Massachusetts (Boston)Boston, MA
Expos | Job Resources | Educational Grant | Students Only
Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.Tuesday, December 4, 2018 | 5:00 PM
Location: iRobot Corpoeration in Bedford, MA
Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.
By: Timothy O’Neil Technical Marketing Manager for AIM Solder
|Date:||Tuesday, Dec. 4th, 2018|
|Time:||5:00 PM to 9:00 PM|
|Location:||iRobot Corporation 8 Crosby Drive Bedford, MA 01730|
|Cost:||Members $25 / Non-Members $30|
Technical Topic: The choices for solder alloys are expanding rapidly as new application requirements materialize. This presentation will highlight the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. Whether low temperature or high reliability alloys, attendees will gain a better understanding of how implementing these materials can impact process and affect product reliability.
Click here to download presentation
Mr. O’Neill’s responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.
|5:00 PM||Registration, Socializing, Networking|
|5:15 – 6:00 PM||iRobot Corporation Museum Tours|
|6:00 – 7:00 PM||Dinner|
|7:00 – 7:15 PM||SMTA Boston Welcome, Announcement, Introduction|
|7:15 – 8:45 PM||Technical Presentation|
|8:45 – 9:00 PM||Questions & Answers|
|9:00 PM||Meeting Adjourn|
President : Michael G. Jansen (Raytheon Company)
Vice President : Louis Feinstein (DS Solidworks)
VP of Technical Programs : Joe Kwong (Draper Labs)
2018 New England Technical Forum Slides
Attached below are the techincal session slides from our 2018 New England Technical Forum and Expo.
Keynote by Jay Gorajia, Global Services Director, PCB Design and Electronics Manufacturering atMentor Graphics; A Siemens Company
"Smart Manufacturing in the Electronics Industry – An Overview"
Tech Sessions by Charles E. Bauer, Ph.D., TechLead Corporation
"Nanotechnology for Advanced Electronics Packaging"
"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"
Tech Sessions by Denis Barbini, Ph.D., Crucial Machines ( currently not available, check back at a later date)
"Failure Analysis: Case Studies and Implementing Practical Solutions"
"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"
Our 2018 Expo Sponsors:
|Date / Time||Event||Location||Contact/Email|
December 4, 2018
|Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.||iRobot Corpoeration in Bedford, MA||
Michael G. Jansen (Raytheon Company)
Phone : 978-470-7598
Vice President :
Peter Bigelow (IMI, Inc.)
Phone : 978-373-9190
Claire Jamieson (NCAB Group USA, Inc.)
Phone : 603-362-1034
Charles Bickford (Wall Industries Inc.)
Phone : 603-778-2300
VP of Technical Programs :
Joe Kwong (Draper Laboratory)
Phone : 617-258-1746
VP of Membership :
Neeta Agarwal Ph.D. (Benchmark Electronics)
Phone : 603-879-7002
Technical Advisor (Appointed) :
Louis Feinstein (DS Solidworks)
Phone : 781-810-7261
Board Liaison :
Tim Jensen (Indium Corporation)
Phone Contact : 315-853-4900
NCAB Group USA, Inc.
NEO Technology Solutions (OnCore Manufacturing, LLC)
Advanced Assembly Technologies