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Chapter News
Location: Fuji America Corporation, 171 Corporate Woods Parkway, Vernon Hills, IL 60061
In this presentation, the work done by the HDPUG consortium on a standardized test procedure for simulating and observing head in pillow formation and defects will be covered.
About the Speaker:
Gene Dunn is a Sr. Staff Process Engineer at Plexus and is Regional Subject Matter Expert for SMT Equipment and Process. His main responsibilities include equipment and material selection, process development and yield improvement. Previous Gene worked at Panasonic and AT&T in various SMT and Microelectronic engineering and management roles. He holds a BS in Engineering from Univ. of Illinois- Urbana & an MBA from Northwestern.
The need to non-destructively inspect electronic components and assemblies is the main driver behind the development and advancements of the X-ray inspection technology for the electronics industry. In many cases, X-ray inspection is the only available technique for non-destructive inspection of optically hidden solder joints like BGA, QFN, Through Hole components. In this talk we will discuss the latest developments in the 2D and 3D X-ray technology for detecting Head-In-Pillow and other common SMT defects. Real life examples and cases will be discussed in detail.
About the Speaker:
Evstatin Krastev, Ph.D.
Director of Applications
Nordson Dage
Dr. Krastev is Director of Applications at Nordson Dage responsible for the X-Ray and Bondtester lines. He holds a Master degree in Electrical Engineering and Ph.D. in Physics from Michigan State University. He has also valuable experience working as a software engineer and hardware design engineer.
During the last 25 years Dr. Krastev has been actively involved in the fields of testing and inspection for the microelectronics and NDT industries. During the last 14 years at Nordson Dage, Evstatin was instrumental building a strong global applications team supporting customers and sales.
Evstatin has published numerous articles in leading magazines discussing advanced topics in the spheres of bond testing, 2D and 3D X-ray inspection. He is a well-known expert in the industry and is working closely with key customers and consortia developing new standards and testing techniques.
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.
Questions? Contact:
Gerri Noble
847-639-2440
gnoble@ntech-inc.com
Location: Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089
By Dr. Mark Currie – Henkel Corporation
Authors and acknowledgements to:
Dr. Neil Poole/Doug Dixon (Henkel Electronic Materials, Irvine, CA, USA)
Chrys Shea (Shea Engineering Services)
Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3 mm pitch array packages to remain competitive. The process of acquiring these capabilities can be complex, as they involve numerous interactive factors. To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment. It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit. It discusses:
• Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
• Sample size consideration for statistical significance
• DFM of the PCB to manage costs
• Design for solder paste inspection (SPI)
• Nesting of tests to evaluate 22 paste properties in 4 hours or less
• Stencil design considerations
• Full database for programming entire SMT line
• PCB support design, development and testing
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers. It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51） (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT). Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing. Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP). What is the overall effect of surface finish on solder paste performance? Which solder paste is best for each surface finish? It is the goal of this paper to answer these questions.
In the initial work, several different surface finishes were tested in the surface mount process including: HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver. Several different types of solder pastes were tested along with each surface finish including: lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes. Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding. The results of this testing were quantified and summarized. Recommendations pairing the optimal solder paste with each surface finish were given.
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters. Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver). Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste. Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile. Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured. Reflow performance was measured and quantified including wetting, solder balling, and graping data. Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads.
All of the test results, including data from the first study, are summarized, compared and contrasted. Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters. Recommendations are made for optimal combinations of surface finish and solder paste.
About the Speakers:
Dr. Mark Currie – Henkel Corporation
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts. Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter. As such, Mark has been familiar with solder for 28years. In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
Shantanu Joshi - Koki Solder America Inc.
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
Tony Lentz – FCT Assembly
Tony Lentz has worked in the electronics industry since 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events. Tony is a speaker of distinction with SMTA. Tony holds B.S. and M.B.S. degrees in Chemistry.
Questions? Contact:
Gerri Noble
(847) 639-2440
gnoble@ntech-inc.com
SMTA Great Lakes – Fuji America Corporation Tour & Head-In-Pillow Presentation
Thursday, November 21, 2019 | 2:30 pmLocation: Fuji America Corporation, 171 Corporate Woods Parkway, Vernon Hills, IL 60061
SMTA Great Lakes Chapter Meeting
Thursday, November 21st, 2019
Thursday, November 21st, 2019
| Location: | Fuji America Corporation |
| 171 Corporate Woods Parkway | |
| Vernon Hills, IL 60061 |
| Time: | |
| 2:30-3:00 pm | Registration/Networking |
| 3:00-3:30 pm | Fuji America Corporation Tour/Demo |
| 3:30-4:00 pm | Presentation: “Test Method for Head in Pillow” – Gene Dunn |
| 4:00-4:30 pm | Presentation: “Recent Advances in the 2d and 3d X-ray technology for detection of Head-In-Pillow and other common SMT defects” – Evstatin Krastev, Ph.D. |
| 4:30-4:45 pm | Adjournment |
| Cost: | |
| Members | $30.00 |
| Non-Members | $35.00 |
| **Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process) |
“SMTA Great Lakes – Fuji America Corporation Tour & Head-In-Pillow Presentations”
“Test Method for Head In Pillow”
By Gene Dunn – Plexus Corporation
“Test Method for Head In Pillow”
By Gene Dunn – Plexus Corporation
In this presentation, the work done by the HDPUG consortium on a standardized test procedure for simulating and observing head in pillow formation and defects will be covered.
