Massachusetts (Boston)Boston, MA
Expos | Job Resources | Educational Grant | Students Only
2017 New England Expo and Technical Forum Thursday, November 16, 2017
The SMTA is privileged to have a membership that is willing to help one another and that contributes to its pool of knowledge. One of primary ways we do that at the regional level is through quarterly Chapter meetings and through our regional Expo’s.
Mark your calendars!
2017 New England Expo and Technical Forum
Thursday, November 16, 2017
50 Foster St.
Worcester MA 01608
Expo Day Schedule:
Registration: 7:00-8:00 am
Morning Tech Session: 8:00-10:00 am
Exhibit Hall Opens: 9:00 am
Two Keynote speakers!: 12:00 Noon
Afternoon Tech Session: 2:30-4:30 pm
Exhibit Hall Closes: 5:00 pm
We are building upon the success of the inaugural 2016 New England Expo and Technical Forum, and the Boston and Connecticut chapters working together to outdo ourselves in 2017 by adding:
· Technical Sessions that address today’s hot topics!
· Live SMT line!
· A day filled with fantastic giveaways!
Below is a highlight of our morning and afternoon sessions. Additional details are forthcoming over the next several weks, including abstracts and Speaker bio’s.
Global trends On Smart connected & Mechatronic products (ECAD Focus)
Global trends On Smart connected & Mechatronic products (Mechanical Focus)
What today’s successful companies are doing to support mechatronic and smart connected products.
The Smart Reflow Oven for the Industry 4.0 Factory (Smart Factory)
* What is the cost to attend the NE Expo and Technical Forum?
Nothing! Nada! Zippo!
*Where is the nearest hotel?
The Hilton Garden Inn (directly across from the DCU Center). We will soon be adding a link to a reservation site for discounted rates 11/15 and 11/16.
For more information about this event, please contact the appropriate person below:
Questions about attending the Technical Forum?
Sabrina Beck, SMTA-CT President at 860 309-8501 or Sabrina.Beck@AltekElectronics.com
Questions about exhibiting at the Expo?
Mark Siems, SMTA-CT Treasurer at 203 953-1276 or firstname.lastname@example.org
LASER EXFOLIATION REMOVAL OF CONFORMAL COATINGS
The SMTA Boston Chapter cordially invites you to attend a joint meeting and plant tour
with IEEE Reliablity and iMAPs organizations on Nov. 1st, 2017:
“Design for Rinsability” Presentation (SMTAI 2016) and “LASER EXFOLIATION REMOVAL OF CONFORMAL COATINGS FROM CCA PCB PAD SURFACES”
"We have reached our seating limit for this event and started a wait list."
Deadline to register for this event is by 7:00 PM today
TITLE: DfR-DESIGN for RINSE-ABILITY:EFFECT OF SMT COMPONENT PACKAGE DESIGN ON CLEANING EFFECTIVENESS
ABSTRACT: Circuit Cards Assemblies-CCAs are manufactured to meet Class 3 military-grade requirements –they must work the first time, every time. Certain electronic components from recent production builds were detected with cleaning residue remaining, and it appears that the component housing design is a major factor that determines whether a component entrains & entraps residues. To ensure protection to moisture or extreme environments, the CCA undergoes a conformal coating process on CCA exposed surfaces. Prior to conformal coat, the surface of the CCA is semi-aqueous chemically cleanedto provide a surface condition suitable for the coating to properly adhere. However, If the cleaning solutions get entrained / entrapped within the components, residual contamination may cause materials degradation of the components, which may limit the electrical performance of the device. As a result, a study was initiated to understand the susceptibility of entrainment / entrapment of cleaning residues on 28 different components, each with various component cover / attachment constructions and vent open areas.
TITLE: LASER EXFOLIATION REMOVAL OF CONFORMAL COATINGS FROM CCA PCB PAD SURFACES
ABSTRACT: CCAs-circuit card assemblies for military applications require a high level of performance and reliability, and typically undergo a CC-conformal coating process after SMT-surface mount technology assembly to protect the circuit card and attached electrical components from exposure to moisture and harsh environments. However, certain areas of the CCA or PCB-printed circuit board metallized surfaces are desired to be free of conformal coating and are required to be clean, solderable and electrically / thermally conductive. Current conformal coating de-masking processes are time consuming and labor intensive. A more cost effective and automated laser-aided exfoliation method was evaluated and successfully demonstrated to remove parylene C conformal coatings from ENIG-plated Cu pads. The parylene was removed within a precise pad area, and tested to be solderable to enable subsequent wire-soldering and consistent sealant coverage in a cost-effective manner. This paper will discuss the “physics” of laser ablation, laser exfoliation, materials interactions, test and characterization methods used to evaluate and validate the laser-aided removal processes on actual production CCA product.?
