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FEATURED BOOKS & PROCEEDINGS
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iNEMI 2013 Roadmap on USB
Author: iNEMI
Description: The complete 2013 Roadmap is available on a USB drive for $3000 (plus $100 when shipped outside of North America). This tenth edition of the iNEMI Roadmap features a 73-page executive summary, six chapters that cover product sectors, 20 chapters that cover technology and infrastructure areas, plus related appendices. All together, the document totals more than 1900 pages.
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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2013
Author:
Description: The 18th Annual Pan Pacific Microelectronics Symposium that took place January 22-24, 2013, at the Makena Beach and Golf Resort in Maui, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 30 papers from the technical program are featured here. Topics include: Failure Analysis Tools and Techniques, Strategic Directions, 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, and more.
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Extreme Environment Electronics
Author: John Cressler and H. Alan Mantooth
Description: Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.
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SMTA International Wafer-Level Packaging Conference (IWLPC) 2012 Proceedings on USB Flash Drive
Author: SMTA
Description: Sponsored jointly by the SMTA and Chip Scale Review magazine, the 9th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 30 technical papers from leading experts in the advanced packaging industry. The conference took place November 5-8, 2012 at the DoubleTree by Hilton in San Jose, CA.
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SMTA International Conference Proceedings on USB, 2012
Author: SMTA
Description: Be Part of the Solution!
This is your essential source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, flip chip, BGA, Embedded Component Technology, and more... The flash drive includes over 120 papers from all sessions at SMTA International held October 14-18, 2012 in Orlando, Florida, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium and the Evolving Technologies Summit.
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The Lead Free Electronics Manhattan Project - Phase II
Author: Office of Naval Research Benchmarking and Best Practices Center of Excellence
Description: Phase II of the Pb-Free Electronics Manhattan project focused on the development of a timephased
roadmap, including a detailed technical approach, to deal with the multiple technical
risks and knowledge gaps identified during Phase I. The three-year roadmap and supporting
details contained in this Phase II report define the Phase III research and development (R&D)
recommended by the team of subject matter experts to deal with those issues. The rough order
of magnitude (ROM) cost to complete the R&D is estimated to be $105M in 2010 dollars, and
includes a 10% factor for the cost of the government contract administration effort. To convey
the scope and purpose of the needed R&D, Phase III has been named the Pb-Free Electronics
Risk Reduction Program.
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The Lead Free Electronics Manhattan Project - Phase I
Author: Office of Naval Research Benchmarking and Best Practices Center of Excellence
Description: The objective of the Pb-Free Electronics Manhattan Project – Phase I has been accomplished. Best practices have been captured and documented in two artifacts. The first artifact articulates best practices identified to mitigate the risks associated with Pb-free electronics usage in high-reliability, high-performance aerospace and defense systems.
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Microelectronics to Nanoelectronics: Materials, Devices & Manufacturability
Author: Anupama B. Kaul
Description: Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm.
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HALT and HASS, Accelerated Reliability Engineering
Author: Gregg K. Hobbs, Ph.D., P.E.
Description: Accelerated reliability engineering is becoming a popular industry alternative to on-going product quality testing. Highly Accelerated Life Tests (HALT) and Highly Accelerated Stress Screens (HASS) are intensive methods which use stresses higher than the field environment to expose and then improve design and process weaknesses. HALT and HASS offer faster, cheaper and more accurate results than traditional reliability testing techniques. This book provides comprehensive coverage of the methods and philosophy behind this successful approach. Production managers will appreciate the time-saving and cost-effective testing techniques described. Design engineers involved in quality assurance and students of reliability engineering will benefit from this unique resource detailing the technical aspects of accelerated reliability engineering.
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DfE OnlineTM (Single User License)
Author: Technology Forecasters Inc.
Description: Design-for-Environment (DfE) is a methodology that has revolutionized the way engineers approach electronics products, increasing their efficiency and decreasing their environmental and social impacts. The many business advantages of DfE include a 1%-5% reduction in Cost of Goods Sold (COGS), increased reliability (80% of DFE principles increase reliability), and increased competitive edge and customer loyalty. As the regulatory burden on electronics products grows, the demand for DfE-trained engineers has increased. With DfE OnlineTM, this methodology is now available to you in a time-efficient, self-paced package, saving you hundreds of hours of research.
DfE OnlineTM will teach you DfE principles to develop products that are in compliance, more efficient and less costly to produce. DfE OnlineTM provides you hundreds of tools, tips, case studies, videos, and interactive exercises, as well as a professional Forum.
