Reference books on electronics assembly, packaging, and related technology
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FEATURED BOOKS & PROCEEDINGS
Should you clean your product during manufacturing? If so, when and how? Cleaning is essential for proper performance, optimal quality, and increased sales. Inadequate cleaning of product elements can lead to catastrophic failure of the entire system and serious hazards to individuals and the general public. With 90% new or revised chapters plus supplementary online material, the handbook has grown into two comprehensive volumes, Cleaning Agents and Systems and Applications, Processes, and Controls.
The proceedings from the technical program at the International Conference on Soldering & Reliability, held May 19-21, 2015, at the Hilton Markham Suites in Markham, ON, Canada are now available for download. The technical conference featured 28 presentations on topics including lead-free solders, materials as different as graphene, nanofibers and coatings, stencils for disparate-sized components, and prevention of defects like tin whiskers and head-in-pillow. Speakers represented companies including BAE Systems, Celestica, Creation Technologies, Intel Corporation, Jabil Circuit, Rockwell Collins, Verdant Electronics, and schools including University of Singapore, University of Waterloo, University of Toronto, and SUNY Binghamton.
Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
The 2015 iNEMI Roadmap is now available for sale in the SMTA BookStore. As the only industry roadmap that looks at the entire supply chain, the iNEMI Roadmap delivers in-depth information about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It also provides direction regarding the technologies required to meet the ever-evolving needs of this rapidly diversifying and growing industry.
The 20th Annual Pan Pacific Microelectronics Symposium which took place February 2-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. Session topics ranged from Power Electronics and Nano-Technology to Wearable Electronics and 2.5/3D Interposers.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 11th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place November 11-13, 2014 at the DoubleTree San Jose Airport Hotel.
In 2014 INEMI, MEPTEC, and SMTA joined forces to host the Medical Electronics Symposium September 18-19, 2014 in Portland, Oregon. The presentations focus on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. The symposium covered three tracks: Components and Designs for Higher Density Functionalities, Solutions for Best-in-Class Assembly and Volume Manufacturing, and Next Generation Microelectronics for Changing Healthcare Markets. Over 30 presentations are included in the proceedings.
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Topics covered in the book include various theories or mechanisms of adhesion, surface (physical or chemical) characterization of materials as it pertains to adhesion, surface cleaning as it pertains to adhesion, ways to improve adhesion, unraveling of interfacial interactions using an array of pertinent techniques, characterization of interfaces / interphases, polymer-polymer adhesion, metal-polymer adhesion (metallized polymers), polymer adhesion to various substrates, adhesion of thin films, underfills, molding compounds, and different dielectric materials, delamination and reliability issues in packaged devices, interface mechanics and crack propagation, and adhesion measurement of thin films and coatings.
This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, conflict minerals, and more... The flash drive includes over 130 papers from all sessions at SMTA International held September 28 - October 2, 2014 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.
A set of 15 colour wall charts available covering inspection and process defects in High Temperature assembly. The photographic poster guide is ideal reference source in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for display for operator reference or as a training aid. The posters cover different solder alloys through hole and selective soldering to leads and chip terminations.
The HT Photo Album provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photographs on the CD are normally provided in .jpg format. This Photo CD-ROM contains over 100 images including through hole and surface mount solder joints, microsections, x-ray images, conformal coating and the different types of process failures that may be found during assembly and equipment operation.
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-15, 2014, at the Four Points by Sheraton Toronto Airport Hotel in Toronto, ON, Canada. There are 25 technical papers on topics ranging from Tin Whisker testing and micro-Alloying to Bottom Termination Component voiding and High Temperature, High Reliability lead-free solder issues. Research was compiled from a variety of companies including Alpha, BAE International, BlackBerry, Celestica Inc., DfR Solutions, IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several renowned universities, and more.
Although test has always been thought of as a necessary evil, in reality it is the single best way to ensure that a product meets the needs of your customer. Throughout the development process test is used to reduce the risk that the design, theory, and final product, reality, are as close to each other as possible. The SMTA Testability Guidelines TP-101E were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters. The Guidelines were intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product.
Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically.
Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.
This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.
The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are featured here. Topics included Interposers, Roadmaps and Industry Trends, Embedded Assemblies, Assembly Challenges, 3D and TSV Technologies, Prognostics and Health Management, Business Strategies, Power Electronics, Reliability and Failure Analysis, Manufacturing Paradigms, Statistics and Probability, Connection Taxonomy, Simulation and Modeling.
SMTA and CALCE @ University of Maryland hosted the Symposium on Counterfeit Electronic Parts - West on November 19-21, 2013 in San Diego, CA. Presentations covered Supply Chain Management, Risks to the Supply Chain, Authentication Technologies, Obsolescence Management & Regulatory Landscape, Detection Technologies, and Standards. The symposium was a success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals.
