Advanced Electronics Assembly Conference

The Advanced Electronics Assembly Conference will enhance your knowledge of the latest manufacturing techniques, with skilled industry speakers from around the globe! Attending this conference will increase your value to your company, as we live in an ever-changing and improving environment.

Global experts from companies including Celestica, IBM and Jabil will guide you through the latest technology advancements related to Boundary Scan, Cleaning, Conformal Coating, Jetting, Laser Depaneling, Low Temperature Soldering, Rework, Selective Soldering, and X-Ray Inspection.

Two Dates, Two Venues, Same Great Program

Budapest, Hungary

November 19, 2019
Budapest, Hungary
Novotel Budapest Centrum

Budapest, Hungary

November 21, 2019
Oradea, Romania
DoubleTree by Hilton Oradea

By holding the same program in two locations, we are allowing for more visitors to attend this innovative conference.




Keynote Speaker


Pete Lomas, FREng

Co-Founder/Hardware Designer, Raspberry Pi


From Cardboard to Space - The Raspberry Pi Story


The keynote presentation will cover Pete's somewhat unusual early career in engineering through to how the Raspberry Pi was conceived and designed. He will also discuss the challenges involved in deploying two special Raspberry Pi computers to the International Space Station providing educational outreach that is literally "out of this world."

Pete Lomas, Raspberry Pi



Technical Program Agenda

Same schedule for both days

08:00 - 09:15
Registration Open
09:15 - 09:30
Opening Remarks

KEYNOTE: From Cardboard to Space - The Raspberry Pi Story
Pete Lomas, FREng, Raspberry Pi

IPC Conformal Coating Material & Application State of the Industry Assessment Project
Jason Keeping, P.Eng., Celestica, Inc.

Cleanliness Before Conformal Coating
Helmut Schweigart, Ph.D., Zestron

Implementation of a Low Melting Point Soldering Alloy in Electronics Assembly
David DeSomviele, Interflux Electronics

Automotive Grade Solder Paste - How to Engineer the Flux Chemistry to Achieve High SIR and Maximize the Print & Reflow Process Windows
Karthik Vijay, Indium Corporation

Selective Solder Fine Pitch Components on High Thermal Mass Assembly
Gerjan Diepstraten, Vitronics Soltec BV

Laser Depaneling - The Future?
Allen Duck, Getech Automation

Yield Improvement at NPI Using X-Ray
Keith Bryant, Keith Bryant Consultancy

Rework of Hybrid Land Grid-Array Sockets on Large High-Density Printed Circuit Boards
Prabjit Singh, Ph.D., IBM Corporation; Nandu Ranadive, Jabil Inc.

Using JTAG/Boundary-Scan in Manufacturing
Peter van den Eijnden, JTAG Technologies B.V.

Innovation in Jetting Technology for Advanced Manufacturing
Twan Aldenzee, Mycronic