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SMTA India Technical Workshop - Designing and Manufacturing Telecommunications Hardware for the Next Decade and BeyondMonday, November 25, 2019 | 10:30 AM
Location: Cisco Cessna Business Park, Bangalore, India
Designing and Manufacturing Telecommunications Hardware for the Next Decade and Beyond
25th November 2019, Bangalore
Post Moore's Law and Quantum Electronics - An Unparalleled Opportunity for Indian Scientific, Engineering and Industrial Organizations
Presented by Prof. Rao R. Tummala (Georgia Institute of Technology, USA)
Abstract: As Moore’s Law begins to come to an end, for not only fundamental reasons but also for computing performance, power, cost, and investments, it is becoming clear that a different vision for electronics systems must emerge. The new era of artificial intelligence mimicking the human brain, with several orders better computer performance than with the current electronics, is yet another reason for the end of Moore’s Law. A typical human brain has about 90 billion nerve cells interconnected by trillions of synapses providing trillions of pathways for the brain to process the information along with petabyte memory. New Moore’s La w, therefore, must duplicate this architecture. The packaging or I/Os has historically evolved dramatically from dual-in-line ceramic packages in the 1970s with 16 I/Os to silicon packages approaching 200,000 I/Os. Currently, the best Moore’s Law for packaging is with wafer-based silicon packaging. But silicon-based packaging has many limitations at the material, device, circuit, and system levels.
This talk describes a vision for post Moore's Law Electronics from Moore’s Law for ICs to electronic and photonic interconnections and eventually to DNA and quantum computing. Post Moore’s Law electronics is highly interdisciplinary, requiring a team of scientists and engineers to work together from electrical, mechanical, thermal, optical, bio and nanomaterials, and chemical process disciplines. The Post-Moore’s Law electronics provides a new opportunity for India to be a global player, in contrast to old Moore’s Law.
About the Speaker: Dr. Rao Tummala is a Distinguished and an Endowed Chair Professor in Electrical and Computer Engineering and in Materials Science and Engineering at Georgia Tech. He is also the Founding Director of the Microsystems Packaging Research Center (PRC) pioneering the Second Law of Electronics (the first being Moore ’s Law) by his System-On-Package (SOP) vision. Prior to joining Georgia Tech, Professor Tummala was a Fellow at IBM Corporation where he invented a number of major technologies for IBM's products for displaying, printing, magnetic storage, and packaging. He was the lead materials scientist pioneering the industry’s first flat panel display in the 1970s; Technical leader and Program Manager for the industry’s first R&D in multi-chip-module (MCM) leading to the first 61-layer, low-temperature, co-fired ceramic (LTCC) in 1980s, and the Director of IBM ’s Advanced Packaging Research laboratory. He has published over 320 technical papers, holds 71 U.S. patents and inventions, and authored the first modern reference book for microsystems packaging in 1988.
Star Invited Presentations
Customization and Personalization in a Connected Ecosystem (Live Telecast)
Presented by Girish Wable (Strategic Capabilities, Jabil Cicuits, USA)
Abstract: The digital revolution is upon us and connected devices are ubiquitous as part of the digital transformation. Integrating both the hardware data collection and analytics layers of the IOT ecosystem across different domains (smart retail, hospitality, health & safety) can help enhance the ROI of the solution. Such “devicification” leads to customized and personalized solutions enabled by additive manufacturing processes like: 3D printing, printed electronics, consumer packaging, and flexible hybrid electronics. These manufacturing innovations create opportunities where the benefits of functional integration are realized and can potentially impact manufacturing processes, reducing assembly steps and fostering supply chain simplification. Materials and sensor developments have a large role to play in advancing this field.
About the Speaker: Mr. Girish Wable is currently Sr. Manager of Strategic Capabilities at Jabil Circuits, USA. He is a Mechanical Engineer with a Master of Science in Industrial Engineering. Technology, operations, sourcing and business solutions strategist for Jabil. +25 years of global experience in electronics manufacturing, high performance coatings, material handling, automation, additive manufacturing, printed electronics and digital transformation. Leads up strategic business and technical initiatives for Jabil. Keynote speaker with multiple patents and publications.
Special Invited Presentations
Presented by Dr. Morgana Ribas (MacDermid Alpha Electronics Solutions, India Research Centre, Bangalore, India)
Abstract: The assembly material industry is continually adapting to meet the evolving needs of the markets it serves. In recent years, the reliability requirements have continued to increase beyond the capabilities of SAC305 toward more complex microstructures that enable increased thermal-mechanical performance in harsh environments. This presentation will explore topics ranging from Pb-solder alloy design, enhancements in solder paste chemistry, and processing differences between SnPb and Pb-free solders.
About the Speaker: Dr. Ribas is currently a Sr. R&D Manager at MacDermid Alpha India Research Centre in bangalore. She has Bachelor and Master's degrees in Metallurgical Engineering from UFRGS, Brazil, and Ph.D. from the Mechanical Engineering & Materials Science department at Rice University, USA. +20 years R&D experience, > 65 publications in journals, conference proceedings and patents.