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
This thesis work is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.
The SMTA/iNEMI Medical Electronics Symposium took place November 12-13, 2013 at the Embassy Suites in Milpitas, CA. The proceedings contain 24 presentations focused on medical electronic devices, carriers and components, advanced assembly techniques, reliability and the complex global regulatory requirements (including ROHS) required for medical applications.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 10th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain 39 technical papers from leading experts in the advanced packaging industry. The conference took place November 6-7, 2013 at the DoubleTree by Hilton in San Jose, CA.
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This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, flip chip, BGA, embedded component technology, printed electronics, counterfeit part mitigation, and more... The flash drive includes over 130 papers from all sessions at SMTA International held October 13-17, 2013 in Fort Worth, Texas, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.
SMTA and CALCE @ University of Maryland hosted the Symposium on Counterfeit Electronic Parts - East on June 25-27, 2013 in College Park, MD. Presentations covered Supply Chain Management, Risks to the Supply Chain, Authentication Technologies, Obsolescence Management & Regulatory Landscape, Detection Technologies, and Standards. The symposium was a success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals.
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 14-17, 2013, at the Sheraton Toronto Airport Hotel, Toronto, ON, Canada. There are 30 presentations on topics ranging from Vapor Phase technology and Stencil Design to Bottom Termination Components and Package on Package assembly issues. Research was compiled from a variety of companies including 3M Canada, Alcatel-Lucent, Alpha, BAE Systems, BlackBerry, Celestica Inc., Creation Technologies Inc., Honeywell International Inc., IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several reknowned universities, and more.
The 18th Annual Pan Pacific Microelectronics Symposium that took place January 22-24, 2013, at the Makena Beach and Golf Resort in Maui, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 30 papers from the technical program are featured here. Topics include: Failure Analysis Tools and Techniques, Strategic Directions, 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, and more.
Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 9th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 30 technical papers from leading experts in the advanced packaging industry. The conference took place November 5-8, 2012 at the DoubleTree by Hilton in San Jose, CA.
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This is your essential source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, flip chip, BGA, Embedded Component Technology, and more... The flash drive includes over 120 papers from all sessions at SMTA International held October 14-18, 2012 in Orlando, Florida, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium and the Evolving Technologies Summit.
Phase II of the Pb-Free Electronics Manhattan project focused on the development of a timephased roadmap, including a detailed technical approach, to deal with the multiple technical risks and knowledge gaps identified during Phase I. The three-year roadmap and supporting details contained in this Phase II report define the Phase III research and development (R&D) recommended by the team of subject matter experts to deal with those issues. The rough order of magnitude (ROM) cost to complete the R&D is estimated to be $105M in 2010 dollars, and includes a 10% factor for the cost of the government contract administration effort. To convey the scope and purpose of the needed R&D, Phase III has been named the Pb-Free Electronics Risk Reduction Program.
The objective of the Pb-Free Electronics Manhattan Project – Phase I has been accomplished. Best practices have been captured and documented in two artifacts. The first artifact articulates best practices identified to mitigate the risks associated with Pb-free electronics usage in high-reliability, high-performance aerospace and defense systems.
Accelerated reliability engineering is becoming a popular industry alternative to on-going product quality testing. Highly Accelerated Life Tests (HALT) and Highly Accelerated Stress Screens (HASS) are intensive methods which use stresses higher than the field environment to expose and then improve design and process weaknesses. HALT and HASS offer faster, cheaper and more accurate results than traditional reliability testing techniques. This book provides comprehensive coverage of the methods and philosophy behind this successful approach. Production managers will appreciate the time-saving and cost-effective testing techniques described. Design engineers involved in quality assurance and students of reliability engineering will benefit from this unique resource detailing the technical aspects of accelerated reliability engineering.
Design-for-Environment (DfE) is a methodology that has revolutionized the way engineers approach electronics products, increasing their efficiency and decreasing their environmental and social impacts. The many business advantages of DfE include a 1%-5% reduction in Cost of Goods Sold (COGS), increased reliability (80% of DFE principles increase reliability), and increased competitive edge and customer loyalty. As the regulatory burden on electronics products grows, the demand for DfE-trained engineers has increased. With DfE OnlineTM, this methodology is now available to you in a time-efficient, self-paced package, saving you hundreds of hours of research.
DfE OnlineTM will teach you DfE principles to develop products that are in compliance, more efficient and less costly to produce. DfE OnlineTM provides you hundreds of tools, tips, case studies, videos, and interactive exercises, as well as a professional Forum.
