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IPC-A-610E: Acceptability of Electronic Assemblies (Hard Copy) -
IPC
A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead-free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. More Info...
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IPC-J-STD-001E: Requirements for Soldered Electrical & Electronic Assemblies (on CD) -
IPC
J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610E. Released April 2010. More Info...
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Symposium on Counterfeit Electronic Parts - West 2010 Proceedings -
SMTA
More Info...
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RF and Microwave Microelectronics Packaging -
Ken Kuang, Franklin Kim, and Sean S. Cahill (Eds.)
More Info...
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Portable Consumer Electronics - Packaging, Materials and Reliability -
Viswanadham Puligandla and Sridhar Canumalla
More Info...
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Wire Bonding in Microelectronics, 3rd Edition -
George Harman
More Info...
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Bob Willis Package on Package (PoP) STACK Package Assembly, Inspection & Rework interactive CD-ROM -
Bob Willis
More Info...
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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2010 -
SMTA
The Annual Pan Pacific Microelectronics Symposium & Exhibit held January 26-28, 2010, Kauai, Hawaii, promoted international technical interchange and provided a premier forum for networking among industry professionals and business leaders around the world. Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly. More Info...
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Advanced MEMS Packaging -
John Lau, Cheng Kuo Lee, C.S. Premachandran, and Yu Aibin
More Info...
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Bob Willis Package on Package (PoP) Inspection & Process Defects wall charts -
Bob Willis
More Info...
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Bob Willis Package on Package (PoP) STACK Package Assembly Photo CD-ROM -
Bob Willis
More Info...
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SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2009 -
SMTA
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 6th annual IWLPC addressed cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The conference took place October 27-30, 2009 at the Marriott Hotel in Santa Clara, CA. More Info...
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SMTA/MEPTEC Medical Electronics Symposium Day 2 Proceedings on CD, 2009 -
SMTA/MEPTEC
The SMTA/MEPTEC Medical Electronics Symposium took place on September 16 and 17, 2009 at the ASU Campus in Tempe, AZ. This proceedings contains technical presentations from the second day of the symposium.
The medical electronics industry is a dynamic and evolving industry that consists of many technology and market segments. The evolvement of technology and market segments are due to the close working relationships between the private sector, universities, local, state, federal and international governments. This allows the medical electronics technology to be a vibrant and interactive technical community. This symposium will include the market’s current and future outlooks, regulatory requirements, legal perspectives, components, reliability, trends, initiative projects and advanced applications. More Info...
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SMTA International Conference Proceedings on CD, 2009 -
SMTA
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Materials for Advanced Packaging -
Daniel Lu and C.P. Wong
Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
Covers emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging
Discusses various types of materials including polymers, ceramics, metals, and solders Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:
New bonding and joining techniques
Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates
Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.
Materials and processing aspects on MEMS and wafer level chip scale packaging.
Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
Written for: Professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science
Keywords: advanced packaging, emerging technologies, materials development, microelectronic packaging, nanomaterials, nanopackaging, optoelectronic packaging, packaging materials, packaging techniques More Info...
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Solder Joint Technology Materials, Properties, and Reliability -
King-Ning Tu
Solder joints are ubiquitous in electronic consumer products. With the European Union’s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book offers a thorough examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Written for: Researchers in academia and industry, graduate students and advanced undergraduate students in the following areas: electronic manufacturing, electronic packaging technology, electronic materials science and engineering, and physical metallurgy More Info...
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Conformal Coating - Application, Inspection, Rework, and Quality Control -
Bob Willis
This CD-ROM provides a simple guide to the use of coatings, their application processes, product benefits, inspection and quality control. A practical interactive defect guide also allows users to see defect coating application and user defects. A unique feature of the interactive disk is engineers answering the most common questions on coating processes, process defects and quality control in manufacture. This section features six experts on coating from around the world and also contributors to national and international standards on coating with IEC and IPC. More Info...
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Bob Willis Conformal Coating Photo Album CD-ROM -
Bob Willis
This CD-ROM is one of a series of photo albums and provides the process or quality engineer with a supply of photographs which may be used for company inspection documentation or training presentations. The photographs can also be used in marketing and advertising material or in technical articles provided the source is credited. They can be simply pasted into any Word or PowerPoint document for in-house company use. Photographs are provided in either .Tiff or .jpg file format. The images are not all one resolution but a mixture of high and low resolution. More Info...
