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Chapter News

SMTA Capital Chapter Tutorial - Supporting High Reliability at the OEM: A PCB Perspective

Thursday, March 28, 2019 | 9:00 am
Location: Country Inn & Suites

Instructors: Yaad Eliya and Jim Barry, PCB Techologies

March 28, 2019

9:00 a.m. - 3:00 p.m.
Country Inn & Suites
1717 West Nursery Road
Linthicum Heights, MD 21090
(443) 577-1036
 
Price:
  • Members: $200
  • Non-Members: $400
  • Capital Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80

Think Big...Think Small...Think Beyond!!!  Everything you want to know about PCB Manufacturing to help you design and assemble a better circuit card assembly!!!


Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Topics Covered:

  • Solderability Issues from the PCB Fabrication Perspective
    - Speaker:  Yaad Eliya
    - Synopsis:
       *  The speaker will discuss the PCB Manufacturing process and how it has a direct effect on the solderability process
        *  Items such as plating technicque ((DC plating vs. Reverse plating), Final finished and other processes that effect the assembly
     
  • Design for Reliability
    - Speaker:  Yaad Eliya
    - Synopsis:
        *  The speaker will discuss how design aspects can directly affect the reliability of the raw card at the assembly level
        *  Items such as Non-functional pads, via-fill, cross hatched grounds, conductor routing, PTH preparations, etc. -- and their effects on reliability
     
  • RF/Microwave Design Considerations and Options
    - Speaker:  Yaad Eliya
    - Synopsis:
        *  The speaker will discuss the Do's and Don'ts for RF & Microwave success
        *  Items such as materials, lamination cycles, Single vs. double cavities and "Air Cavity" for varying frequencies will be discussed
     
  • Thermal Mitigation Options at the Raw Card Level
    - Speaker:  Jim Barry
    - Synopsis:
        *  The speaker will discuss the options available for Thermal mitigations at the raw card level
        *  As designs get smaller and faster, high temperature is becoming a big issue - we will look at Materials, Heatsinks and Coins to help mitigate heat


About the Instructors:
Instructor Bios and Photos coming soon...

 

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

SMTA Capital Chapter    Circuits Assembly

 



Questions? Contact:
Brian Costanzo
240-404-8423





Download Presentations from Capital Chapter Meetings


Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Fred Dimock BTU International

Additive Manufacturing Corporate Development
KEYNOTE SPEAKER: Geoffrey Doyle, Jabil Circuits, Inc.

Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker: MB Allen, KIC

Avoiding the Pitfalls of Voiding in PCB Assemblies
Speaker: Kim Flanagan, Indium Corporation
 


 






Download the latest Chapter Newsletter


January 2016 Newsletter

August 2012 Newsletter

September 2010 Newsletter

May 2010 Newsletter

The SMTA Capital Chapter is looking for sponsors to advertise in our newsletter.  Advertising revenues will help the Capital Chapter to bring the best experts to our meetings and workshops.  Please, contact Fernando Rueda (fernando_rueda@kyzen.com) for details.








Chapter Calendar of Events

Date / Time Event Location Contact/Email
March 28, 2019
9:00 am
SMTA Capital Chapter Tutorial - Supporting High Reliability at the OEM: A PCB Perspective Country Inn & Suites Brian Costanzo 
240-404-8423
August 22, 2019
Capital Expo & Tech Forum Johns Hopkins University/Applied Physics Lab Hannah Terhark
(952) 920-7682 


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Our Chapter Leaders


President : Bert Horner  (The Test Connection, Inc.)
Phone : 410-205-7300

Vice President : Brian A. Costanzo  (DRS Signal Solutions)
Phone : 301-944-8535

Secretary/Treasurer : Fernando Rueda  (KYZEN Corporation)
Phone : 615-983-4603

VP of Technical Programs : Karen Walters Ebner  (Raytheon Systems Company)
Phone : 508-490-1639

Events Chair (Appointed) : Katie Higgs  (NTS)
Phone : 410-229-4371

VP of Communications (Appointed) : Jessica Molloy  (ZESTRON Americas)
Phone : 703-393-9880

Board Liaison : Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880

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Global Members of our Chapter

ZESTRON Americas



Global Participating Members of our Chapter

Harris Corporation

KYZEN Corporation

ZESTRON Americas



Corporate Members of our Chapter

Annapolis Micro Systems, Inc.

CEMSI

Cornet Technology

Department of Defense

Leidos

NTS-Baltimore

Powertrain Control Solutions

Practical Technologies, Inc.

Simplimatic Automation

The Test Connection, Inc.

Zentech Manufacturing, Inc.

ZESTRON Americas



SMTA Global Members

Amazon Amazon Lab126 Celestica, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC Performance Chemicals ITW EAE Keysight Technologies KYZEN Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA, Inc. NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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SMTA Headquarters
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Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819