The Advanced Electronics Assembly Conference will enhance your knowledge of the latest manufacturing techniques, with skilled industry speakers from around the globe! Attending this conference will increase your value to your company, as we live in an ever-changing and improving environment.
Global experts from companies including Celestica, IBM and Jabil will guide you through the latest technology advancements related to Boundary Scan, Cleaning, Conformal Coating, Jetting, Laser Depaneling, Low Temperature Soldering, Rework, Selective Soldering, and X-Ray Inspection.
Thanks to the attendees, speakers, sponsors, and committee members who contributed to a successful inaugural AEAC. We look forward to returning in 2020.
More AEAC 2020 details coming soon...
By holding the same program in two locations, more visitors have a chance to attend this innovative conference.
19 November 2019
Novotel Budapest City Hotel
21 November 2019
DoubleTree by Hilton Oradea
The keynote presentation will cover Pete's somewhat unusual early career in engineering through to how the Raspberry Pi was conceived and designed. He will also discuss the challenges involved in deploying two special Raspberry Pi computers to the International Space Station providing educational outreach that is literally "out of this world."
Same schedule for both days
KEYNOTE: From Cardboard to Space - The Raspberry Pi Story
Pete Lomas, FREng, Raspberry Pi
IPC Conformal Coating Material & Application State of the Industry Assessment Project
Jason Keeping, P.Eng., Celestica, Inc.
Cleanliness Before Conformal Coating
Helmut Schweigart, Ph.D., Zestron
Implementation of a Low Melting Point Soldering Alloy in Electronics Assembly
Gheorghita Chirculete, Comet Electronics
Automotive Grade Solder Paste - How to Engineer the Flux Chemistry to Achieve High SIR and Maximize the Print & Reflow Process Windows
Graham Wilson, Indium Corporation
Selective Solder Fine Pitch Components on High Thermal Mass Assembly
Gerjan Diepstraten, Vitronics Soltec BV
Laser Depaneling - The Future?
Allen Duck, Getech Automation
Yield Improvement at NPI Using X-Ray
Keith Bryant, Keith Bryant Consultancy
Rework of Hybrid Land Grid-Array Sockets on Large High-Density Printed Circuit Boards
Prabjit Singh, Ph.D., IBM Corporation; Nandu Ranadive, Jabil Inc.
Using JTAG/Boundary-Scan in Manufacturing
Peter van den Eijnden, JTAG Technologies B.V.
Innovation in Jetting Technology for Advanced Manufacturing
Twan Aldenzee, Mycronic