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Third International Symposium On Tin Whiskers 2009 Proceedings on CD -
SMTA
This symposium, held on June 23-24, 2009 at the Technical University Of Denmark, Lyngby, Denmark covered case histories, theories of tin whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies. Papers cover the current state of knowledge regarding tin whisker growth, risk, and mitigation strategies, enabling the development of improved and effective qualification and mitigation procedures. Presentations by: National Institute Of Advanced Industrial Science And Technology Nippon Avionics Co. National Institute Of Standards & Technology Ormecon/Enthone NASA Senju Metals Yokohama National University and more... More Info...
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SMTA International Conference on Soldering & Reliability Proceedings on CD, 2009 -
SMTA
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 20-22, 2009, at the Crowne Plaza Hotel, Toronto, Ontario, Canada. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. Process optimizations for manufacturing and repair, as well as mixed alloy soldering have become important areas of study. New solder alloys, as well as a return to vapor phase soldering, lead-free HASL, and cleaning provide topics for renewed understanding. Finally, the proposed changes to the restrictions on hazardous substances, and the upcoming REACH initiative will be covered. More Info...
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Wafer Level 3-D ICs Process Technology -
Chuan Seng Tan, Ronald J. Gutmann, and Rafael L. Reif
Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration.
Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.
Written for: Professionals and engineers in the field of 3-D ICs More Info...
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Bob Willis Conformal Coating Photographic Poster Guide -
Bob Willis
The 15 page colour poster guide is available at ASKbobwillis.com and was originally produced to accompany our workshops run jointly with ITRI in St Albans, England. The photographic guide is ideal as a reference source for operators, inspection and training departments in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed as A4 for bench top reference or as A3 colour posters for reference in manufacture. Alternatively they can be viewed on a PC with each page featuring three images illustrating points to examine or steps in the inspection process. Currently the guide features 10 individual pages for on site printing and display. More Info...
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Bob Willis Counterfeit Component Photographic Guide Poster Set -
Bob Willis
The 28 page colour guide is available at ASKbobwillis.com and was originally produced to accompany the "Practical Failure Analysis Workshops" run jointly with ITRI in St Albans. The photographic guide is ideal as a reference source to reduce the impact of counterfeit components on your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for reference at goods receipt inspection and can be updated with new samples provided for inclusion or new test methods and procedures.
An onsite Counterfeit Components Workshop is also available to train staff on testing and identification of counterfeit parts, which is becoming a significant threat to the reliability and profitability of the electronics industry.
The colour guide covers many of the following topics Optical Inspection Solvent Testing Lead Inspection Component Packaging & Labelling Marking Durability X-Ray Analysis XRF Inspection Encapsulation More Info...
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Profiling Guide for Profitability -
Mike Limberg and Brian O'Leary
Learn Smart Profiling for Tough Times. This guide is meant as a brief, concise guide to profiling, while knowing that for many, the reflow oven continues to be a "black box." The status quo is no longer an option, especially during this economic downturn. Resources have been spread thin and those of us with knowledge are far and few between. The reflow process continues to bleed operations of precious time and money. Decoding the reflow process is not only important, it is essential for survival these days. Discover how to: Characterize your Facility Characterize your Reflow Oven and Thermocouples Measure, Define & Improve your Reflow Process Find out what is new in Automation, Thermocouple Attachment Methodology and Materials More Info...
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SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2009 -
SMTA
The Annual Pan Pacific Microelectronics Symposium & Exhibit that was held February 10-12, 2009, at the Hapuna Beach Prince Hotel on the Big Island of Hawaii, promoted international technical interchange and provided a premier forum for extensive networking among industry professionals and business leaders throughout the world.
Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly. More Info...
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Solder Joint Reliability Prediction for Multiple Environments -
Andrew E. Perkins and Suresh K. Sitaraman
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability.
A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type. Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder. More Info...
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High Performance Electronics Assembly Cleaning Symposium Proceedings on CD 2008 -
SMTA/IPC
The symposium, held on October 28-29, 2008 at the Crowne Plaza Chicago O'Hare in Rosemont, IL, focused on all classes of high reliability and high performance electronics assembly and included case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries. More Info...
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SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2008 -
SMTA
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 5th annual IWLPC addressed cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The conference took place October 13-16, 2008 at the Wyndham Hotel in San Jose, CA. More Info...
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SMTA Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts Proceedings 2008 -
SMTA
SMTA and CALCE @ University of Maryland put on the 2nd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts on September 9-10, 2008 at the University of Maryland, College Park, MD. The first symposium was an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals.
Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.
