Toronto (Ontario)

ON,  Canada

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Toronto SMTA Expo & Tech Forum


In conjunction with the International Conference on Soldering & Reliability (ICSR)

Wednesday, June 7, 2017 
Location: Edward Village Markham 
50 East Valhalla Drive
Markham, ON L3R 0A3


Register here to attend the expo only!
Technical conference and workshops not included.

Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

ICSR Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

Exhibit Hours:
Wednesday, June 7, 2017: 10:00am – 3:30pm

Registration Opens

Expo Opens

12:00pm - 1:00pm 
Free Lunch!

A Special Thank You To Our Lunch Sponsor: Nortec Humidity! 


1:00pm – 2:00pm 
Chuck BauerNanotechnology in Electronics Packaging, Interconnect, and Assembly: Hype or Reality? 
Chuck Bauer, Ph.D., TechLead Corporation

While often exaggerated and over-promised, nanotechnology now provides vital performance enhancements to electronic systems after over a decade of R&D. Advanced solders and adhesives pioneered nanotech adoption by electronics manufacturers by minimizing technical risk and masking their nanotechnology nature via drop-in alternatives. Hype gives way to breakthrough as new nanotech solutions address multiple aspects of packaging, interconnect, and assembly. Leading nanotech contributions today include surface finishes for stencils and tin whisker mitigation, adhesives, die attach and solder replacements, via structures, additive circuit formation and 3D printing, novel conductors and dielectrics, and passive components. The authors examine a broad range of exciting evolutionary as well as revolutionary nano-based technologies for electronics manufacturing, identifying key technical challenges and fascinating practical applications characterizing the potential routes to commercialization. As with most technical developments, evolutionary nano-enabled solutions find quicker adoption thanks to existing standards and infrastructure, but revolutionary nano-alternatives entice early adopters with their potential, albeit at substantial risk, to displace incumbent technologies or even more excitingly to create entirely new markets. Presentations of practical and cost effective applications demonstrate that nanotechnology today indeed represents reality instead of hype.

2:00pm - 2:30pm 
Alan RaeiNEMI Roadmap 2017 and Research Priorities
Alan Rae, TPF Enterprises

The 2017 iNEMI roadmap is now the only comprehensive electronics roadmap left in the Western Hemisphere. This talk outlines some of the findings relevant to the assembly community and the process underway to develop Research Priorities for companies, University and Government laboratories.

2:30pm - 3:00pm 
Alan RaeReliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach
Mike Bixenman, DBA, KYZEN Corporation

Bottom terminated electronic components can fail from contamination trapped under the device. Many devices are designed with large, uninterrupted solder mass and a low standoff height, which close off paths for flux to outgas during reflow. The surface tension effects and wetting properties of the flux within solder paste can underfill the device with active residue that bridges conductive paths. Environmental conditions can mobilize conductive ions that lead to metal migration, and from which ultimately causes intermittent performance and failure. Non-standard test methods have been developed to perform site specific analysis of both contamination trapped under the bottom termination and reliability expectations based on the current assembly process conditions. These test methods allow an OEM to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.

The purpose of this research paper is to demonstrate the use of these non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.

Dessert & Coffee Break!

Expo Ends

Current Exhibitor List:

Adroit Circuit Logix Private Limited 
Alpha Assembly Solutions 
Apex Tool Group - Weller 
Aven Tools, Inc. 
Comtree Inc. 
Conductive Containers, Inc. 
Electronic Coating Technologies 
EPTAC Corporation 
Foresite, Inc. 
Fuji America Corporation 
High Density Package User Group 
Indium Corporation 
Integrity Testing Laboratory Inc. 
INVENTEC Performance Chemicals USA
KYZEN Corporation 
MicroCare Corporation 
Nikon Metrology, Inc. 
Opti-Tech Scientific Inc. 
Panasonic Factory Solutions 
Seica Inc. 
SMT Industrial Supply, Inc. 
StaticStop a division of SelecTech, Inc. 
Trans-Tec Yamaha 
Universal Instruments 
ZESTRON Americas 

Companies in bold are SMTA corporate members

The Toronto Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at or call 952-920-7682. Thank you!
Exhibit Hours:
Wednesday, June 7, 2017: 10:00am – 3:30pm

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). 
Early Registration Ends May 5th! Rates go up $100!

