Puget Sound

Seattle, WA 

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Chapter Meeting - Experiencing Mixed Reality Using the Microsoft HoloLens

The SMTA Puget Sound Chapter cordially invites you to attend:

Experiencing Mixed Reality Using the Microsoft HoloLens

Dr. Sridhar Canumalla 
February 13th, 2018
11am – 1pm
Fluke Hall, Room 119A, University of Washington
4000 Mason Rd
Seattle, WA 98195
(206) 543-0340
Free to all attendees and lunch is provided!
REGISTER TODAY AT https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4362

  • 11:00am - Check in and Networking
  • 11:30am - Lunch Begins
  • 11:45am - Chapter Announcements
  • 12:00pm - Feature Presentation
  • 1:00pm – Adjourn
Contact SMTA Puget Sound at smtapugetsound@gmail.com with questions.

Experiencing Mixed Reality Using the Microsoft HoloLens

Microsoft’s HoloLens is an untethered holographic computer that creates high-definition, 3D holograms using advanced nano-optics. These holograms become part of the real world through an array of sensors, which continuously sample the user’s environment. HoloLens combines all the processing and components in a form factor that enables interaction with the real and the virtual worlds - in a natural way. The ability to project 3D images into a user’s field of view has many exciting applications in the industrial space with the ability to provide real-time information or images fixed in-space to a real-world object.

  • Challenges in development of this technology
  • Practical Applications
Manufacturing engineers, process engineers, design engineers, quality engineers, managers, suppliers
ABOUT Dr. Sridhar Canumalla
Dr. Sridhar Canumalla is a Director Thermal-Mechanical Engineering in the Hololens team and leads a team responsible for the thermal mechanical architecture and design. He was also responsible for various aspects of thermal, structural and acoustic engineering for Kinect, Xbox and accessories over the past ten years including reliability engineering and failure analysis.
Prior to joining Microsoft, he worked at Texas Instruments in flip chip and wire bond package development projects for consumer electronics applications.  He worked at Nokia R&D developing several mobile phone products. Sridhar has also worked on advancing quantitative acoustic microscopy techniques while at Sonoscan Inc. He received his Ph.D. in Engineering Science and Mechanics from The Pennsylvania State University for his work on the fatigue and fracture behavior of metal matrix composites.
Sridhar has over 40 publications in journals and conferences in the areas of reliability, robust design, solders, acoustic microscopy, acoustic emission, materials characterization, fatigue and fracture, and processing of composite materials. He holds several patents on laser thermal management and is the co-author of 3 book chapters and a reference book on Portable Electronics. He has volunteered in the IEEE CPMT Society in the Applied Reliability Committee in various roles, and closer to home, he volunteers as park ranger at Mt. Rainier National Park.

Q1 Newsletter

End of Summer BBQ

WE REGRET THAT THIS EVENT HAS BEEN CANCELED.  Please watch this space for info on our next event.  

End of Summer BBQ

Member Appreciation



Sat Sep 9th 2017

10am – 3pm

Thornton A Sullivan Park

Park Camp Patterson Picnic Shelter

11405 W Silver Lake Rd

Everett, WA 98208



Chapter Meeting & Presentation

 The SMTA Puget Sound Chapter cordially invites you to attend:


Chapter Meeting/Presentation:

Cleanliness and Components

Lessons Learned & Lessons Lost

 Dock Brown


Tue Oct 3rd 2017, 3pm


700 SW 39th St

Renton, WA 98057

Tel: 425 301 6153




Problems associated with cleanliness are not a new phenomenon; the presenter’s first personal experience was a qualification test failure that occurred 40 years ago. The recent rise in the use of no-clean fluxes and solder pastes accompanied by some sadly persistent myths associated with their chemistry and reflow processing, have created unexpected field failures.

Manufacturers of high reliability and harsh environment products have used COTS (commercial off the shelf) electronic components for many years. Recent changes in the nature of the COTS supply chain can catch manufacturers off guard and result in unpleasant surprises. These changes call for a more in depth and nuanced understanding of the factors driving the design, marketing, production, and distribution of these components.

Join us for an informative afternoon presentation on these topics.  There will be interesting case studies and time for questions.




Learn how to reduce field failures by focusing on cleanliness.



Design & process engineers



Dock Brown has extensive experience in DFX practices which he acquired through his work history at Physio-Control, Medtronic and now at DfR Solutions. At DfR Solutions he guides clients throughout the product lifecycle from requirements development to design to production. 