Topics include: Electronic parts supply chain Sources of counterfeit parts Proven methodologies for reducing chances of being victims of counterfeit parts Supply chain management tools to mitigate counterfeit part risks Inspections tools and techniques for detecting counterfeit parts Authentication techniques for securing electronic part supply chain Trade and business issues adopted by industry Law enforcement and international cooperation More Info...
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Semiconductor Manufacturing Handbook -
Hwaiyu Geng
This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. More Info...
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Design for Six Sigma 2nd Ed. -
Kai Yang and Basem S. El-Haik
The Latest Tools and Guidance Needed to Implement Design for Six Sigma in New Product and Service Development!
The Second Edition of this indispensable design tool retains the core of the previous edition, while adding new information on innovation, lean product development, incomplete DOE, mixture experiments, and alternative DFSS roadmaps—plus new thread-through case studies.
From quality concepts and DFSS fundamentals…to DFSS deployment and project algorithm…to design validation, the updated edition of Design for Six Sigma gives you a solid understanding of the entire process for applying DFSS in the creation of successful new products and services. More Info...
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SMTA International Conference Proceedings on CD, 2008 -
SMTA
More Info...
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Bob Willis Flip Chip Assembly & Defect Photo CD-ROM -
Bob Willis
The flip chip CD ROM provides the process or quality engineer with a source of photographs of assembly process, flip chip components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Over 230 photographs are provided as a .jpg or .Tiff file format. Includes some x-ray and underfill process examples and defects. More Info...
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Bob Willis LGA/QFN Design, Assembly, Rework & Defect Guide -
Bob Willis
If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional, surface mount & LGA/QFN assembly process stages this CD-ROM is for you.
The CD features three presentations: LGA/QFN Design and Assembly Process Conventional through hole assembly Surface mount and mixed technology assembly stages Changes for lead-free production The LGA/QFN Assembly is a standard PowerPoint presentation including video clips and many photographs illustrating the design, assembly, inspection and rework process for LGA/QFN packages.
In the second two presentations each stage of the SMT and Conventional assembly process is illustrated with video animations and commentary, each slide describes the basic process stages. The PowerPoint format makes it ideal to edit each presentation, leave out slides or add additional photographs, text depending on your requirement and for busy engineers 90% of the work has been done for you. We have also included 11 "Lead-free Casebooks" featured in Circuits Assembly.
To use these any presentation place the CD in your ROM drive and select one of the PowerPoint files, all the video clips should run directly in PowerPoint from the CD. If not you may have to re-link the files on you PC. Other lead-free material and resources are included on the CD-ROM. More Info...
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SMTA 3D/SiP Advanced Packaging Symposium Proceedings on CD, 2008 -
SMTA
More Info...
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SMTA International Conference on Soldering & Reliability Proceedings on CD, 2008 -
SMTA
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-16, 2008, at the Hilton Toronto Airport, Toronto, Ontario, Canada The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future.
The European Union’s directive on lead-free electronics which became a reality on July 1, 2006 complicates that with the variety of alloy choices, component compatibility and mixed-solder concerns. More Info...
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Green Electronics Design and Manufacturing -
Sammy G. Shina
This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations.
Edited by the founder of the New England Lead-Free Consortium and filled with over 130 detailed illustrations, Green Electronics Design and Manufacturing features:
Guidance for lead-free conversions while maintaining quality and reliability for printed circuit board production and rework of surface mount technology and palted through holes Restriction of hazardous substances (RoHS) compliance for hex-chrome and future halogen free issues Detailed coverage of global environmental regulations and their impact on manufacturing and design processes Techniques for managing corporate strategy and project design teams for green products Proven methods for testing and analyzing green products Proven methods for dealing with the adverse results of green production such as tin whiskers and finish interactions More Info...
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Introduction to System-on-Package (SOP) -
Rao Tummala and Madhavan Swaminathan
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness. More Info...
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MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applica -
A.R. Jha, Ph.D.
The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applications.
This book presents the latest performance parameters and experimental data of state-of-the-art sensors and devices. It describes packaging details, materials and their properties, and fabrication requirements vital for design, development, and testing. Some of the cutting-edge materials covered include quantum dots, nanoparticles, photonic crystals, and carbon nanotubes (CNTs). More Info...
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Mechanical Design of Electronic Systems -
James Dally, Pradeep Lall, and Jeffrey Suhling
This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design rather than the business strategy of a product line. More Info...
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Find It. Book It. Grow It. -
Susan Mucha
In this new book, Susan E. Mucha explores in great detail the entire account acquisition process of companies in the electronics manufacturing service (EMS) industry. EMS companies face the challenges of a 12- to 18-month sales cycle, low margins and geographically scattered customer bases. Growing the business requires a differentiation strategy and a focused process for maintaining mindshare within a diverse target market. Susan Mucha maps the process of building a differentiated brand while creating a repeatable, consistent sales process, and addresses strategies for account retention and growth.
