Atlanta

Atlanta, GA

Chapter News

Updated Status of Upcoming Events

Given the response and direction of government agencies and global health authorities, SMTA is directing all in-person meetings originally scheduled through Mid-May to be postponed or transformed into an online format.

The health and safety of our participants and members is top priority at SMTA. We remain in regular contact with our venue managers, chapter teams, and professionals within the greater meeting planning industry.
This situation will effect our 2020 Scholarship plans as well. Or 2020 Expo has been moved to April 22, 2021 where we will also plan on presenting Scholarships.

For the most updated information about SMTA events, check our website or contact your local chapter.

Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling

Thursday, June 18, 2020 | 4:00PM
Location: Webinar

Overview

Reliability of the new solder alloys has been a serious concern, especially in the harsh environment. Aging at elevated temperature alters the structural and mechanical properties of the solder joint and leads to the coarsening of the precipitates in the bulk solder and growth of the intermetallic compound layer, which in turn deteriorates the solder joint. Various new elements such as bismuth, antimony, and nickel are micro-alloyed into the SnAgCu based alloys to slow down this deterioration process and improve the reliability. There haven’t been many studies about the effect of solder sphere alloys with bismuth pastes on the harsh thermal reliability. In this paper, the effect of mixing solder sphere alloys (SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied. Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to +125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres.

About the Presenter:

Francy Akkara is pursuing his doctoral degree in Industrial and Systems Engineering at Auburn University. He has been working on electronics reliability for the past four years with focus on component reliability in thermal cycling. Francy has Masters degree in Electrical Engineering (Microelectronics) from Auburn University and is currently interning at Western Digital as RAMP SSD Assembly Development Engineer. His research interests include reliability test design, effect of solder alloy composition and surface finishes, failure analysis, thermal cycling/mechanical shock reliability and defects in SMT assembly.

Free Registration

Payment Instructions:
Free

Questions? Contact:
Douglas Philbrick
7705974829
dphilbrick@worldeb.com

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Chapter Calendar of Events

Date / Time	Event	Location	Contact/Email
June 18, 2020 4:00PM	Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling	Webinar	Douglas Philbrick 7705974829 dphilbrick@worldeb.com