Great Lakes (Chicago)Chicago, IL
Expos | Job Resources | Educational Grant | Students Only
SMTA Great Lakes Solder Paste Roundtable EventTuesday, October 29, 2019 | 5:00 pm
Location: Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089
Tuesday, October 29th, 2019
|2400 Millbrook Drive|
|Buffalo Grove, IL 60089|
|**Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)|
By Dr. Mark Currie – Henkel Corporation
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51） (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
By Tony Lentz – FCT Assembly
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT). Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing. Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP). What is the overall effect of surface finish on solder paste performance? Which solder paste is best for each surface finish? It is the goal of this paper to answer these questions.
In the initial work, several different surface finishes were tested in the surface mount process including: HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver. Several different types of solder pastes were tested along with each surface finish including: lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes. Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding. The results of this testing were quantified and summarized. Recommendations pairing the optimal solder paste with each surface finish were given.
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters. Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver). Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste. Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile. Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured. Reflow performance was measured and quantified including wetting, solder balling, and graping data. Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads.
All of the test results, including data from the first study, are summarized, compared and contrasted. Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters. Recommendations are made for optimal combinations of surface finish and solder paste.
About the Speakers:
Dr. Mark Currie – Henkel Corporation
Shantanu Joshi - Koki Solder America Inc.
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
Tony Lentz – FCT Assembly
Tony Lentz has worked in the electronics industry since 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events. Tony is a speaker of distinction with SMTA. Tony holds B.S. and M.B.S. degrees in Chemistry.
You can pay with Cash/Check (onsite) or Credit Card (via PayPal - see PayPal button)
Upcoming Events for the SMTA Great Lakes Chapter
Thank you for the continued support of the local chapter of the SMTA. We have a couple of meetings that are currently in the planning stage. We are targeting a date during the periods listed below:
Meeting 1: March 12-15 (WK11) or March 19-22 (WK12)
Meeting 2: April 30-May 3 (WK18) or May 7-10 (WK19)
Topics, speaker information and location are to be determined. Please check back as we hope to have this information posted here as soon as possible.
Thank you again for your continued support of the Great Lakes Chapter of the SMTA!
|Date / Time||Event||Location||Contact/Email|
October 29, 2019
|SMTA Great Lakes Solder Paste Roundtable Event||Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089||
Ursula Marquez de Tino Ph.D. (Plexus Corp.)
Vice President :
Paige Dusek (FCT Assembly, Inc.)
Dave Munsterman (Accelerated Assemblies)
Gerri Noble (J.D. Noble & Associates, Inc.)
VP of Technical Programs :
Gene Dunn (Plexus Corp.)
VP of Membership :
Pratish Patel (Electronic Interconnect)
Webmaster (Appointed) :
Tim Noble 18033 (J.D. Noble & Associates, Inc.)
Technical Committee (Appointed) :
Manivannan Sampathkumar (Plexus Corp.)
Board Liaison :
Robert Kinyanjui (Deere & Company)