With over 20 years’ experience in the industry, Mucha has built a distinguished career consulting to EMS companies. This new book is an excellent resource for chief executive officers, vice-presidents of sales and/or marketing, sales directors, sales managers, program managers, account managers, business development managers, and sales engineers in EMS companies and in related manufacturing services industries. More Info...
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RFID Handbook: Applications, Technology, Security, and Privacy -
Syed Ahson and Mohammad Ilyas
Radio Frequency Identification (RFID) tagging is now used by the department of defense and many of the world’s largest retailers including Wal-Mart. As RFID continues to infiltrate industries worldwide, organizations must harness a clear understanding of this technology in order to maximize its potential and protect against the potential risks it poses.
The RFID Handbook provides an overview of RFID technology, its associated security and privacy risks, and recommended practices that will enable organizations to realize productivity improvements while also protecting sensitive information and the privacy of individuals.
Expert contributors present a host of applications including RFID enabled automated receiving, triage with RFID for massive incidents, RFID and NFC in relation to mobile phones, and RFID technologies for communication robots and a privacy preserving video surveillance system. The unprecedented coverage also includes detailed descriptions of adaptive splitting protocols as well as tree-based and probabilistic anti-collision protocols.
Drawing on its distinguished editors and world-renowned contributors, this one-of-a-kind handbook serves as the ultimate reference on RFID, from basic research concepts to future applications. More Info...
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SMTA Medical Electronics Symposium Proceedings on CD, 2008 -
SMTA
The medical electronics industry is a dynamic and evolving industry that consists of many technology and market segments. The evolvement of technology and market segments are due to the close working relationships between the private sector, universities, local, state, federal and international governments. This allows the medical electronics technology to be a vibrant and interactive technical community. This symposium will include the market’s current and future outlooks, regulatory requirements, legal perspectives, components, reliability, trends, initiative projects and advanced applications. More Info...
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Embedded Core Design with FPGAs -
Zainalabedin Navabi, Ph.D.
A landmark guide in digital system design, Embedded Core Design with FPGAs equips today's computer engineers with everything they need to design embedded cores and apply those cores in a state-of-the-art embedded system. This practical resource brings together logic design, computer architecture, Verilog, FPGAs, Hardware/Software design, and SoCs, explaining how engineers can draw on their computer engineering background to achieve cutting-edge embedded designs.
Renowned design expert and educator Zainalabedin Navabi first covers the basics of logic design, RT Level Verilog, computer architectures, and the architecture of modern field programmable devices. He then explores the design of utility cores that are used for high-level core-based designs, with specific focus on existing Altera cores. Finally, he describes higher-end design methodologies, including design of hardware/software systems, CPU configurations, embedded systems, and the utilization of various Altera Nios II processors. More Info...
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Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing -
E. Bradley, C. Handwerker, J. Bath, R. Parker, and R. Gedney, (Editors)
Reflecting the results of a two-year study undertaken by a cross-section of some of the largest North American electronic equipment manufacturers, this book provides full coverage of the issues surrounding the implementation of lead-free solder into electric board assembly. Additionally, fully documented book chapters with references to existing published work in the area make this an invaluable reference for the countless engineers and companies faced with making the switch to lead-free electronics. More Info...
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Bob Willis Pin in Hole Intrusive Reflow CD-ROM -
Bob Willis
This CD ROM is fully interactive and covers the use of through hole components, design rules and process requirement when implementing Pin in Hole/Intrusive reflow assembly. Examples of satisfactory solder joint standards are provided with a complete guide to possible process defects with intrusive reflow. The defect section may be viewed with small examples to make searching easy and then each sample may be viewed at both half and full screen. More Info...
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Right The First Time- A Practical Handbook on High Speed PCB and System Design volume 2 -
Lee W. Ritchey
More Info...
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Integrated Circuit Packaging, Assembly and Interconnections -
William J. Greig
More Info...
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SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2007 -
SMTA
More Info...
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SMTA International Conference Proceedings on CD, 2007 -
SMTA
More Info...
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Nano/Microscale Heat Transfer -
Zhuomin Zhang
More Info...
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Business Innovation in the 21st Century -
Praveen Gupta
More Info...
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Virtually Stat Free Six Sigma: Focusing on Intent for Quick Results -
Praveen Gupta
More Info...
