Capital (DC)Washington, DC
Expos | Job Resources | Educational Grant | Students Only
SMTA Capital Expo to Feature Essemtec Fox Pick and Place SystemAugust 16, 2017 - The SMTA Capital Chapter is pleased to announce that it will feature a live demo of the Essemtec Fox pick-and-place system at the upcoming expo on Thursday, August 24th.
Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum
Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo on August 24th
Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th
SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 24th
During this year’s expo, the Capital Chapter will host technical presentations by ITM Consulting, Summit Interconnect, and GVD Corporation. Specific topics include “The “Deadly Sins” of SMT Assembly,” “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly,” and “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics.”
Registration opens at 8:00 AM and includes a complimentary lunch on the show floor. Exhibits are open from 9:00 AM until 3:00 PM and the first technical presentation will start at 9:30 AM.
Please join us for this great networking and free educational event. To register online to attend or exhibit, please visit http://www.smta.org/expos/#capital.
Second Meeting of 2017 - April 25 at ZESTRON Americas
Presentations at the second meeting of the year for the SMTA Capital Chapter held at ZESTRON Americas included:
Dr. Gil Sharon, DfR Solutions, presented “Effective Use of Reliability Simulation in an Agile Development Process”.
The use of simulation to predict reliability early in development is increasing as more electronic equipment manufacturers migrate to an Agile Methodology. However, most companies struggle to incorporate simulation and modeling successfully into new product introduction. This presentation will outline industry best practices in regards to the timing and workflow for the integration of reliability simulation and modeling. The audience will be introduced to process flows appropriate for component selection, pre-layout and post-layout activities. The type and timing of data transfer will be discussed and how it can be adjusted for different corporate structures. Case studies relevant to Solid State Drives (rigorous requirements for temp cycle, shock and vibration), Internet of Things (small form factor, state-of-the-art wireless, uncontrolled environments), and rapid implementation of Advanced Packaging (small pitch, large die, 3D) into Automotive and Military applications will be presented. There is a specific focus on the value of iteration and tradeoff studies generated by an integrated reliability simulation.
Naveen Ravindran, ZESTRON Americas, presented “High-Reliable Cleaning Process Optimization & Customer Requirements”.
Product quality is vital to manufacturing products that meet the customer’s reliability standards. However, when new customer requirements cannot be met, line deficiencies must be identified and corrected. Mr. Ravindran will provide details on how a properly designed experiment unveiled the solutions to a customer’s cleaning challenges and identified a way to increase product quality while decreasing operating costs.
To request a copy of the presentations, contact Jessica Kreis, VP of Communications at firstname.lastname@example.org.
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|Date / Time||Event||Location||Phone||Contact/Email|
February 23, 2017
|SMTA Capital Chapter to Host First Meeting of the Year||The Test Connection||(410) 205-7300||
April 25, 2017
|MTA Capital Chapter to Host Second Meeting of the Year||ZESTRON Americas||703-393-9880||
August 24, 2017
||Vendor-Expo - Capital 2017||Johns Hopkins University/Applied Physics Lab||
Brian A. Costanzo (DRS Signal Solutions)
Phone : 301-944-8535
Email : firstname.lastname@example.org
Vice President :
Karen Walters Ebner (Raytheon Systems Company)
Phone : 443-558-5332
Email : email@example.com
Bert Horner (The Test Connection, Inc.)
Phone : 410-205-7300
Email : firstname.lastname@example.org
Fernando Rueda (KYZEN Corporation)
Phone : 615-983-4603
Email : email@example.com
VP of Technical Programs :
John Vaughan (Zentech Manufacturing, Inc.)
Phone : 443-348-4500
Email : firstname.lastname@example.org
VP of Membership :
Phone : 410-730-3385
Email : email@example.com
Acting VP of Communications :
Larry Park (ZESTRON Americas)
Phone : 703-393-9880
Email : Lawrence.Park@zestronusa.com
Board Liaison :
Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880
Email Address : firstname.lastname@example.org
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