Addressing Concerns Related to Coronavirus (COVID-19) and Status of the Conference

The health and safety of our participants and members is top priority. We remain in regular contact with our venue managers, speakers, and professionals within the greater meeting planning industry. We are carefully monitoring current developments and are assessing the situation on a case-by-case basis. Currently, the Additive Electronics TechXchange will proceed as planned unless noted otherwise. We will inform you about any changes immediately.



Additive Electronics TechXchange Returns to San Jose in 2020!

Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices. 

The format of this techXchange is to showcase the needs and requirements of the end users and provide an opportunity for the supply chain to respond.

Submit an abstract for the 2020 Conference


Key additive manufacturing advantages:

  • Opens up design capabilities
  • Weight reduction
  • Miniaturization
  • 3D design
  • Line width & spaces from .003" to 5 microns

2019 Participating Organizations

Avaratek
Calumet
Crane
Jabil
Lockheed Martin
MacDermid Alpha Electronics Solutions
NASA Goddard Space Flight Center
Nextflex
SAT Plating

Who should attend:

Those who are or expect to be facing the challenges of the need for very high density interconnect and are interested in learning about options available in the market to enable line width and space below 75-micron feature size.
  • Designers
  • Material Suppliers
  • Assemblers
  • Process Engineers

  • Conference Co-Chairs

    Lenora Clark

    Lenora Clark

    MacDermid Alpha
    Tara Dunn

    Tara Dunn

    Omni PCB

    Become a Sponsor

    Our sponsors get great exposure and visibility at this conference, and there are several sponsorship opportunities to choose from. Don’t miss the chance to get your company recognized at this event!

    Sponsorship Info


    Venue

    Incredibly close to both Santa Clara University and San Jose State University, the DoubleTree by Hilton San Jose is a great place to stay for visiting families and friends.