PM Dinner, Socializing, Networking
5:45 – 6:00 PM Announcements, Future Events, and Printing Intro.
6:00 – 6:45 PM Printing Presentation (Featured 0201 Chip Size)
6:45 – 6:50 PM IPC J-STD-001 Intro.
6:50 – 7:35 PM IPC J-STD-001, Revision G, Amendment 1
7:35 – 7:45 PM Q&A
7:45 -8:30 PM
8:30 PM
Printing Demo & Tour
Adjourn

Our 2018 Expo Sponsors:
  
Contact Info:
President : Peter Bigelow (IMI Inc.)
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

VP of Technical Programs : Joe Kwong  (Draper)
Phone: 617-258-1746


Future Events:
iMAPS NE - March 12, 2019 - "Extending Copper Plating Technology to New Sturcutures in Advanced Packaging" at the Boxboroguh Regency Hotel & Conference Center, Boxborough, MA - for more info visit: http://events.r20.constantcontact.com/register/event?oeidk=a07eg3jrnszf9fc4f73&llr=dntnvbkab
SMTA - Tuesday March 19, 2019 - Photo Etch Technology, Lowell, MA

iMAPS NE - May 7, 2019 – 46th Symposium & Expo
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo




Questions? Contact:
Mike Jansen
978-470-7598
Michael Jansen





Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.

Tuesday, December 4, 2018 | 5:00 PM
Location: iRobot Corpoeration in Bedford, MA

Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.
By:  Timothy O’Neil Technical Marketing Manager for AIM Solder
Date: Tuesday, Dec. 4th, 2018
Time: 5:00 PM to 9:00 PM
Location: iRobot Corporation 8 Crosby Drive Bedford, MA 01730
Cost: Members $25 / Non-Members $30
 
Technical Topic:  The choices for solder alloys are expanding rapidly as new application requirements materialize. This presentation will highlight the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. Whether low temperature or high reliability alloys, attendees will gain a better understanding of how implementing these materials can impact process and affect product reliability.
Click here to download presentation
 
 
Speaker Bio:  Timothy O'Neill is the Technical Marketing Manager for AIM Solder.  AIM Solder is a leading global manufacturer of assembly materials for the electronics industry.  Mr. O’Neill who has 25 years of industry experience is a Certified IPC Specialist. 
Mr. O’Neill’s responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.

Agenda:

5:00 PM Registration, Socializing, Networking
5:15 – 6:00 PM iRobot Corporation Museum Tours
6:00 – 7:00 PM Dinner
7:00 – 7:15 PM SMTA Boston Welcome, Announcement, Introduction
7:15 – 8:45 PM Technical Presentation
8:45 – 9:00 PM Questions & Answers
9:00 PM Meeting Adjourn
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598

Vice President : Louis Feinstein  (DS Solidworks)
Phone: 781-810-7261

VP of Technical Programs : Joe Kwong  (Draper Labs)
Phone: 617-258-1746






2018 New England Technical Forum Slides


Attached below are the techincal session slides from our 2018 New England Technical Forum and Expo.

Keynote by Jay Gorajia, Global Services Director, PCB Design and Electronics Manufacturering atMentor Graphics; A Siemens Company
"Smart Manufacturing in the Electronics Industry – An Overview"

Tech Sessions by Charles E. Bauer, Ph.D., TechLead Corporation
"Nanotechnology for Advanced Electronics Packaging"
"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"

Tech Sessions by Denis Barbini, Ph.D., Crucial Machines ( currently not available, check back at a later date)
"Failure Analysis: Case Studies and Implementing Practical Solutions"
"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"

Our 2018 Expo Sponsors:
  
 








Chapter Calendar of Events

Date / Time Event Location Contact/Email
February 19, 2019
05:00
Printing and Cleaning ITW EAE (Electrohic Assembly Equipment; 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748 Mike Jansen 
978-470-7598
Michael Jansen


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Our Chapter Leaders


President : Michael G. Jansen  (Raytheon Company)
Phone : 978-470-7598

Vice President : Peter Bigelow  (IMI, Inc.)
Phone : 978-373-9190

Secretary : Claire Jamieson  (NCAB Group USA, Inc.)
Phone : 603-362-1034

Treasurer : Charles Bickford  (Wall Industries Inc.)
Phone : 603-778-2300

VP of Technical Programs : Joe Kwong  (Draper Laboratory)
Phone : 617-258-1746

VP of Membership : Neeta Agarwal Ph.D.  (Benchmark Electronics)
Phone : 603-879-7002

Technical Advisor (Appointed) : Louis Feinstein  (DS Solidworks)
Phone : 781-810-7261

Board Liaison : Tim Jensen (Indium Corporation)
Phone Contact : 315-853-4900

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Global Members of our Chapter

ITW EAE

NCAB Group USA, Inc.



Global Participating Members of our Chapter

HISCO, Inc.

ITW EAE

NCAB Group USA, Inc.

NEO Technology Solutions

NEO Technology Solutions (OnCore Manufacturing, LLC)

Specialty Coating Systems, Inc.



Corporate Members of our Chapter

AIM Solder

Alternative Manufacturing Inc.

BTU International

CIRCUITS ASSEMBLY Magazine

Cobar Solder Products

Colonial Electronic Manufacturers Inc.

Corfin Industries LLC

Eltek USA Inc.

Epoxy Technology Inc.

EPTAC Corporation

FKN Systek, Inc.

GreenSource Fabrication LLC

Hardware Specialty Co., Inc.

IMI, Inc.

ITW EAE

Lenze

Micron Corporation

Miraco, Incorporated

Mycronic, Inc.

NCAB Group USA, Inc.

Nordson EFD

Optical Control Americas

OSDA Contract Services

Photo Etch Technology, Inc.

Polyonics

Seica Inc.

SelecTech

Teradyne, Inc.

VJ Electronix, Inc.



Professional Members of our Chapter

Advanced Assembly Technologies

EMT Company

Performance Technologies Group, Inc.

PFC Flexible Circuits



SMTA Global Members

Amazon Amazon Lab126 Celestica, Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC Performance Chemicals ITW EAE Keysight Technologies KYZEN Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA, Inc. NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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Phone 952.920.7682
Fax 952.926.1819