For a hard copy of the sponsorship and exhibits form, click here.

View the floor plan.

Exhibit space entitles you to: 

  • 6 ft. Draped table
  • Two Chairs
  • Attendee list (sent after the conference)
  • Company sign
  • Lunch & Breaks

Sponsorship Opportunities:

  • Lanyard Sponsor $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Bag Sponsor - $400/$800 (Official sponsor for ICSR Conference & Toronto Expo)
  • Lunch Sponsor - $800
  • Refreshment Break Sponsor - $550

SMTA Toronto Chapter Meeting - Electronics Ruggedization



This meeting is intended for any individuals that are interested in knowledge of Ruggedization along with Industry work that has been done to understand and mitigate concerns related to harsh environments that may impact electronic assemblies.




With the growth and diversification of work within North America and Globally; there has been an increase in Ruggedization for both commercial and military grade products. This meeting is designed to provide an overview by international speakers and organizations that specialize on Ruggedization as well as mitigation.


This workshop will have subject matter experts from MG Chemicals, Momentive Performance Materials as well leaders from 3M to share their information on this topic.




There will be nominal costs as noted below with discounts for SMTA members.

Space is limited for this event and will be on a first come first basis.

· Industry / SMTA Discount - $40 / $20 CDN

· Student / SMTA  Discount - $20 / $10 CDN


September 15, 2016 



Monte Carlo Inns - Downtown Markham

7255 Warden Ave, Markham, ON L3R 1B4

Event Hours: 1:00pm - 5:00pm



Michel Hachey:  Michel Hachey is the Chief Technical Communicator, scientific officer, and regulatory specialist at MG Chemicals.

Clarissa Miller:  Senior Global Program Manager, Electronic & RTV Materials for Momentive Performance Materials

Weixing Hou:
  Ph.D., Senior Application Development Specialist EMD and DMSD Divisions for 3M Canada


For a detailed abstract for each speaker; please see our website for this information.

Our Chapter Leaders

President : Jason Keeping P.E.  (Celestica, Inc.)
Phone : 416-443-7448

Vice President : Eddie Rezaei  (STIM Canada Inc.)
Phone : 416-636-4584

Secretary : Kahlie Speechly  (Simcona Electronics of Canada Inc.)
Phone : 647-825-4966

Treasurer : Jason Rogers  (MG Chemicals)
Phone : 905-331-1396

VP of Marketing : Tom Charlton  (Electronic Coating Technologies)
Phone : 905 866 6795

VP of Membership (Appointed) : Sutharshan Suppiramaniam  (Tyco Safety Products Canada Ltd.)
Phone : 905-760-3000

Ambassador to Waterloo Region : Bev Christian Ph.D.  (HDPUG)
Phone : 519-648-9717

Board Liaison : Matt Kelly (IBM Corporation)
Phone Contact : 905-316-5242

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Global Members of our Chapter

Celestica Inc.

Creation Technologies Inc.


Global Participating Members of our Chapter

Celestica Inc.

Celestica, Inc.

Creation Technologies Inc.


Corporate Members of our Chapter

5N Plus Micro Powders

Accu-Automation Corporation

Acculogic Inc.

Bittele Electronics Inc

Celestica Inc.

CMC Electronics Inc.

Comtree Inc.

Creation Technologies Inc.

Digico Fabrication Electronique Inc

Electronic Coating Technologies

Grass Valley, a Belden Brand

ITL Circuits

Kapsch TrafficCom IVHS

Laytec Design & Consulting Inc.

MG Chemicals

OES Inc.

PFC Flexible Circuits Ltd.

Safran Electronics Canada Inc.

SMTC Corporation


STIM Canada Inc.

Tyco Safety Products Canada Ltd.


SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819