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Hermeticity of Electronic Packages -
Hal Greenhouse
More Info...
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Lead-Free Electronics -
Michael Pecht and Sanka Ganesan
More Info...
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Guide to Lead-Free Solders: Physical Metallurgy and Reliability -
John W. Evans (Author), Dong-il Kwon (Contributor), and Werner Engelmaier (Editor)
More Info...
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Practical Guide to X-Ray Inspection Criteria -
David Bernard and Bob Willis
The Dage x-ray inspection guidebook provides x-ray images and information that can be used as a teaching aid and reference guide for anyone undertaking x-ray inspection of printed circuit board assemblies. The contents of the guidebook spans information on the theory and practice of x-ray inspection, voiding within BGA devices, inspection of area array packages, fine pitch devices, passive components, small active components and through-hole joints, as well as x-ray inspection criteria and commonly detectable defects. More Info...
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Lead-Free Soldering -
Jasbir Bath
The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia.
Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with lead-free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components.
This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena. More Info...
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The SMT Step by Step Collection 2006 -
PennWell Books
More Info...
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The Handbook of Manufacturing Engineering, Second Edition -
Richard Crowson
More Info...
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SMTA Medical Electronics Symposium Proceedings on CD, 2006 -
SMTA
More Info...
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SMTA Six Sigma/Green Belt Certification Study Guide -
Ronald Lasky, Phil Zarrow, and W. James Hall
More Info...
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SMTA Processes Certification Study Guide -
Ronald Lasky, Phil Zarrow, and W. James Hall
More Info...
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Your Transition to Pb-Free On-line Course and Book -
Ronald Lasky, Katherine Hickey, and Amish Parashar
Our industry is making one of its most challenging and evolutionary steps in going from SnPb to lead-free products. The issues are many, and they must be well understood to avoid costly mistakes or misspoken statements. In this book and corresponding "E-Learn" on-line course you will learn the most critical pieces about the transition to lead-free. It is the most extensive and broadest coverage of this topic available anywhere.
The transition to lead-free first starts with understanding the directives and global trends. Then learn about the possible alloy replacements, their pros and cons along with the environmental considerations and reliability; each backed up with testing and data. The PWB finishes are dealt with in detail, covering a wide range of optional finishes. That is followed by what the effects are of intermixing different board finishes, PWB plating types and solder alloys: addressing both forward and backward compatibility. Next, another important topic, tin whiskers are explained in a detail not found anywhere else. Now you are only half way through! More Info...
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Bob Willis Conventional/SMT & Lead-Free Assembly Process Animations (CD) -
Bob Willis
If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional and surface mount assembly process stages, this CD-ROM is for you. The CD features three presentations: Conventional through hole assembly Surface mount and mixed technology assembly stages Changes for lead-free production More Info...
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Bob Willis Printed Circuit Board Design & Lead-Free Defect Guide 2 (CD) -
Bob Willis
Printed board design and layout is the key to zero defect manufacturing, which is particularly true for lead-free. Design and development engineers must convert their build of materials to make all components lead-free and processes compatible.
This CD-ROM provides a basic introduction to conventional, surface mount, ball grid array, and pin in hole / intrusive reflow assembly, including changes for lead-free with the following... More Info...
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Bob Willis BGA Inspection & Lead-Free Defect Guide (CD) -
Bob Willis
This interactive CD-ROM produced jointly by Metcal and Bob Willis covers optical and X-ray inspection of solder joints. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provides a step-by-step guide to the procedure of inspection for optical and X-ray showing you how to do it. More Info...
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Lead-Free Solder Interconnect Reliability -
Shangguan (Editor), Dongkai
This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.
Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. More Info...
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MEMS/MOEMS Packaging: Concepts, Designs, Materials, and Processes -
Dr. Ken Gilleo
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS and MOEMS, and ultimately nano-electrical devices, is the development of appropriate packaging solutions for the protection, assembly, and long-term reliable operation.
This book rigorously examines the properties of the materials used in MEMS and MOEMS assembly and then evaluates them in terms of their routing, electrical performance, thermal management, and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. More Info...
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SMTA/TMAG Testability Guidelines TP-101D (Single-user Electronic PDF) -
SMTA/TMAG Task Forces
The SMTA Testability Guidelines TP-101D were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters.
A general format applies to each task force, and it was intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product. Each chapter begins with an introduction intended to put into perspective the enumerated guidelines that follow.
Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically. More Info...
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IPC-A-610E: Acceptability of Electronic Assemblies (on CD-ROM) -
IPC
A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include lead-free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. More Info...
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