Location: Raytheon, Andover, MA
5:00 PM Attendee Registration
5:15 PM Raytheon Facility tours (Walk through of SMT Lines and Failure Analysis Area)
6:00 – 7:00 PM Dinner in Raytheon, Andover Cafeteria (Will work with cafeteria on dinner options)
7:00 – 7:10 PM SMTA Boston Chapter Welcome and Announcements by Boston Chapter President Michael Jansen
7:10 – 7:25 PM Raytheon Welcome and Overview of what Raytheon does
7:25 ~ 8:30 PM “Design for Rinsability” Presentation (SMTAI 2016) and “LASER EXFOLIATION REMOVAL OF CONFORMAL COATINGS FROM CCA PCB PAD SURFACES” presentation (SMTAI 2017) both presented by Norman Armendariz – Raytheon Engineering Fellow
~8:30 PM Q&A
Speaker Biography: Dr. Armendariz is an Engineering Fellow at Raytheon responsible for materials engineering design, materials analysis, process equipment development, and production support associated with the manufacturing of CCA- circuit card assemblies used in missiles, smart munitions, ground based radars, and mobile sensors across multiple US and international sites. Norm has over 20 years of industrial experience, having worked for Lockheed/NASA, Motorola, TI and Intel, and as Director of Labs / Asst. Engr. Prof. at American University. He holds an interdisciplinary PhD in Chemical Engr. from New Mexico State University, MS in Materials Science Engr. from the University of Illinois at Urbana-Champaign, and BS Metallurgical Engr. from Colorado State University, with 9 US patents and 27 peer-reviewed publications.
350 Lowell Street
Andover, MA 01810
Registration/Arrival Details: (US Citizens Only)
* Pre-registration is required, walk-ins will not be able to pass the guard at the gate.
* Raytheon is a secure facility – escort is required at all times while on the premises)
* YOU MUST bring proof of US Citizenship to avoid any entry issues. this can be a valid driver’s license, passport, or government issued photo ID.
* you will need to provide first, middle and last name along with company affiliation during registration
* You MUST REGISTER HERE with online RSVP to be placed on the wait list! or copy this url to your browser https://
* SMTA, iMAPS & IEEE Members who RSVP in advance: $25
* Non-Members: $30
* Cost includes: Dinner, tour, networking and presentations
* Payment will be accepted at the door. Cash, checks or credit cards accepted.
SMTA & iMAPS New England Joint Meeting Tues. Oct. 24, 2017 at Holiday Inn, Tewksbury-Andover, MA
"Designing, Building, and Flying cutting-edge Spectrometers in the Stratosphere on a Shoe String"
Speaker: Chris Tuozzolo (Harvard/Draper)
Click here to Register Now!
or copy this to your browser https://events.r20.constantcontact.com/register/eventReg?oeidk=a07eenrlldwb3fbd65f&oseq=&c=&ch=
SCHEDULE (times approximate)
5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner (American Buffet: Beef Tips & Scrod)
7:30 PM Technical Presentation
You'll enjoy this Presentation and a scrumptious Autumn Buffet. Chris will reveal some of the more interesting things learned in 9 years as the Lead Mechanical Engineer at the Harvard University Atmospheric Research Project. You’ll hear some of the technical and packaging challenges undertaken to evolve cutting-edge spectrometers from the laboratory optical table to airborne atmospheric chemistry research aboard NASA’s WB-57 and ER-2 stratospheric research aircraft. He’ll also contrast that experience with previous challenges as a design engineer for Texas Instruments, developing commercial sensors and subsequent work at Draper delivering sensors for the defense industry.
You may attend the presentation without eating dinner. Pre-Registration deadline is Wednesday, October 18..!!! After that, or for Walk-Ins At-Door, the fee is an additional $5.00 [Limited Availability].
Cancellations must be received by 3:00 p.m. Monday 10/23… or The Chapter will bill you for the registration fee. Options: To cancel a registration or register by e-mail, contact Matt Bracy: email@example.com
Technical Presentation at Bose Corporation on Tuesday, May 23rd, 2017
From points east or west, go onto route 90 Massachusetts Turnpike (toll road) to exit 12, merge on to route 9 west. Turn right onto California Ave (~0.3 miles - Framingham Office Park). Turn left on to New York Ave. Bose is first building on the right.
Joint iMAPS New England - SMTA Boston Chapter Technical Meeting on February 28, 2017
Click here for more information
Tuesday February 28, 2017 from 5:30 PM to 9:00 PM EST
242 Adams Place
Boxborough, MA 01719
Click here to register for this event.
Pre-Registration deadline is Wednesday, February 22..!!! After that, or for Walk-Ins At-Door, the fee is an additional $5.00 [Limited Availability].
Cancellations must be received by 3:00 p.m. Monday 02/27... or The Chapter will bill you for the registration fee. Options: To cancel a registration or register by e-mail, contact Matt Bracy: firstname.lastname@example.org
Michael G. Jansen (Raytheon Company)
Phone : 978-470-7598
Vice President :
Louis Feinstein (DS Solidworks)
Phone : 781-810-7261
Claire Jamieson (NCAB Group USA)
Phone : 603-362-1034
Charles Bickford (Wall Industries Inc.)
Phone : 603-778-2300
VP of Technical Programs :
Joe Kwong (Draper)
Phone : 617-258-1746
VP of Membership :
Neeta Agarwal (Benchmark Electronics)
Phone : 603-879-7002
VP of Marketing & Communications :
Peter Bigelow (IMI, Inc)
Phone : 978-373-9190
Board Liaison :
Timothy Jensen (Indium Corporation)
Phone Contact : 315-853-4900
NCAB Group USA