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SMTA International Conference on Soldering & Reliability Proceedings on CD, 2012
Author: SMTA
Description: This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 15-18, 2012, at the Crowne Plaza Hotel, Toronto, ON, Canada. There are 30 presentations on topics ranging from BGA Voids to Conformal Coating to Design for Manufacturability and Package on Package assembly issues. Research was compiled from a variety of companies including Celestica, Cookson Electronics, Creation Technologies, IBM, Indium Corporation, Intel Corporation, Nihon Superior Co., Rockwell Collins, Sandia National Laboratories, several reknowned universities, and more.
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IPC-AJ-820-A Assembly & Joining Handbook (hard copy)
Author: IPC
Description: This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting, and rework and repair.
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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2012
Author: SMTA
Description: The Annual Pan Pacific Microelectronics Symposium held February 14-16, 2012, on the Kauai, Hawaii, promoted international technical interchange and provided a premier forum for networking among industry professionals and business leaders around the world. More than 30 papers from the technical program are featured here. Topics include: Industry Roadmaps, Pb Free Advancements, 3D Integrated Circuits, Evaluation and Failure Analysis, Strategic Manufacturing, Failure Modeling and Design, Process Advancement, and Green Technologies.
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Symposium on Counterfeit Electronic Parts - West 2011 Proceedings
Author: SMTA
Description: SMTA and CALCE @ University of Maryland hosted the Symposium on Counterfeit Electronic Parts - West on December 4-6, 2011 in Garden Grove (Anaheim), CA. Presentations covered Electronic parts supply chain, Sources of counterfeit parts, Proven methodologies for reducing chances of being victims of counterfeit parts, Supply chain management tools to mitigate counterfeit part risks, Inspections tools and techniques for detecting counterfeit parts, Authentication techniques for securing electronic part supply chain, Trade and business issues adopted by industry, and Law enforcement and international cooperation. The symposium was an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals.
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The Bug | A Training Tool for IPC-A-610 and JSTD-001
Author: BEST
Description: THE BUG has been developed by master instructors and CITs to help teach the concepts of inspection and dimensional criteria for a variety of through hole and SMT components. It makes your teaching job simpler as you can demonstrate/explain the most mundane parts of the IPC-A-610 acceptability criteria making it come alive for your students. Concepts such as side and end overhang, end joint width, side joint width and end overlap can now be more easily demonstrated to students in 3-D (no glasses required!)
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SMTA International Wafer-Level Packaging Conference (IWLPC) 2011 Proceedings on USB Flash Drive
Author: SMTA
Description: Sponsored jointly by the SMTA and Chip Scale Review magazine, the 8th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 30 technical papers from leading experts in the advanced packaging industry. The conference took place October 3-6, 2011 at the Marriott Hotel in Santa Clara, CA.
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SMTA International Conference Proceedings on CD, 2011
Author: SMTA
Description: Be Part of the Solution!
This is your essential source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, flip chip, BGA, Embedded Component Technology, and more... The CD includes over 130 papers from all sessions at SMTA International held October 16-20, 2011 in Fort Worth, Texas, including the AIMS/Harsh Environments Symposium, the reknowned Lead-Free Symposium and the Evolving Technologies Summit.
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Structural Dynamics of Electronic and Photonic Systems
Author: Ephraim Suhir, T. X. Yu, David S. Steinberg (Editors)
Description: This book offers comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Author: John H. Lau
Description: Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
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SMTA International Conference on Soldering & Reliability Proceedings on CD, 2011
Author: SMTA
Description: This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 3-6, 2011, at the Crowne Plaza Hotel, Toronto, ON, Canada. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. Process optimizations for manufacturing and repair, as well as mixed alloy soldering have become important areas of study. New solder alloys, as well as a return to vapor phase soldering, lead-free HASL, and cleaning provide topics for renewed understanding. Finally, the proposed changes to the restrictions on hazardous substances, and the upcoming REACH initiative will be covered.
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Melting Down
Author: Harvey Stone
Description: Melting Down is an environmental thriller novel representing the full spectrum of viewpoints in regard to energy systems, economic interests and environmental activism. It also highlights a system of thinking that simultaneously addresses social, economic and environmental problems. The book was authored by Harvey Stone, who has been a dedicated speaker for many SMTA events.
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Profiling Guide for Six Sigma
Author: Brian O'Leary
Description: The popular no nonsense profiling guide is back with this highly-readable second edition. New content such as Wave has been added along with a new format that focuses on each of the five steps of Six Sigma's DMAIC (Define, Measure, Analyze, Improve and Control). Additional contributors, such as Indium have offered insight in how to mitigate common reflow defects through profiling.