Contact Christoph Wimmer at cwimmer@microscan.com with questions.

Newsletter 3Q 2017


Nanofab short course- registration open!

Dr. Michael Khbais, Associate Director, Washington Nanofabrication Facility (WNF), National Nanofabrication Coordinated Infrastructure (NNCI), University of Washington and one of the "founding fathers" of the SMTA Puget Sound Chapter is offering  this specialized course to the public. More information and registration  can be found at http://nanofab2017.ee.washington.edu/

Expo 2017

Newsletter 2Q2017

Puget Sound Expo 2017

If you would like to attend the expo, Click here to RSVP!

SMTA Certification

 SMT Processes- August 15-17, 2017 (Portland, OR)

                Now available in Oregon!


·        August 15- Course (8:30-5pm)

·        August 16- ½ day of course + exam

·        August 17- All day exam (8:30-5pm)

Instruction: English 
Test: English 
Instructor: Jim Hall, ITM Consulting

               For more information, http://www.smta.org/certification/

1Q2017 Newsletter

4Q 2016 Newsletter

SMTA International award!

Congratulations to everyone in the chapter!

COTY stats 2016

Congratulations! We've made significant progress!

3Q 2016 Newsletter

Summer Social

CTP 2016 Pix


2Q 2016 Newsletter

2016 SMTA Puget Sound (Bellevue) Symposium & Supplier Day

Thursday, May 12 

Show hours10 AM until 4 PM

At The Red Lion Hotel in Bellevue

11211 Main St.

Bellevue, Washington

(425) 455-5240

Technical Program begins at 1:30-3:00 PM

Topic: Cleaning & Conformal Coatings; Exploring Complexities, Compatibilities & Consequences!

With representatives from all facets of surface mount assembly including materials, equipment, processing, assembly, applications and failure analysis this panel enlightens both users and suppliers on the challenges and solutions to cost effective reliability and performance for high end electronic products. As in the past, we anticipate extensive interaction between the panel and audience to elucidate the subtleties of the results from various experiences ranging from no clean to both water soluble and solvent cleaned assemblies and their performance both electrically and from a reliability perspective. Join us for a scintillating discussion!!

Panel Featuring:

1. Eric Camden, Foresite (failure analysis)

2. Jigar Patel, Zestron (cleaning)

3. Tony Lentz, FCT Assembly (cleaning & conformal coating compatibility)

4. Paul Handler, REHM (conformal coating equipment/processes)

5. Dock Brown, DfR Solutions (broad based user experiences)

6. Hans Bok, SCS (conformal coating materials)

We have over 30 local suppliers exhibiting, a great discussion panel, door prizes, and an opportunity to meet some old friends and add a few new ones to your network!

Register to Attend!
We hope to see you there!

Visit These Suppliers at the show
A.C.E. Tech
Alpha Recycle Division
Amitron Corporation
Apex Tool Group
Assembly Solutions
Cascade Engineering Services
Conductive Containers
EPTAC Corporation
FCT Assembly
Foresite, Inc
Harmon Company NW
Hi-Rel Labs
JBC Tools
JH Tecchnologies
Kirby & Demarest
Marc Technologies
NCAB Group
Nikon Metrology
NW Test Solutions
Panasonic Factory Solutions
Pentagon Technology
Seica Inc.
Seika Machinery
Specialty Coatings
Speed Print
Technica, USA
Test Equity
Trans-Tec America
University of Washington Nanofab
VI Technology
Zero Defects

1Q 2016 Newsletter


The Feb 16th meeting will be held at:

12590 Willows Rd NE
Kirkland, WA 98034


Spokane Meeting Was A Success!

Courtyard by Marriott Downtown - Spokane, WA
Friday, March 4th, 10:00 am - 3:00 pm
In an attempt to re-generate enthusiasm for SMTA Inland Northwest Chapter, three other SMTA Chapters in the region collaborated to bring you an outstanding technical meeting. If you missed the meeting, you can still view the presentations below by clicking on the title:
Dock Brown, DfR Solutions, Puget Sound Chapter VP of Technical Programs
In the 2000s, red phosphorous flame retardants were at the root of widespread and costly failures in electronics products. The most prominent of these failures were in plastic encapsulated microcircuits. These failures were widely reported and painfully experienced. As a result, users of electronic components and finished products came to expect that technical diligence, marketplace forces, and the threat of lawsuits were sufficient to prevent a recurrence.

