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San Diego Chapter Meeting - Wednesday May 10 2017

 Failure Modes in Flip Chip and Wire Bonded Packages

Presented by Mumtaz Bora - Sr. Staff Packaging Engineer -Peregrine Semiconductor

Phone: 858-795-0112 Email:

Growth of portable and wireless products is driving miniaturization, resulting in development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects in order to shorten the signals, reduce inductance and improve functionality. The flip chip packages have solder bump interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame.

Integration of these packages in high volume SMT assembly demands good assembly process controls at the package level and clear understanding of the failure modes to minimize defect escape to subsequent assembly operations.  This challenge is enhanced with the transition to lead free reflow as the higher peak reflow temperatures results in more thermal and CTE mismatch between package and PWB.

This presentation provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. Some of the lessons learned as the factory transitioned to thin form factor packages are shared.


Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX.  She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation.  She has worked with suppliers and subcontractors in several parts of Asia.  She is currently a Sr. Staff Packaging Engineer at Peregrine Semiconductor for qualification of RFIC packages for wireless, broadband, Automotive and Hi-Rel/Space applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Vice President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently the Publicity Chair for the IMAPS San Diego Chapter.


Location: NEOTech 237 Via Vera Cruz


5:30 – 5:45PM             Registration check-in

5:45 – 6:15PM             Dinner

6:15 -- 6:30PM             Announcements and Introductions

6:30PM                         Presentation

Cost: $15 members, $20 non-members.  

RSVP: through this link by 05/08/2017   or by going to “San Diego Chapter News”        


2D, 2.5D, and 3D X-Ray Inspection – What’s a “D”?

Presented by Dr. Bill Cardoso - CEO, Creative Electron, Inc.
Phone: +1 760.752.1192 E-mail:

X-ray inspection has been widely adopted in the electronics industry over the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements, so becoming an integral part of the quality assurance function of modern electronic manufacturers.

As new x-ray technologies are introduced – with new algorithms and new hardware – users are faced with a growing range of choices. Users need a solid technical background to understand these options and make an educated decision when acquiring x-ray inspection capabilities. Unfortunately, x-ray companies are not always clear about the pros and cons of each option. As a result, users end up buying too much or too little capability. In either situation, the user is left without the right x-ray inspection solution. 

The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. We will set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in detail at the user level – no math involved. Most importantly, this presentation will cover all the modalities to be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.

Bill staBillrted his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering and after a 10-year long career at Fermi lab, Bill moved from Chicago to sunny California to start Creative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). Starting with an associate degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill was 2015 president of the SMTA San Diego chapter and is member of the technical committee for SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 120 technical publications, a contributor to 2 books, owner of a few patents, and a frequent speaker at technical conferences. 




   5:30 – 5:45PM             Registration check-in

   5:45 – 6:15PM             Dinner

   6:15 -- 6:30PM             Announcements and Introductions

   6:30PM                       Presentation


   $0 members, $0 non-members.  All costs kindly are covered by Creative Electron

   Please RSVP by 04/10/2017 Thanks!
      or RSVP by going to “San Diego Chapter News”


   Creative Electron, 253 Pawnee St., San Marcos, CA. 92078   
logo CE                   


Minimizing Voiding in Bottom-Terminating Components

Presented by Joe Bahou, -Technical Sales Support Engineer, West Coast

Indium Corporation

Phone: +1 (315) 853-4900 x7677 E-mail:


This presentation with cover an Introduction to QFN challenges, determining void criteria, design of experiments (DOE), results, void control using solder fortification and conclusions.


Joe is a Technical Sales Support Engineer supporting Indium Corporation's advanced SMT materials, fluxes and engineered thermal materials, to customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry.  Joe is based in Huntington Beach, California and has more than 16 years of experience in electronics assembly manufacturing, including hands on experience in SMT production.Joe has a bachelor's degree in Mechanical Engineering from the University of Massachusetts (Lowell). He has worked for several major companies, including MFlex in Anaheim, California. In addition he has worked on the development of 01005 chip component placement on to a printed circuit board .