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Lead-Free Solder Process Development
Author: Greg Henshall, Jasbir Bath, Carol A. Handwerker (Editors)
Description: This book covers a list of key topics including: legislation, SMT, wave, rework, BGA/CSP component alloys, tin whiskers, testability, mechanical reliability, aerospace/military and automotive reliability. It is intended as a reference guide to engineers in the industry who are or who will be migrating to lead-free soldering. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. Each subject area is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering.
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Essentials of Electronic Packaging: A Multidisciplinary Approach
Author: Puligandla Viswanadham
Description: This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2011
Author: SMTA
Description: The Annual Pan Pacific Microelectronics Symposium & Exhibit held January 18-20, 2011, on the Big Island of Hawaii, promoted international technical interchange and provided a premier forum for networking among industry professionals and business leaders around the world. Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.
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SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2010
Author: SMTA
Description: Sponsored jointly by the SMTA and Chip Scale Review magazine, the 7th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The CD contains 40 technical papers from leading experts in the industry. The conference took place October 11-14, 2010 at the Marriott Hotel in Santa Clara, CA.
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Electronic Systems Obsolescence Management (ESOM) SF-2.0
Author: Damian Fozard and Lee Melatti
Description: Electronic Systems Obsolescence Management (ESOM) SF-2.0 provides a new approach to managing long-term supply of COTS electronics for aerospace, military, and industrial systems manufacturers. The Defense Standardization Program Office publication DMSMS SD-22 sets the objectives for proactively managing obsolescence. ESOM SF-2.0 is a direct response to the challenges raised by these objectives and provides a defined framework for integrating obsolescence management into the heart of each system manufacturing program.
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SMTA International Conference Proceedings on CD, 2010
Author: SMTA
Description: Discover the Difference of a Totally Focused Event!
This is your reference source for electronics assembly, lead-free, SMT, RFID, process control, flip chip, chip scale, BGA, RoHS compliance, automotive, and more... you'll find the electronic interconnection solutions you need, because this proceedings is dedicated to surface mount, advanced packaging, and related technologies and business operations. Includes over 130 papers including papers from the AIMS/Harsh Environments Symposium, the reknowned Lead-Free Symposium and the Evolving Technologies Summit.
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IPC-A-610E: Acceptability of Electronic Assemblies (Hard Copy)
Author: IPC
Description: A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead-free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.
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IPC-J-STD-001E: Requirements for Soldered Electrical & Electronic Assemblies (on CD)
Author: IPC
Description: J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610E. Released April 2010.
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Symposium on Counterfeit Electronic Parts - West 2010 Proceedings
Author: SMTA
Description: SMTA and CALCE @ University of Maryland hosted the Symposium on Counterfeit Electronic Parts - West on June 8-11, 2010 at Honeywell Deer Valley in Phoenix, AZ. Presentations covered intellectual property enforcement, prevention and detection strategies, defense strategies, G19 activities, and counterfeit trends. The symposium was an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals.
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RF and Microwave Microelectronics Packaging
Author: Ken Kuang, Franklin Kim, and Sean S. Cahill (Eds.)
Description: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Portable Consumer Electronics - Packaging, Materials and Reliability
Author: Viswanadham Puligandla and Sridhar Canumalla
Description: Portable consumer electronic devices have experienced exponential growth in recent years. Although the reliability implications and performance criteria of these products are significantly different from electronic hardware of the past, no single volume has covered the materials, design, and reliability aspects of these products until the publication of this new book.
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Wire Bonding in Microelectronics, 3rd Edition
Author: George Harman
Description: The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.
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Bob Willis Package on Package (PoP) STACK Package Assembly, Inspection & Rework interactive CD-ROM
Author: Bob Willis
Description: Available Now!
The industry's first PoP Package assembly interactive CD-ROM. Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.
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Advanced MEMS Packaging
Author: John Lau, Cheng Kuo Lee, C.S. Premachandran, and Yu Aibin
Description: Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.
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Bob Willis Package on Package (PoP) Inspection & Process Defects wall charts
Author: Bob Willis
Description: A set of 20 colour wall charts available covering inspection and quality control in Package on Package (PoP) assembly. The charts were produced to accompany the "Package on Package (PoP) STACK Package Assembly, Inspection & Rework Workshops" organised in Europe. The photographic poster guide is ideal reference source in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for display for operator reference or as a training aid.