It is therefore surprising that in what appears to be only a few short years after IDMs and OSATs discontinued using red phosphorus flame retardants in semiconductor manufacturing, manufacturers of other types of components began using them. Two or three years after line cord and connector manufacturers went into production with red phosphorus flame retardants, they too started to get field returns.

Pat Ryan, Indium Corporation, Inter-Mountain Chapter VP of Technical Programs
One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs. This solder voiding, especially on thermal pads, can lead to hot spots and a reduction in the life of the component and the overall assembly.  Without careful design considerations, it is also difficult to obtain precision in the level of voiding from one component to another. This paper looks at the cause and effect of voiding and a new approach using readily available solder preforms. It has been determined that this approach can both decrease the level of voiding found in the solder joints beneath bottom terminated components and also decrease the amount of variation in this value. While this paper focuses on this technique when used with SAC305, it is versatile enough to be used with other alloys commonly available in paste and solder fortification preform forms. This method also has the added benefit of being fully compatible with current manufacturing processes, adding only extra placement steps without the need to change reflow profile, equipment, etc. This easy and inexpensive modification to current processes can have a big impact on the reliability of the final product.

David Nixon, Key Tronic Corporation, SMTA Active Member
Production shops of all sizes are met with the challenge to be in front of production capacity with the technological capability to meet the designer’s whim at a moment’s notice.  Whether you run a single surface mount line from the next room, or oversee 100 lines around the world, a good equipment plan will help ensure that you won’t be caught behind the production eight ball. In this session we will look at:
  • Past capacity and how we projected future growth with component sales market data.
  • Determining operational equipment efficiencies for line load capacities.
  • Driving factors for equipment technical capabilities with component trends.
  • Identifying equipment at end of life, and some thoughts on choosing a long term equipment supplier.
Are you tired of being behind in production capacity only to be told to “Show Justification” for future equipment purchases?  Do you then struggle with trying to predict the increase in production before that increase is needed? In today’s vast production world, what makes better sense; placement speed or number of lines? During this session we will explore the creation of a manufacturing equipment plan. 

Chuck Bauer, TechLead Corporation, Oregon Chapter VP of Technical Programs
While often exaggerated and over-promised, nanotechnology continues to provide vital performance enhancements to electronic systems after over a decade of development. Advanced conductive adhesives and thermal interface materials pioneered nanotech adoption by electronics manufacturers. Hype gives way to breakthrough as new nanotech solutions address multiple aspect of packaging, interconnect, and assembly. Leading research areas include coatings, adhesives, die attach, solder replacements, via structures, 3D printing, and novel conductors. This survey and analysis examines a broad range of revolutionary as well as disruptive nano-based technologies for electronics manufacturing, identifying practical applications, characterizing the challenges and opportunities, and peering into the future commercial exploitation of these exciting solutions. The authors detail multiple examples of practical and cost effective applications demonstrating that nanotechnology today represents reality instead of hype.

Puget Sound EXPO 2015

Thank you to all of the speakers and suppliers for making this show a success!  We look forward to seeing you all next year.

SMTA Puget Sound Expo 2015 SMTA Puget Sound Expo 2015 SMTA Puget Sound Expo 2015


Chapter Calendar of Events

Date / Time Event Location Contact/Email
February 13, 2018
Chapter Meeting - Experiencing Mixed Reality Using the Microsoft HoloLens Fluke Hall, Room 119A, University of Washington SMTA Puget Sound 
(425) 882-3100
May 3, 2018
Puget Sound Expo & Tech Forum Hilton Seattle Airport & Conference Center Kaitlyn Schmiel 

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Our Chapter Officers

President : Christina Paz  (Crane Aerospace & Electronics)
Phone : 425-882-3100 x.14276

Vice President : Christoph Wimmer  (Microscan)
Phone : 425-301-6153

Secretary : Dock Brown CRE  (DfR Solutions)
Phone : 206-892-8597

Treasurer : Jerome Larez  (Prototron)
Phone : 425.499.2631

VP of Membership (Appointed) : Allison Budvarson  (Out of the Box Manufacturing)
Phone : 253-214-7448

Board Liaison : William Capen (DRS Technologies)
Phone Contact : 814-534-8451

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Global Participating Members of our Chapter


Corporate Members of our Chapter

Hentec Industries Inc.

Nordson SELECT

Out of the Box Manufacturing

Prototron Circuits

Professional Members of our Chapter

Schippers and Crew

SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819