About the Speaker:
Gene Dunn is a Sr. Staff Process Engineer at Plexus and is Regional Subject Matter Expert for SMT Equipment and Process. His main responsibilities include equipment and material selection, process development and yield improvement. Previous Gene worked at Panasonic and AT&T in various SMT and Microelectronic engineering and management roles. He holds a BS in Engineering from Univ. of Illinois- Urbana & an MBA from Northwestern.
“Recent Advances in the 2D and 3D X-ray technology for detection of Head-In-Pillow and other common SMT defects”
By Evstatin Krastev, Ph.D. – Nordson Dodge
By Evstatin Krastev, Ph.D. – Nordson Dodge
The need to non-destructively inspect electronic components and assemblies is the main driver behind the development and advancements of the X-ray inspection technology for the electronics industry. In many cases, X-ray inspection is the only available technique for non-destructive inspection of optically hidden solder joints like BGA, QFN, Through Hole components. In this talk we will discuss the latest developments in the 2D and 3D X-ray technology for detecting Head-In-Pillow and other common SMT defects. Real life examples and cases will be discussed in detail.
About the Speaker:
Evstatin Krastev, Ph.D.
Director of Applications
Nordson Dage
Dr. Krastev is Director of Applications at Nordson Dage responsible for the X-Ray and Bondtester lines. He holds a Master degree in Electrical Engineering and Ph.D. in Physics from Michigan State University. He has also valuable experience working as a software engineer and hardware design engineer.
During the last 25 years Dr. Krastev has been actively involved in the fields of testing and inspection for the microelectronics and NDT industries. During the last 14 years at Nordson Dage, Evstatin was instrumental building a strong global applications team supporting customers and sales.
Evstatin has published numerous articles in leading magazines discussing advanced topics in the spheres of bond testing, 2D and 3D X-ray inspection. He is a well-known expert in the industry and is working closely with key customers and consortia developing new standards and testing techniques.
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.
Questions? Contact:
Gerri Noble
847-639-2440
gnoble@ntech-inc.com
SMTA Great Lakes Solder Paste Roundtable Event
Tuesday, October 29, 2019 | 5:00 pmLocation: Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089
SMTA Great Lakes Chapter Meeting
Tuesday, October 29th, 2019
Tuesday, October 29th, 2019
| Location: | Plexus |
| 2400 Millbrook Drive | |
| Buffalo Grove, IL 60089 |
| Time: | |
| 5:00-5:30 pm | Registration/Networking |
| 5:30-6:00 pm | Dinner |
| 6:00-7:30 pm | Presentations |
| 7:30-8:00 pm | Adjournment |
| Cost: | |
| Members | $30.00 |
| Non-Members | $35.00 |
| **Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process) |
“SMTA Great Lakes Solder Paste Roundtable Event”
“Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Technology”
By Dr. Mark Currie – Henkel Corporation
Authors and acknowledgements to:
Dr. Neil Poole/Doug Dixon (Henkel Electronic Materials, Irvine, CA, USA)
Chrys Shea (Shea Engineering Services)
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment. It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit. It discusses:
• Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
• Sample size consideration for statistical significance
• DFM of the PCB to manage costs
• Design for solder paste inspection (SPI)
• Nesting of tests to evaluate 22 paste properties in 4 hours or less
• Stencil design considerations
• Full database for programming entire SMT line
• PCB support design, development and testing
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers. It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
“Lead-free Solder Paste Development for Ultra Fine-Pitch Printing and Reflow of 03015 and 0201 Metric Chip Components”
By Shantanu Joshi - Koki Solder America Inc.
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51） (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
“The Effects of Surface Finish on Solder Paste Performance”
By Tony Lentz – FCT Assembly
By Tony Lentz – FCT Assembly
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT). Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing. Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP). What is the overall effect of surface finish on solder paste performance? Which solder paste is best for each surface finish? It is the goal of this paper to answer these questions.
In the initial work, several different surface finishes were tested in the surface mount process including: HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver. Several different types of solder pastes were tested along with each surface finish including: lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes. Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding. The results of this testing were quantified and summarized. Recommendations pairing the optimal solder paste with each surface finish were given.
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters. Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver). Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste. Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile. Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured. Reflow performance was measured and quantified including wetting, solder balling, and graping data. Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads.
All of the test results, including data from the first study, are summarized, compared and contrasted. Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters. Recommendations are made for optimal combinations of surface finish and solder paste.
About the Speakers:
Dr. Mark Currie – Henkel Corporation
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts. Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter. As such, Mark has been familiar with solder for 28years. In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
Shantanu Joshi - Koki Solder America Inc.
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
Tony Lentz – FCT Assembly
Tony Lentz has worked in the electronics industry since 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events. Tony is a speaker of distinction with SMTA. Tony holds B.S. and M.B.S. degrees in Chemistry.
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.
Payment Instructions:
You can pay with Cash/Check (onsite) or Credit Card (via PayPal - see PayPal button)
Questions? Contact:
Gerri Noble
(847) 639-2440
gnoble@ntech-inc.com
Our Chapter Leaders
President :
Ursula Marquez de Tino Ph.D. (Plexus Corp.)
Vice President :
Paige Dusek (FCT Assembly, Inc.)
Secretary :
Dave Munsterman (Accelerated Assemblies)
Treasurer :
Gerri Noble (J.D. Noble & Associates, Inc.)
Webmaster (Appointed) :
Tim Noble 18033 (J.D. Noble & Associates, Inc.)
VP of Membership (Appointed) :
Pratish Patel (Electronic Interconnect)
Board Liaison :
Robert Kinyanjui (Deere & Company)
Corporate Members of our Chapter
ACL STATICIDE
American Standard Circuits, Inc.
Eastek International Corporation
International Control Services, Inc.
Purex Inc.
Rauland-Borg Corporation
Watchfire Signs
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