Call for Abstracts
You are invited to share your research at the conference on any of the topics below:
Additive PCB Technologies
Advanced HDI Technology - Subtractive Etch Processing
Flexible Hybrid Electronics (FHE)
Modified Semi Additive Processing (mSAP)
Molded Interconnect Devices
Semi Additive Processing (SAP)
Submission Guidelines for Abstracts
Abstracts are solicited to describe original, unpublished, and non-commercial work.
The abstract should be at least 300 words and must clearly state purpose, results and conclusions. Technical conference agenda presentations will be limited to 30 minutes, including five minutes for questions.
A registration fee is associated with the conference and all speakers and session chairs are required to register. Speakers and chairs are eligible for a reduced price and SMTA members save even more!