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Bob Willis Package on Package (PoP) STACK Package Assembly Photo CD-ROM
Author: Bob Willis
Description: Photo CD-ROMs provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photographs on the CD may be provided in .jpg or .Tiff file format. The PoP Photo CD-ROM contains over 380 images.
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Materials for Advanced Packaging
Author: Daniel Lu and C.P. Wong
Description: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
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Solder Joint Technology Materials, Properties, and Reliability
Author: King-Ning Tu
Description: Solder joints are ubiquitous in electronic consumer products. With the European Union’s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book offers a thorough examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
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Conformal Coating - Application, Inspection, Rework, and Quality Control
Author: Bob Willis
Description: 
This CD-ROM provides a simple guide to the use of coatings, their application processes, product benefits, inspection and quality control. A practical interactive defect guide also allows users to see defect coating application and user defects. A unique feature of the interactive disk is engineers answering the most common questions on coating processes, process defects and quality control in manufacture. This section features six experts on coating from around the world and also contributors to national and international standards on coating with IEC and IPC.
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Bob Willis Conformal Coating Photo Album CD-ROM
Author: Bob Willis
Description: This CD-ROM is one of a series of photo albums and provides the process or quality engineer with a supply of photographs which may be used for company inspection documentation or training presentations. The photographs can also be used in marketing and advertising material or in technical articles provided the source is credited. They can be simply pasted into any Word or PowerPoint document for in-house company use. Photographs are provided in either .Tiff or .jpg file format. The images are not all one resolution but a mixture of high and low resolution.
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Wafer Level 3-D ICs Process Technology
Author: Chuan Seng Tan, Ronald J. Gutmann, and Rafael L. Reif
Description: Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration.
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Bob Willis Conformal Coating Photographic Poster Guide
Author: Bob Willis
Description: The 15 page colour poster guide is available at ASKbobwillis.com and was originally produced to accompany our workshops run jointly with ITRI in St Albans, England. The photographic guide is ideal as a reference source for operators, inspection and training departments in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed as A4 for bench top reference or as A3 colour posters for reference in manufacture. Alternatively they can be viewed on a PC with each page featuring three images illustrating points to examine or steps in the inspection process. Currently the guide features 10 individual pages for on site printing and display.
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Bob Willis Counterfeit Component Photographic Guide Poster Set
Author: Bob Willis
Description: The 28 page colour guide is available at ASKbobwillis.com and was originally produced to accompany the "Practical Failure Analysis Workshops" run jointly with ITRI in St Albans. The photographic guide is ideal as a reference source to reduce the impact of counterfeit components on your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for reference at goods receipt inspection and can be updated with new samples provided for inclusion or new test methods and procedures.
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Solder Joint Reliability Prediction for Multiple Environments
Author: Andrew E. Perkins and Suresh K. Sitaraman
Description: Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
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Design for Six Sigma 2nd Ed.
Author: Kai Yang and Basem S. El-Haik
Description: The Latest Tools and Guidance Needed to Implement Design for Six Sigma in New Product and Service Development!
The Second Edition of this indispensable design tool retains the core of the previous edition, while adding new information on innovation, lean product development, incomplete DOE, mixture experiments, and alternative DFSS roadmaps—plus new thread-through case studies.
From quality concepts and DFSS fundamentals…to DFSS deployment and project algorithm…to design validation, the updated edition of Design for Six Sigma gives you a solid understanding of the entire process for applying DFSS in the creation of successful new products and services.
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Bob Willis Flip Chip Assembly & Defect Photo CD-ROM
Author: Bob Willis
Description: The flip chip CD ROM provides the process or quality engineer with a source of photographs of assembly process, flip chip components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Over 230 photographs are provided as a .jpg or .Tiff file format. Includes some x-ray and underfill process examples and defects.
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Bob Willis LGA/QFN Design, Assembly, Rework & Defect Guide
Author: Bob Willis
Description: If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional, surface mount & LGA/QFN assembly process stages this CD-ROM is for you.
The CD features three presentations:
LGA/QFN Design and Assembly Process
Conventional through hole assembly
Surface mount and mixed technology assembly stages
Changes for lead-free production
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Green Electronics Design and Manufacturing
Author: Sammy G. Shina
Description: This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations.
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IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
Author: IPC
Description: Includes greatly expanded criteria for molding, potting, splicing, crimp contacts without insulation support, inline insulation displacement connectors, connectorization, rigid and conformable cable, flexible sleeving, broomstitching, testing, and more!