    5:30 – 5:45PM          Registration check-in

    5:45 – 6:15PM          Dinner

    6:15 -- 6:30PM          Announcements and Introductions

    6:30PM                     Presentation


    $0 members, $0 non-members ….Indium Corporation is kindly sponsoring this meeting.

     Please RSVP by 03/06/2017 Thanks!



    14110 Stowe Dr, Poway, CA 92064-7147

    Tel: 858.535.6000



Newsletter Archive

San Diego Chapter Newsletters

February 2012 April 2012  May 2012  June 2012 Newsletter  SMTA San Diego Chapter Newsletter October 2012 November 2012 Newsletter


Issue 20 
Issue 20 


February 2010  March 2010  April 2010  June 2010  
September 2010 


February 2009  March 2009  April 2009  May 2009  June 2009  September 2009  November 2009


May 2008  June 2008  August 2008  September 2008  October 2008  November 2008

2009 2nd Place Award  2010 Outstanding Award


Corporate Members

  Creative Electron Focal Spot 
 Hughes Circuits Kic Thermal  
 Nordson Asymtek  
Vitronics Soltec    

SMTA- San DiegoDisclosure

The contents contained in this section of the website are maintained by SMTA-San Diego webmaster. Any corrections or concerns should be sent to

Chapter Calendar of Events
Date / Time Event Location Phone Contact/Email
February 15, 2017
APEX Going Dutch-Lunch Tin Fish -170 6th Ave Gaslamp 8582321094   julie Bradbury-Bennett
March 8, 2017
Minimizing Voiding in Bottom-Terminating Components- Indium Corporation HME 14110 Stowe Dr Poway 8586584220   Brian Roggeman
April 12, 2017
2D, 2.5D, 3D X-Ray Inspection -What's a D? Creative Electron Creative Electron 253 Pawnee St San Marcos 6196016216   Liliana Barba
May 10, 2017
Failure Modes in Flip Chip and Wire Bonded Packages -Mumtaz Bora -Peregrine Semi Neotech 237 Via Vera Cruz San Marcos 8582321094   julie Bradbury-Bennett
September 13, 2017
Thermal Management in PCBs - by Doug Schneider -Stablcor Pergrine Semiconductor 9380 Carroll Park Drive San Diego, CA, 92121 8587950112   Mumtaz Bora

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Our Chapter Leaders

President : Brian Roggeman  (Qualcomm Technologies Inc.)
Phone : 858-658-4220
Email :

Vice President : Mumtaz Y. Bora  (Peregrine Semiconductor)
Phone : 858-795-0112
Email :

Secretary : David Kruidhof  (West-Tech Materials, Inc.)
Phone : 858-774-1174
Email :

Treasurer : Julie Bradbury-Bennett Ph.D.  
Phone : 858-232-1094
Email :

VP of Technical Programs : Bill Cardoso Ph.D.  (Creative Electron, Inc.)
Phone : 760-752-1192
Email :

VP of Membership : Philippe Frid  (Kulicke & Soffa Industries)
Phone : 442-236-1136
Email :

Board Liaison : Debbie Carboni (KYZEN Corporation)
Phone Contact : 215-498-8856
Email Address :

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Global Members of our Chapter


Global Participating Members of our Chapter


Corporate Members of our Chapter

CAIG Laboratories, Inc.

Creative Electron, Inc.

Hughes Circuits, Inc.


Kyocera America, Inc.



Palomar Technologies

Para Tech Coating, Inc.



SMTA Global Members

Amazon Celestica Inc. Cisco Systems, Inc. Creation Technologies Inc. FCA Group Harris Corporation Henkel Electronic Materials LLC HISCO, Inc. IDENTCO ITW EAE Jabil Circuit Sdn. Bhd. Keysight Technologies KYZEN Sdn. Bhd. Metallic Resources, Inc. Micro Systems Technologies Management AG NCAB Group USA NEO Technology Solutions Plexus Corp. Samtec Microelectronics SMAC Specialty Coating Systems Vexos ZESTRON Americas

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