Additive Electronics Conference

Call for Abstracts

You are invited to share your research at the conference on any of the topics below:

  • Additive PCB Technologies
  • Advanced HDI Technology - Subtractive Etch Processing
  • Assembly
  • Chemistry
  • Design Software
  • Flexible Hybrid Electronics (FHE)
  • Inspection Equipment
  • Laser Technology
  • Modified Semi Additive Processing (mSAP)
  • Molded Interconnect Devices
  • Printed Technologies
  • Raw Materials
  • Semi Additive Processing (SAP)


  • Abstract Submission Deadline: June 30, 2019

    Submission Guidelines for Abstracts

    Abstracts are solicited to describe original, unpublished, and non-commercial work. The abstract should be at least 300 words and must clearly state purpose, results and conclusions. Technical conference agenda presentations will be limited to 30 minutes, including five minutes for questions.

    Conference Registration

    A registration fee is associated with the conference and all speakers and session chairs are required to register. Speakers and chairs are eligible for a reduced price and SMTA members save even more!





    Home | Top

    Organized by SMTA