Intra and Inter System's Connection Through Cables and Connector Arrangements Signal And Mechanical Constraints
Presented by N. S. Krishna Kumar (Sr. Consultant and Trainer, Bangalore)
About the Speaker: Mr. N. S. Kumar is an industry veteran on manufacturing of cable assemblies. He was Heading manufacturing of cable assemblies for Tyco Electronics (then AMP). Presently Sr. Consultant and Trainer in process improvements. Trainer for IPC India Wiring Harness Manufacturers Association (WHMA) standards.
Questions? Call +91 96200 75752
Registration Fees: Rs. 500 (SMTA members) and Rs.1,000 (SMTA non-members) Registration includes: Workshop, lunch and refreshments Register by e-mail, including your name, company and contact details: email@example.com
SMTA Webinar: Electronic Hardware CorrosionWednesday, October 9, 2019 | 9:30 AM
Location: Online Webinar (Organized by SMTA India Chapter)
Members must log in to the smta.org website to register at the member rate. Pay by credit card online by clicking the "Register Now" button.
SMTA India Technical Workshop - Reliable Electronics for the Automotive IndustrySaturday, July 6, 2019 | 09:30 AM
Location: Sathyam Grand Resorts, Sriperumbudur - Chennai
Reliable Electronics for the Automotive Industry
6th July 2019, Chennai
Essentials of EV - The EV Technology Trends
Presented by Dr. Allabaksh Naikodi (Mahindra Electric Mobility Ltd.)
Speaker: Dr. Allabaksh Naikodi has more than 32 years of leadership in electronics and is presently heading the Advance Technology Department of Mahindra Electric - the Electric Vehicle Company of Mahindra. He obtained a Ph.D. degree in Electrical Engineering from the Indian Institute of Technology, Madras (Chennai), India in 1995. Prior to joining Mahindra Electric he has worked for ABB, Honeywell, Schneider Electric and Tech Mahindra. He is a member of several technical committees including the expert committee of the Government of India on EV sub-systems development and BIS ETD51 for charging systems. He has many publications, including eleven patent applications in EV Technologies.
Star Invited Presentations
Advanced High Reliability Interconnect Technologies in Automotive Electronics
Abstract: Electronics content in automobiles is increasing dramatically, with the emergence of “Autonomous-Connected-Electric-Shared” mobility. Demands on automotive electronics system reliability are significant, calling for high reliability of automotive electronic interconnects. This paper presents advances in interconnect technology for electronics in various automotive systems.
Speaker: Dr. Ravi Bhatkal currently serves as Managing Director, India, Cookson India Private Limited, and is responsible for the MacDermid Alpha Electronics Solutions and MacDermid Enthone Industrial Solutions businesses in India. Previously he served in various VP and GM positions at Alpha Assembly Solutions, Alent and Cookson Electronics. He is also Member of the Global Board of Directors of iNEMI. He earned a Ph.D. in Materials Science and Engineering and M.B.A. from Rensselaer Polytechnic Institute, an M.S. in Materials Science and Engineering from Vanderbilt University, and a B.E. in Mechanical Engineering from the College of Engineering, Pune, India. He is widely published and is a co-inventor on four granted and four pending patents.
Key Design Variables that Impact Electrochemical Reliability of Electronic Devices (live telecast)
Presented by Dr. Mike Bixenman (KYZEN)
Abstract: Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. Reliability of these devices requires high level of cleanliness, especially residues that are ionic in nature. Will cover design variables that impact electrochemical reliability of Electronic Devices, including methods for screening materials and processes.
Speaker: Dr. Mike Bixenman is Co-founder and Chief Technology Officer of KYZEN Corporation. He has 30 years working experience, is a prolific author/co-author of more than 100 technical papers, holds four earned degrees, including a Ph.D. in Business Administration.
Special Invited Presentations
HDI Design Challenges and DFMA
Speaker: Amba Prasad is a veteran PCB Designer and architect with more than 30 years designing for the telecommunications industry. He is also a trainer for Certified IPC Designer and Advanced Certified IPC Designer courses.
Questions? Call +91 96200 75752
+91 96200 75752
SMTA PROCESS ENGINEER CERTIFICATION PROGRAM
SMTA India is accepting the applications for PROCESS ENGINEER CERTIFICATION PROGRAM!
Be the first few to join and part of the coveted global network of "SMTA Certified Process Engineers".
Limited seats offered on first occupancy.
Please send your request soon or queries for any specific details!
Email: firstname.lastname@example.org / email@example.com / firstname.lastname@example.org
Ankan Mitra (WEAMG Electronic Solutions Pvt Ltd)
Vice President :
Amba Prasad (Tejas Networks Ltd.)
Pankaj L. Bansod (Honeywell Technology Solutions)
Dhiren Shah (Pro Innovative Technologies Pvt. Ltd)
VP of Technical Programs :
Morgana Ribas (MacDermid Alpha Electronics Solutions)
VP of Membership :
Rajeev Kulkarni (Electronics and Automation)
VP of Public Relations :
Madhukar Rao (Hutakshi Associates)
Board Liaison :
Robert Kinyanjui (Deere & Company)
Keysight Technologies International