University of Texas at Arlington Student Chapter

Arlington, TX 

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Power Electronics Wide Band Gap (WBG) semiconductor technology by Nicholas Mescia

Group picture from the November 14th event. Thanks everyone for making it happen. 

Invited Speaker: Nicholas Mescia

The presentation is to expose the students to the evolving Wide Band Gap (WBG) semiconductor technology, and describe our WBG supply line and possible employment possibilities within the various manufacturers within the supply line, per their technical studies. PowerAmerica is one of the Manufacturing USA institutes to promote R&D studies from universities and government agencies, and bridge those studies to USA manufacturing to promote the various technologies, and USA jobs.

by  Nicholas Mescia

Tuesday, November 14 2017
WH 413
5:00pm - 7:00pm


Invited Speaker: Dr. Viswanadham Puligandla


Reliability Testing and How to Do it Right

by  Dr. Viswanadham Puligandla

Wednesday, April 26, 2017
WH 200
3:30 pm - 4:30 pm

UT Arlington Student Chapter


SMTA UT Arlington Student Chapter members at SMTA Dallas Expo & Tech Forum 2017

Poster Presentation and Luncheon 2/13/17

Chapter officers with Attendees  

UT Arlington Student Chapter Poster Presentation & Luncheon

Meet the technologists of the future.  Learn new technology, meet people, find interns and talented employees.   
Monday February 13th, 2017
11:00 a.m. to 1:00 p.m.
SMTA Members, Non-members, Technical Managers, and Hiring Managers are welcome.
RSVP now,  request no later than 2/10 to this e-mail: 
Forward this invitation to others. 
Pricing:      FREE for all 
11:00-11:20 Check-in & Networking
11:20          Lunch begins  (provided)
11:40          Brief Introduction by Prof. Dereje Agonafer 
12:00          Poster Presentations       
1:00            Adjourn
Poster Titles 
1. Effect of Copper Density on Reliability of Thin Wafer Level Chip Scale Package by Pavan Rajmane
2. The Impact of Low Loss Materials on Board Level Reliability by Mugdha Chaudhari
3. Crack Propagation Study on 3D TSV Package under Thermal Loading by Unique Rahangdale 
4. QFN Package Assembly under Power and Thermal Cycling by Navya Kasi Reddy
5. Comprehensive Design Analysis of Thick FR-4 QFN Assemblies for Enhanced Board Level Reliability by Rishikesh Tendulkar
6. Solder Ball Reliability Assessment of WLCSP under Power Cycling by Srikanth Chintapally
7. Comparative Assessment of Board Level Reliability of PCBs using Viscoelastic Modeling vs. Elastic Modeling by Abel Misrak
Brief Overview of Work Done at Electronics, MEMS, and Nanoelectronics Systems Packaging Center (EMNSPC) at UT Arlington
Professor Dereje Agonafer
Dereje Agonafer, Jenkins Garrett Professor
Mechanical and Aerospace Engineering, UT Arlington

The mission of EMNSPC at UTA is to establish a first-class research center that will meet the needs of industry, and in particular, the state of Texas and the North Texas region's "Electronic, MEMS and Nanoelectronics Packaging Industry". This includes research, education and training. EMNSPC will target the needs of the Microelectronics, MEMS and Nanoelectronics (with a special emphasis on thermo mechanical issues) as a fundamental research area as these technologies have and will continue to overlap. "Technology" and "Executive" Advisory Board members from Industry will provide leadership and guidance to the Center.
Speaker Bio:
Dr. Agonafer is the Jenkins Garrett Professor in Mechanical and Aerospace Engineering Department (first endowed chair in the history of the department). He heads two centers and is "Site Director of NSF IUCRC in Energy Efficient Systems" and Director of "Electronics, MEMS and Nanoelectronics Systems Packaging Center." After receiving his PhD degree, he joined IBM and in 1991, the value of his contribution to "Computer Aided Thermal Engineering" was recognized by being awarded the "IBM Outstanding Technical Achievement Award in Appreciation for Computer Aided Thermal Modeling."  Since joining UTA in 1999, he has successfully advised over 140 graduate students and currently advises 12 PhDs and 32 MSc students. His recent focus has been on data center cooling as "Site Director of NSF IUCRC in Energy Efficient Systems" and 3D packaging/cooling (patents filed). Professor Agonafer serves on the Scientific Advisory Board of a NSF Center, Mid-Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007. He also serves on advisory boards at Princeton, Colorado, Howard and CCNY. Professor Agonafer has published over 200 papers and 10 issued patents (with several pending), He is a Fellow of ASME and Fellow of The American Association for the Advancement of Science (AAAS).  Professor Agonafer has received numerous awards during his distinguished career including the 2008 Thermi Award for "Significant Contributor to the field of semiconductor thermal management", and the 2009 InterPACK Excellence Award for leadership in electronic packaging. Professor Agonafer was at MIT as a Dr. Martin Luther King, Jr. Visiting Professor during the 2007 academic year. He has offered courses and given lectures and keynotes internationally including Chiba, Toyama, Puerto Rico, Singapore, Panang, Seoul, Taipei, Shanghai, Tokyo, Osaka, and Capetown, Tufts University, Northeastern University, MIT and Harvard. Professor Agonafer received the 2014 NSBE Golden Torch Award In May 2014, he received the ITHERM Achievement, an award first instituted in 1996, and presented biennially in recognition of significant contributions made in thermal and thermomechanical management of electronics. In 2015, he received over 2 million dollars of servers from Yahoo and Cisco to build his data center lab.
Rio Grande A,
E H Hereford University Center, 300 W 1st St, Arlington, TX 76010
UT Arlington Hereford Center

Our Chapter Officers

President : Abel Misrak  (Unversity of Texas at Arlington)
Phone : 214-228-9473

Vice President : Pavan Rajmane  (University of Texas at Arlington)
Phone : 817-704-9150

Secretary : Prateik Parag Sangekar  (The University of Texas at Arlington)
Phone : 6822528888

Treasurer : A S M Raufur Chowdhury  (University of Texas at Arlington)
Phone : 915-261-5042

Chapter Advisor : Dereje Agonafer Ph.D.  (University of Texas at Arlington)
Phone : 817-272-7377

Event Officer : Mahesh Pallapothu  (University of Texas at Arlington)
Phone : 6822604627

Board Liaison : Matt Kelly (IBM Corporation)
Phone Contact : 905-316-5242

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