Revision B remains the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) continued to work together to develop this significant update.
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Introduction to System-on-Package (SOP)
Author: Rao Tummala and Madhavan Swaminathan
Description: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
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MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applica
Author: A.R. Jha, Ph.D.
Description: The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applications.
This book presents the latest performance parameters and experimental data of state-of-the-art sensors and devices. It describes packaging details, materials and their properties, and fabrication requirements vital for design, development, and testing. Some of the cutting-edge materials covered include quantum dots, nanoparticles, photonic crystals, and carbon nanotubes (CNTs).
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Mechanical Design of Electronic Systems
Author: James Dally, Pradeep Lall, and Jeffrey Suhling
Description: This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design rather than the business strategy of a product line.
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Find It. Book It. Grow It.
Author: Susan Mucha
Description: In this new book, Susan E. Mucha explores in great detail the entire account acquisition process of companies in the electronics manufacturing service (EMS) industry. EMS companies face the challenges of a 12- to 18-month sales cycle, low margins and geographically scattered customer bases. Growing the business requires a differentiation strategy and a focused process for maintaining mindshare within a diverse target market. Susan Mucha maps the process of building a differentiated brand while creating a repeatable, consistent sales process, and addresses strategies for account retention and growth.
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Embedded Core Design with FPGAs
Author: Zainalabedin Navabi, Ph.D.
Description: A landmark guide in digital system design, Embedded Core Design with FPGAs equips today's computer engineers with everything they need to design embedded cores and apply those cores in a state-of-the-art embedded system. This practical resource brings together logic design, computer architecture, Verilog, FPGAs, Hardware/Software design, and SoCs, explaining how engineers can draw on their computer engineering background to achieve cutting-edge embedded designs.
Renowned design expert and educator Zainalabedin Navabi first covers the basics of logic design, RT Level Verilog, computer architectures, and the architecture of modern field programmable devices. He then explores the design of utility cores that are used for high-level core-based designs, with specific focus on existing Altera cores. Finally, he describes higher-end design methodologies, including design of hardware/software systems, CPU configurations, embedded systems, and the utilization of various Altera Nios II processors.
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Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing
Author: E. Bradley, C. Handwerker, J. Bath, R. Parker, and R. Gedney, (Editors)
Description: Reflecting the results of a two-year study undertaken by a cross-section of some of the largest North American electronic equipment manufacturers, this book provides full coverage of the issues surrounding the implementation of lead-free solder into electric board assembly. Additionally, fully documented book chapters with references to existing published work in the area make this an invaluable reference for the countless engineers and companies faced with making the switch to lead-free electronics.
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SMTA Six Sigma/Green Belt Certification Study Guide
Author: Ronald Lasky, Phil Zarrow, and W. James Hall
Description: Six Sigma/Green Belt Certification Study Guide
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SMTA Processes Certification Study Guide
Author: Ronald Lasky, Phil Zarrow, and W. James Hall
Description: SMT Procceses Certification Study Guide
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SMTA Cost Estimating Guidelines CP-101B with ProfitPro(TM) Software
Author: Ronald Lasky
Description: As in all industries profit is the motive for the electronics assembly industry. Therefore, understanding assembly cost should be a prime concern. The stakes are indeed great as approximately 10 to 15% of the $1.5 trillion electronics industry is assembly cost. Surprisingly, there does not appear to be a systematic approach to cost estimating in the industry.
Featuring ProfitPro(TM), an Excel®-based software application that calculates the cost and profit related to PWB assembly, the SMTA Cost Estimating Guidelines for electronic assembly will review some efforts to remedy this situation. ProfitPro(TM) is user-friendly in that it has "default" values of cost metrics if the user does not know them, and it can calculate "what-if scenarios."
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SMTA/TMAG Testability Guidelines TP-101D (Single-user Electronic PDF)
Author: SMTA/TMAG Task Forces
Description: Although test has always been thought of as a necessary evil, in reality it is the single best way to ensure that a product meets the needs of your customer. Throughout the development process test is used to reduce the risk that the design, theory, and final product, reality, are as close to each other as possible. The SMTA Testability Guidelines TP-101D were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters. The Guidelines were intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product.
Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically.
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IPC-A-610E: Acceptability of Electronic Assemblies (on CD-ROM)
Author: IPC
Description: A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead-free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.
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IPC-J-STD-001E: Requirements for Soldered Electrical & Electronic Assemblies (Hard Copy)
Author: IPC
Description: J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610E. Released April 2010.
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