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 15-18, 2012, at the Crowne Plaza Hotel, Toronto, ON, Canada. There are 30 presentations on topics ranging from BGA Voids to Conformal Coating to Design for Manufacturability and Package on Package assembly issues. Research was compiled from a variety of companies including Celestica, Cookson Electronics, Creation Technologies, IBM, Indium Corporation, Intel Corporation, Nihon Superior Co., Rockwell Collins, Sandia National Laboratories, several reknowned universities, and more.
This book offers comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
The popular no nonsense profiling guide is back with this highly-readable second edition. New content such as Wave has been added along with a new format that focuses on each of the five steps of Six Sigma's DMAIC (Define, Measure, Analyze, Improve and Control). Additional contributors, such as Indium have offered insight in how to mitigate common reflow defects through profiling.
This book covers a list of key topics including: legislation, SMT, wave, rework, BGA/CSP component alloys, tin whiskers, testability, mechanical reliability, aerospace/military and automotive reliability. It is intended as a reference guide to engineers in the industry who are or who will be migrating to lead-free soldering. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. Each subject area is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering.
This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
Portable consumer electronic devices have experienced exponential growth in recent years. Although the reliability implications and performance criteria of these products are significantly different from electronic hardware of the past, no single volume has covered the materials, design, and reliability aspects of these products until the publication of this new book.
The industry's first PoP Package assembly interactive CD-ROM. Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.
Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.
A set of 20 colour wall charts available covering inspection and quality control in Package on Package (PoP) assembly. The charts were produced to accompany the "Package on Package (PoP) STACK Package Assembly, Inspection & Rework Workshops" organised in Europe. The photographic poster guide is ideal reference source in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for display for operator reference or as a training aid.
Photo CD-ROMs provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photographs on the CD may be provided in .jpg or .Tiff file format. The PoP Photo CD-ROM contains over 380 images.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
Solder joints are ubiquitous in electronic consumer products. With the European Union’s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book offers a thorough examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
This CD-ROM provides a simple guide to the use of coatings, their application processes, product benefits, inspection and quality control. A practical interactive defect guide also allows users to see defect coating application and user defects. A unique feature of the interactive disk is engineers answering the most common questions on coating processes, process defects and quality control in manufacture. This section features six experts on coating from around the world and also contributors to national and international standards on coating with IEC and IPC.
This CD-ROM is one of a series of photo albums and provides the process or quality engineer with a supply of photographs which may be used for company inspection documentation or training presentations. The photographs can also be used in marketing and advertising material or in technical articles provided the source is credited. They can be simply pasted into any Word or PowerPoint document for in-house company use. Photographs are provided in either .Tiff or .jpg file format. The images are not all one resolution but a mixture of high and low resolution.
The 15 page colour poster guide is available at ASKbobwillis.com and was originally produced to accompany our workshops run jointly with ITRI in St Albans, England. The photographic guide is ideal as a reference source for operators, inspection and training departments in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed as A4 for bench top reference or as A3 colour posters for reference in manufacture. Alternatively they can be viewed on a PC with each page featuring three images illustrating points to examine or steps in the inspection process. Currently the guide features 10 individual pages for on site printing and display.
The 28 page colour guide is available at ASKbobwillis.com and was originally produced to accompany the "Practical Failure Analysis Workshops" run jointly with ITRI in St Albans. The photographic guide is ideal as a reference source to reduce the impact of counterfeit components on your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for reference at goods receipt inspection and can be updated with new samples provided for inclusion or new test methods and procedures.
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design rather than the business strategy of a product line.
In this new book, Susan E. Mucha explores in great detail the entire account acquisition process of companies in the electronics manufacturing service (EMS) industry. EMS companies face the challenges of a 12- to 18-month sales cycle, low margins and geographically scattered customer bases. Growing the business requires a differentiation strategy and a focused process for maintaining mindshare within a diverse target market. Susan Mucha maps the process of building a differentiated brand while creating a repeatable, consistent sales process, and addresses strategies for account retention and growth.
Six Sigma/Green Belt Certification Study Guide
SMT Procceses Certification Study Guide
As in all industries profit is the motive for the electronics assembly industry. Therefore, understanding assembly cost should be a prime concern. The stakes are indeed great as approximately 10 to 15% of the $1.5 trillion electronics industry is assembly cost. Surprisingly, there does not appear to be a systematic approach to cost estimating in the industry.
Featuring ProfitPro(TM), an Excel®-based software application that calculates the cost and profit related to PWB assembly, the SMTA Cost Estimating Guidelines for electronic assembly will review some efforts to remedy this situation. ProfitPro(TM) is user-friendly in that it has "default" values of cost metrics if the user does not know them, and it can calculate "what-if scenarios."