Capital (DC)Washington, DC
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2019 Chapter Events
Dear Chapter Members
Don't miss these upcoming SMTA Capital Chapter Meetings. This is DC's largest gathering of tech-minded folks. Get in on the ground floor to launch your career, learn new technologies, collaborate with like-minds and network with the best.
SMTA Capital Chapter Meeting - Nondestructive BGA/Area Array component rework BGA live demonstration at PACETuesday, February 19, 2019 | 5:30 pm
Location: PACE - Elkridge Engineering & Training Center
This is a Surface Mount Technology Event for Government Specification Industry Organizations, Engineers, Sales, Production Control, Marketing, and Manufacturing.
Its our pleasure to invite you to our Surface Mount Technology Event on February 19th 2019 at PACE. You will get to see a live demonstration as well as an excellent presentation. There will also be great food! Do not miss this event. Do not hesitate to get in touch with us should you have any questions. We hope to see you there.
SMTA Capital Chapter Team!!!
Non-Destructive BGA/Area Array Component Rework
Abstract: In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages, and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
Aaron Caplan Biography: Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
Download Presentations from Capital Chapter Presentations
KEYNOTE SPEAKER: Geoffrey Doyle, Jabil Circuits, Inc.
Speaker: MB Allen, KIC
Speaker: Kim Flanagan, Indium Corporation
SMTA Capital Chapter Tutorial -Tuesday, March 19, 2019 | 9:00 am
Location: BWI Airport - More to come
Think Big...Think Small,,,Think Beyond!!! Everything you want to know about PCB Manufacturing to help you design and assemble a better circuit card assembly!!!
- Enhanced Flex Materials
- Cavity Applications
- Improved PCB Processing tools
- Stacked Via process and reliability
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January 2016 Newsletter
August 2012 Newsletter
September 2010 Newsletter
May 2010 Newsletter
The SMTA Capital Chapter is looking for sponsors to advertise in our newsletter. Advertising revenues will help the Capital Chapter to bring the best experts to our meetings and workshops. Please, contact Fernando Rueda (firstname.lastname@example.org) for details.
|Date / Time||Event||Location||Contact/Email|
January 10, 2019
|Fred Dimock, BTU International, to Present at SMTA Capital Chapter Meeting on January 10th||Zestron||
February 19, 2019
|SMTA Capital Chapter Meeting - Nondestructive BGA/Area Array component rework BGA live demonstration at PACE||PACE - Elkridge Engineering & Training Center||
March 19, 2019
|SMTA Capital Chapter Tutorial -||BWI Airport - More to come||
August 22, 2019
||Capital Expo & Tech Forum||Johns Hopkins University/Applied Physics Lab||
Bert Horner (The Test Connection, Inc.)
Phone : 410-205-7300
Vice President :
Brian A. Costanzo (DRS Signal Solutions)
Phone : 301-944-8535
Fernando Rueda (KYZEN Corporation)
Phone : 615-983-4603
VP of Technical Programs :
Karen Walters Ebner (Raytheon Systems Company)
Phone : 508-490-1639
Events Chair (Appointed) :
Katie Higgs (NTS)
Phone : 410-229-4371
VP of Communications (Appointed) :
Jessica Molloy (ZESTRON Americas)
Phone : 703-393-9880
Board Liaison :
Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880
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