Four sessions that will change your business forever

This four-session conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.

  • Session 1: The Need for Additive 
  • Session 2: Materials & Technology
  • Session 3: Practical Applications
  • Session 4: Interactive Panel Discussion

View all sessions


Key additive manufacturing advantages:

  • Opens up design capabilities
  • Weight reduction
  • Miniaturization
  • 3D design
  • Line width & spaces from .003" to 5 microns

Keynote Speaker

Rich Brooks
Senior Engineering Manager
Jabil Circuit, Inc.

Miniaturization – Driving the Advances in PCB Technology and Assembly

Miniaturization is one of the main trends today that is driving the electronics industry to push the limits of capabilities and driving the implementation of new technologies. Some of the products that are driving miniaturization include: Wearables, Health Sensing, 3D Printing, IIoT, AI and AR/VR. At Jabil, our goal is to understand the various technology trends and to implement new solutions for our customers that will also drive the market. For Miniaturization, Jabil does not only focus on the Manufacturing assembly process but also the advances in the PCB technology and IC packaging. This presentation will review these various technology processes and how they impact the industry, as well as the Contract Manufacturers and how it will effect the way they do business.

Rich Brooks has degrees in both Chemistry and Chemical Engineering and he has been in the Electronics industry for 30 years. His first role was with the Advanced Manufacturing Technology group at Motorola where he spent 14 years. After Motorola, he joined the Indium Corporation of America as the Global Technical Manager. In recent years, Rich held a Senior Engineering Manager position at GE Oil & Gas Design Engineering and now for the past 3 years, he has been with the Jabil Design Organization. At Jabil, he manages a team of SMEs (Subject Matter Experts) with various areas of technical knowledge. Rich Brooks' area of expertise is in PCB and soldering materials technology.

Rich Brooks

Presenting Organizations

Avaratek
Calumet
Crane
Jabil
Lockheed Martin
MacDermid Alpha Electronics Solutions
NASA Goddard Space Flight Center
Nextflex
SAT Plating

Meet Our Expert Speakers

Wilfried Bair

VP Engineering
NextFlex

Nathan Khosla

Senior Research Scientist
Lockheed Martin

Beth Paquette

Flight Systems Design
NASA-GSFC

Audra Thurston

Chemical / Process Engineer
Calumet Electronics

Rahul Raut

Director, Strategy/Tech. Acq.
MacDermid Alpha Electronics Solutions

Bawa Singh

Exec. VP, Tech. & Corp. Dev.
MacDermid Alpha Electronics Solutions

Steve Vetter

Electronics Engineer
Naval Service Warfare Center, Crane

Mike Vinson

President
Averatek

Will Wallace

General Manager
SAT Plating

Who should attend:

Those who are or expect to be facing the challenges of the need for very high density interconnect and are interested in learning about options available in the market to enable line width and space below 75-micron feature size.
  • Designers
  • Material Suppliers
  • Assemblers
  • Process Engineers

  • Conference Co-Chairs

    Lenora Clark

    Lenora Clark

    MacDermid Alpha
    Tara Dunn

    Tara Dunn

    Omni PCB

    Become a Sponsor

    Our sponsors get great exposure and visibility at this conference, and there are several sponsorship opportunities to choose from. Don’t miss the chance to get your company recognized at this event!

    Sponsorship Info


    Venue

    Incredibly close to both Santa Clara University and San Jose State University, the DoubleTree by Hilton San Jose is a great place to stay for visiting families and friends.