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SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Tuesday, June 11, 2019 | 9 AM
Location: Country Inn & Suites 1717 W Nursery Rd. Linthicum Heights, MD 21090

SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective
 
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
 
Do not miss this full day educational event with presentations by Yaad Eliya and Jim Barry of PCB Technologies. This is your chance to gain knowledge for improvements in reliability, yield and therefore overall product cost. Come learn about PCB advancements from engaging speakers with years of experience and global industry knowledge.
 
This tutorial is a great value, at half the cost of one at SMTA International and it’s offered right in your backyard! Lunch, coffee breaks, course handouts and a certificate of completion are all included and topics include:
 
RF/Microwave Design Considerations and Options
Innovative solutions, based on close cooperation between mil/aero designers and the fabricator. Explore implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design, including for rigid-flex.
 
Thermal Mitigations Options at the Raw Card Level
The most extreme temperatures and stress facing the PCBA is often the reflow cycle. However, the “post-reflow” or operating temperatures facing the product in the field can be detrimental and even disastrous. Learn how smaller, more complex designs are creating thermal mismatches and intense temperature. Explore options in design, materials, and “adder options” such as heatsinks and coins to
mitigate temperature.
 
Reliability: Design for Reliability & Design for Manufacturability
A focus on two parts of the PCB process: the design and how it affects product performance, and what happens once the design reaches the PCB manufacturer. Review nonfunctional pads, via fill, stacked vs. staggered, cross-hatched grounds in rigid-flex, conductor routing, and more. Also, how manufacturer processes affect solderability, looking at DC plating vs. reverse pulse, multiple finishes, edge
plating, and hole placement.
 
Cost and Registration information HERE!
*Registration deadline is June 1st
 
Location:
Country Inn & Suites
1717 W Nursery Rd.
Linthicum Heights, MD 21090
 

Payment Instructions:
Please follow link for payment.

Questions? Contact:
Brain Costanzo
240-404-8423





SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM


The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
 
Do not miss this full day educational event with presentations by Yaad Eliya and Jim Barry of PCB Technologies. This is your chance to gain knowledge for improvements in reliability, yield and therefore overall product cost. Come learn about PCB advancements from engaging speakers with years of experience and global industry knowledge.
 
This tutorial is a great value, at half the cost of one at SMTA International and it’s offered right in your backyard! Lunch, coffee breaks, course handouts and a certificate of completion are all included and topics include:
 
RF/Microwave Design Considerations and Options
Innovative solutions, based on close cooperation between mil/aero designers and the fabricator. Explore implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design, including for rigid-flex.
 
Thermal Mitigations Options at the Raw Card Level
The most extreme temperatures and stress facing the PCBA is often the reflow cycle. However, the “post-reflow” or operating temperatures facing the product in the field can be detrimental and even disastrous. Learn how smaller, more complex designs are creating thermal mismatches and intense temperature. Explore options in design, materials, and “adder options” such as heatsinks and coins to
mitigate temperature.
 
Reliability: Design for Reliability & Design for Manufacturability
A focus on two parts of the PCB process: the design and how it affects product performance, and what happens once the design reaches the PCB manufacturer. Review nonfunctional pads, via fill, stacked vs. staggered, cross-hatched grounds in rigid-flex, conductor routing, and more. Also, how manufacturer processes affect solderability, looking at DC plating vs. reverse pulse, multiple finishes, edge
plating, and hole placement.
 
Cost and Registration information HERE!
*Registration deadline is June 1st
 
Location:
Country Inn & Suites
1717 W Nursery Rd.
Linthicum Heights, MD 21090
 






Download Presentations from Capital Chapter Meetings


Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Fred Dimock BTU International

Additive Manufacturing Corporate Development
KEYNOTE SPEAKER: Geoffrey Doyle, Jabil Circuits, Inc.

Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker: MB Allen, KIC

Avoiding the Pitfalls of Voiding in PCB Assemblies
Speaker: Kim Flanagan, Indium Corporation
 


 






Download the latest Chapter Newsletter


January 2016 Newsletter

August 2012 Newsletter

September 2010 Newsletter

May 2010 Newsletter

The SMTA Capital Chapter is looking for sponsors to advertise in our newsletter.  Advertising revenues will help the Capital Chapter to bring the best experts to our meetings and workshops.  Please, contact Fernando Rueda (fernando_rueda@kyzen.com) for details.








Chapter Calendar of Events

Date / Time Event Location Contact/Email
June 11, 2019
9 AM
SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective Country Inn & Suites 1717 W Nursery Rd. Linthicum Heights, MD 21090 Brain Costanzo 
240-404-8423
August 22, 2019
Capital Expo & Tech Forum Johns Hopkins University/Applied Physics Lab Hannah Terhark
(952) 920-7682 


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Our Chapter Leaders


President : Bert Horner  (The Test Connection, Inc.)
Phone : 410-205-7300

Vice President : Brian A. Costanzo  (DRS Signal Solutions)
Phone : 301-944-8535

Secretary/Treasurer : Fernando Rueda  (KYZEN Corporation)
Phone : 615-983-4603

VP of Technical Programs : Karen Walters Ebner  (Raytheon Systems Company)
Phone : 508-490-1639

Events Chair (Appointed) : Katie Higgs  (NTS)
Phone : 410-229-4371

VP of Communications (Appointed) : Jessica Molloy  (ZESTRON Americas)
Phone : 703-393-9880

Board Liaison : Sal Sparacino (ZESTRON Americas)
Phone Contact : 703-393-9880

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Global Members of our Chapter

ZESTRON Americas



Global Participating Members of our Chapter

Harris Corporation

KYZEN Corporation

ZESTRON Americas



Corporate Members of our Chapter

AMTI

Annapolis Micro Systems, Inc.

CEMSI

Cornet Technology

Department of Defense

Leidos

NTS-Baltimore

Powertrain Control Solutions

Practical Technologies, Inc.

Simplimatic Automation

The Test Connection, Inc.

Zentech Manufacturing, Inc.

ZESTRON Americas



SMTA Global Members

Amazon Amazon Lab126 Celestica, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO INVENTEC Performance Chemicals ITW EAE Keysight Technologies KYZEN Metallic Resources, Inc. Micro Systems Technologies Management AG NEO Technology Solutions Nokia Plexus Corp. Samtec Microelectronics Specialty Coating Systems, Inc. VEXOS ZESTRON Americas

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Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819