SMTA International Conference on Soldering & Reliability Proceedings on CD, 2013
Copyright Year: 2013
Number of Pages: N/A
Non-Member Price: $60.00
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 14-17, 2013, at the Sheraton Toronto Airport Hotel, Toronto, ON, Canada. There are 30 presentations on topics ranging from Vapor Phase technology and Stencil Design to Bottom Termination Components and Package on Package assembly issues. Research was compiled from a variety of companies including 3M Canada, Alcatel-Lucent, Alpha, BAE Systems, BlackBerry, Celestica Inc., Creation Technologies Inc., Honeywell International Inc., IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several reknowned universities, and more.
Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component s are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. This EU directive officially required that it be made into national laws by January 2, 2013 and these two new categories of electronics must become compliant by July 22, 2014. Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges.