Proceedings Sale!
We're cutting prices by $10 through the end of the year on all SMTA Conference Proceedings! Posted prices reflect discount.

FEATURED BOOKS and CD-Roms

		Title : High Performance Electronics Assembly Cleaning Symposium Proceedings on CD 2008 Author : SMTA/IPC Description : The symposium, held on October 28-29, 2008 at the Crowne Plaza Chicago O'Hare in Rosemont, IL, focused on all classes of high reliability and high performance electronics assembly and included case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries. More Info on This Book    Add to Cart
		Title : SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2008 Author : SMTA Description : Sponsored jointly by the SMTA and Chip Scale Review magazine, the 5th annual IWLPC addressed cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The conference took place October 13-16, 2008 at the Wyndham Hotel in San Jose, CA. More Info on This Book    Add to Cart
		Title : Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts Proceedings 2008 Author : SMTA Description : SMTA and CALCE @ University of Maryland put on the 2nd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts on September 9-10, 2008 at the University of Maryland, College Park, MD. The first symposium was an overwhelming success with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry. Topics include: Electronic parts supply chain Sources of counterfeit parts Proven methodologies for reducing chances of being victims of counterfeit parts Supply chain management tools to mitigate counterfeit part risks Inspections tools and techniques for detecting counterfeit parts Authentication techniques for securing electronic part supply chain Trade and business issues adopted by industry Law enforcement and international cooperation More Info on This Book    Add to Cart
		Title : Semiconductor Manufacturing Handbook Author : Hwaiyu Geng Description : This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. More Info on This Book    Add to Cart
		Title : Design for Six Sigma 2nd Ed. Author : Kai Yang and Basem S. El-Haik Description : The Latest Tools and Guidance Needed to Implement Design for Six Sigma in New Product and Service Development! The Second Edition of this indispensable design tool retains the core of the previous edition, while adding new information on innovation, lean product development, incomplete DOE, mixture experiments, and alternative DFSS roadmaps—plus new thread-through case studies. From quality concepts and DFSS fundamentals…to DFSS deployment and project algorithm…to design validation, the updated edition of Design for Six Sigma gives you a solid understanding of the entire process for applying DFSS in the creation of successful new products and services. More Info on This Book    Add to Cart
		Title : SMTA International Conference Proceedings on CD, 2008 Author : SMTA Description : Come. Focus. This is your reference source for electronics assembly, lead-free, SMT, RFID, process control, flip chip, chip scale, BGA, RoHS compliance, automotive, and more... you'll find the electronic interconnection solutions you need, because this proceedings is dedicated to surface mount, advanced packaging, and related technologies and business operations. The CD contains the papers from the AIMS Harsh Environment Electronics Workshop as well. More Info on This Book    Add to Cart
		Title : Bob Willis Flip Chip Assembly & Defect Photo CD-ROM Author : Bob Willis Description : The flip chip CD ROM provides the process or quality engineer with a source of photographs of assembly process, flip chip components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Over 230 photographs are provided as a .jpg or .Tiff file format. Includes some x-ray and underfill process examples and defects. More Info on This Book    Add to Cart
		Title : Bob Willis LGA/QFN Design, Assembly, Rework & Defect Guide Author : Bob Willis Description : If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional, surface mount & LGA/QFN assembly process stages this CD-ROM is for you. The CD features three presentations: LGA/QFN Design and Assembly Process Conventional through hole assembly Surface mount and mixed technology assembly stages Changes for lead-free production More Info on This Book    Add to Cart
		Title : SMTA 3D/SiP Advanced Packaging Symposium Proceedings on CD, 2008 Author : SMTA Description : The semiconductor industry only recently recognized the power of the third dimension in package and system assembly, yet the competitive environment already encompasses almost every aspect of electronic product manufacturing! SMTA's 3D/SiP/Advanced Packaging Symposium covered a wide range of application opportunities assessing the market, technology and business implications of three dimensional assembly technologies at both the package and product levels. Topical coverage ran the gamut from chip stacks and origami semiconductor packaging through package on package (PoP) board level assembly. Speakers reviewed technical, business and intellectual property aspects of 3D packaging and assembly for products ranging from consumer and commercial to military and medical devices leading to a better understanding of potential matches between various 3D technologies and specific product applications. The program included perspectives from both suppliers and users of 3D technologies along with integrators that make the entire system viable. More Info on This Book    Add to Cart
		Title : SMTA International Conference on Soldering & Reliability Proceedings on CD, 2008 Author : SMTA Description : This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-16, 2008, at the Hilton Toronto Airport, Toronto, Ontario, Canada The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. The European Union’s directive on lead-free electronics which became a reality on July 1, 2006 complicates that with the variety of alloy choices, component compatibility and mixed-solder concerns. More Info on This Book    Add to Cart
		Title : Green Electronics Design and Manufacturing Author : Sammy G. Shina Description : This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations. More Info on This Book    Add to Cart
		Title : Introduction to System-on-Package (SOP) Author : Tummala, Rao and Swaminathan, Madhavan Description : System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges. More Info on This Book    Add to Cart
		Title : MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applica Author : A.R. Jha, Ph.D. Description : The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applications. This book presents the latest performance parameters and experimental data of state-of-the-art sensors and devices. It describes packaging details, materials and their properties, and fabrication requirements vital for design, development, and testing. Some of the cutting-edge materials covered include quantum dots, nanoparticles, photonic crystals, and carbon nanotubes (CNTs). More Info on This Book    Add to Cart
		Title : Mechanical Design of Electronic Systems Author : Dally, James; Lall, Pradeep; and Suhling, Jeffrey Description : This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design rather than the business strategy of a product line. More Info on This Book    Add to Cart
		Title : Find It. Book It. Grow It. Author : Susan Mucha Description : In this new book, Susan E. Mucha explores in great detail the entire account acquisition process of companies in the electronics manufacturing service (EMS) industry. EMS companies face the challenges of a 12- to 18-month sales cycle, low margins and geographically scattered customer bases. Growing the business requires a differentiation strategy and a focused process for maintaining mindshare within a diverse target market. Susan Mucha maps the process of building a differentiated brand while creating a repeatable, consistent sales process, and addresses strategies for account retention and growth. More Info on This Book    Add to Cart
		Title : RFID Handbook: Applications, Technology, Security, and Privacy Author : Ahson, Syed and Ilyas, Mohammad Description : Radio Frequency Identification (RFID) tagging is now used by the department of defense and many of the world’s largest retailers including Wal-Mart. As RFID continues to infiltrate industries worldwide, organizations must harness a clear understanding of this technology in order to maximize its potential and protect against the potential risks it poses. The RFID Handbook provides an overview of RFID technology, its associated security and privacy risks, and recommended practices that will enable organizations to realize productivity improvements while also protecting sensitive information and the privacy of individuals. More Info on This Book    Add to Cart
		Title : SMTA Medical Electronics Symposium Proceedings on CD, 2008 Author : SMTA Description : The medical electronics industry is a dynamic and evolving industry that consists of many technology and market segments. The evolvement of technology and market segments are due to the close working relationships between the private sector, universities, local, state, federal and international governments. This allows the medical electronics technology to be a vibrant and interactive technical community. This symposium will include the market’s current and future outlooks, regulatory requirements, legal perspectives, components, reliability, trends, initiative projects and advanced applications. More Info on This Book    Add to Cart
		Title : SMTA Pan Pacific Microelectronics Symposium Proceedings on CD, 2008 Author : SMTA Description : The Annual Pan Pacific Microelectronics Symposium & Exhibit that was held January 22-24, 2008, at the Sheraton Kauai Resort, Kauai, promoted international technical interchange and provided a premier forum for extensive networking among industry professionals and business leaders throughout the world. Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly. More than 50 papers from the technical program are featured here. More Info on This Book    Add to Cart
		Title : Embedded Core Design with FPGAs Author : Zainalabedin Navabi, Ph.D. Description : A landmark guide in digital system design, Embedded Core Design with FPGAs equips today's computer engineers with everything they need to design embedded cores and apply those cores in a state-of-the-art embedded system. This practical resource brings together logic design, computer architecture, Verilog, FPGAs, Hardware/Software design, and SoCs, explaining how engineers can draw on their computer engineering background to achieve cutting-edge embedded designs. Renowned design expert and educator Zainalabedin Navabi first covers the basics of logic design, RT Level Verilog, computer architectures, and the architecture of modern field programmable devices. He then explores the design of utility cores that are used for high-level core-based designs, with specific focus on existing Altera cores. Finally, he describes higher-end design methodologies, including design of hardware/software systems, CPU configurations, embedded systems, and the utilization of various Altera Nios II processors. More Info on This Book    Add to Cart
		Title : Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing Author : Bradley, E., Handwerker, C., Bath, J., Parker, R., and Gedney, R. (Editors) Description : Reflecting the results of a two-year study undertaken by a cross-section of some of the largest North American electronic equipment manufacturers, this book provides full coverage of the issues surrounding the implementation of lead-free solder into electric board assembly. Additionally, fully documented book chapters with references to existing published work in the area make this an invaluable reference for the countless engineers and companies faced with making the switch to lead-free electronics. More Info on This Book    Add to Cart
		Title : Right The First Time- A Practical Handbook on High Speed PCB and System Design volume 2 Author : Lee W. Ritchey Description : This is the second volume in a two-part series. While Volume 1 of "Right the First Time, A Practical Handbook on High Speed PCB and System Design," addressed the fundamentals, this book provides a detailed explanation of the steps involved in designing and manufacturing a printed circuit board that works right the first time. This book has been designed to provide engineering professionals, as well as business decision makers, a thorough treatment on the process of fabricating complex PCBs including a detailed description of the PCB fabrication process; PCB materials selection; EMI and EMC; Gigabit and higher signaling issues; the PCB design process; power delivery details; testing, simulation and simulators, and IC package design. As with Volume 1, this book also contains an extensive glossary of terms, their definitions and their use relative to high-speed design. More Info on This Book    Add to Cart
		Title : Integrated Circuit Packaging, Assembly and Interconnections Author : William J. Greig Description : Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, a review or an update. To this end, it provides an overview of materials and the processes, as well as trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. More Info on This Book    Add to Cart
		Title : SMTA International Wafer-Level Packaging Conference (IWLPC) Proceedings on CD, 2007 Author : SMTA Description : Co-sponsored by the SMTA and Chip Scale Review Magazine, the Fourth International Wafer-Level Packaging Conference (IWLPC), held September 17-19 at the Wyndham Hotel - San Jose (CA), covered topics in semiconductor packaging, chip scale packaging, 3D, system-in-package, system-on-chip, system-on-package, and wafer-level packaging. More Info on This Book    Add to Cart
		Title : SMTA International Conference Proceedings on CD, 2007 Author : SMTA Description : Come. Focus. This is your reference source for electronics assembly, lead-free, SMT, RFID, process control, flip chip, chip scale, BGA, RoHS compliance, automotive, and more... you'll find the electronic interconnection solutions you need, because this proceedings is dedicated to surface mount, advanced packaging, and related technologies and business operations. Keep pace with rapidly changing technology, learn how to increase productivity and reduce costs, explore new technologies and alternatives, identify innovative solutions and maintain your competitive edge. More Info on This Book    Add to Cart
		Title : Business Innovation in the 21st Century Author : Praveen Gupta Description : The Business Innovation book, with Foreword by Dipak Jain, Dean, Kellogg School of Management, provides a framework for process of innovation in corporations for introducing new products, services, or solutions faster.** Features -- Powerful new framework called Brinnovation™; Types of innovation: Fundament, Platform, Derivative, and Variation; Management of Innovation; Measures of innovation.** Table of Contents -- Part I. Evolving Innovation -- History, Tools, creativity, innovation on demand; Part II. Understanding Innovation -- Brain processes, Framework, Deployment, Measures; Part III. Institutionalizing Innovation -- Service, Protecting, Commercializing, and Managing Innovation; Wisdom of Innovation by Bob Galvin, Former Chairman/CEO of Motorola.** To receive bulk discount, or purchase hardcover version, please visit www.accelper.com. More Info on This Book    Add to Cart
		Title : Virtually Stat Free Six Sigma: Focusing on Intent for Quick Results Author : Praveen Gupta Description : Stat Free Six Sigma has been written to ease implantation of Six Sigma by minimizing statistics, and to achieve great results through innovative application. Unique features of the book include: No cumbersome statistics, hypothesis testing, and statistics tables; Stat Free DMAIC Tool Matrix; and Key Executive Tools. To order multiple copies, or receive bulk discount, please visit www.accelper.com. More Info on This Book    Add to Cart
		Title : SMTA Successful Lead-Free/RoHS Strategies Conference Proceedings on CD, 2007 Author : SMTA Description : This event brought attendees timely and relevant information and best practices for use in the reliable and effective transition to lead-free and RoHS assembly. The conference was structured to bring the latest research from industry experts to enable both consistent and reliable processes. The Do it Right – Do it Now sought to offer attendees the tools to transition to lead-free with the high quality they are accustomed to in leaded systems while maintaining regulatory due diligence. More Info on This Book    Add to Cart
		Title : Lead-Free Soldering Author : Jasbir Bath Description : This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena. More Info on This Book    Add to Cart
		Title : SMTA TechScan Compendium,The State-of-the-Art in Ball Grid Array and Chip Scale Package Technology Author : SMTA / Paul Vianco (Editor) Description : This compendium has been developed with the goal of providing the reader with a concise, easy-to-read resource describing the materials, processing, and reliability aspects of ball-grid array (BGA) and chip-scale packaging (CSP) technologies. The contributions were compiled from the technical papers proceedings of the Surface Mount International (SMI) and Surface Mount Technology Association International (SMTAI) conferences from 1993 to 2005. More Info on This Book    Add to Cart
		Title : SMTA Six Sigma/Green Belt Certification Study Guide Author : Lasky, Ronald; Zarrow, Phil; and Hall, W. James Description : Six Sigma/Green Belt Certification Study Guide More Info on This Book    Add to Cart
		Title : SMTA Processes Certification Study Guide Author : Lasky, Ronald; Zarrow, Phil; and Hall, W. James Description : SMT Procceses Certification Study Guide More Info on This Book    Add to Cart
		Title : SMTA/TMAG Testability Guidelines TP-101D (Single-user Electronic PDF) Author : SMTA/TMAG Task Forces Description : The SMTA Testability Guidelines TP-101D were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters. A general format applies to each task force, and it was intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product. Each chapter begins with an introduction intended to put into perspective the enumerated guidelines that follow. Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically. More Info on This Book    Add to Cart